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    Method of packaging a sensor
    3.
    发明授权
    Method of packaging a sensor 有权
    包装传感器的方法

    公开(公告)号：US08732938B2

    公开(公告)日：2014-05-27

    申请号：US12783397

    申请日：2010-05-19

    申请人： Oleg Kolosov ,  Leonid Matsiev ,  John F. Varni ,  G. Cameron Dales ,  Olaf Ludtke ,  Dirk Wullner ,  Andreas Buhrdorf ,  Heiko Dobrinski

    发明人： Oleg Kolosov ,  Leonid Matsiev ,  John F. Varni ,  G. Cameron Dales ,  Olaf Ludtke ,  Dirk Wullner ,  Andreas Buhrdorf ,  Heiko Dobrinski

    IPC分类号： H04R31/00

    CPC分类号： G01F23/2966 ,  G01N2009/006 ,  G01N2291/0427 ,  Y10T29/42 ,  Y10T29/49005 ,  Y10T29/4908

    摘要： An improved method of packaging a sensor is provided. The method includes the step of affixing a tuning fork to a platform. The tuning fork includes tines comprising one or more surfaces, with each tine further comprising an electrode and a piezoelectric material. An application specific integrated circuit (ASIC) is affixed to the platform. Electrical communication between the ASIC and the electrode of each tine is established for providing stimulus to the tuning fork and for receiving a response signal from the tuning fork. A protective layer is applied to cover the platform and a portion of the tuning fork while maintaining a portion of a surface of each tine free from the protective layer such that the surface can displace the fluid in contact therewith.

    摘要翻译： 提供了一种改进的封装传感器的方法。 该方法包括将音叉固定在平台上的步骤。 音叉包括包括一个或多个表面的尖齿，每个齿还包括电极和压电材料。 专用集成电路（ASIC）贴在平台上。 建立ASIC和每个齿的电极之间的电气通信，用于向音叉提供刺激并且用于从音叉接收响应信号。 施加保护层以覆盖平台和音叉的一部分，同时保持每个齿的一部分表面没有保护层，使得表面可以使与其接触的流体移位。

    Application specific integrated circuitry for controlling analysis of a fluid
    6.
    发明申请
    Application specific integrated circuitry for controlling analysis of a fluid 有权
    用于控制流体分析的专用集成电路

    公开(公告)号：US20050149276A1

    公开(公告)日：2005-07-07

    申请号：US11059130

    申请日：2005-02-15

    申请人： Oleg Kolosov ,  Leonid Matsiev ,  Mikhail Spitkovsky ,  Vladimir Gammer

    发明人： Oleg Kolosov ,  Leonid Matsiev ,  Mikhail Spitkovsky ,  Vladimir Gammer

    IPC分类号： G01L7/00 ,  G01N29/036 ,  G01N29/34 ,  G01N29/36 ,  G01N31/00 ,  G06F19/00

    CPC分类号： G01N29/036 ,  G01N29/34 ,  G01N29/36 ,  G01N2291/02818 ,  G01N2291/0427

    摘要： A circuit chip is disclosed. The circuit chip includes analog-to-digital processing circuitry that is capable of interfacing with a sensor and host electronics. The analog-to-digital processing circuitry includes a frequency generator configured for providing stimulus to the sensor and signal detection circuitry that is configured for identifying amplitude data of a response signal. Further included is analog-to-digital conversion circuitry that is configured for converting the detected amplitude data into digital form. A memory that is capable of holding data characterizing the sensor is also provided. The digital form of the response signal is capable of being processed to generate fluid characteristics of fluids under-test.

    摘要翻译： 公开了一种电路芯片。 电路芯片包括能够与传感器和主机电子设备连接的模数转换处理电路。 模数处理电路包括频率发生器，其被配置用于向配置用于识别响应信号的幅度数据的传感器和信号检测电路提供刺激。 还包括被配置为将检测到的幅度数据转换为数字形式的模数转换电路。 还提供了能够保持表征传感器的数据的存储器。 响应信号的数字形式能够被处理以产生被测试流体的流体特性。

    Resonator sensor assembly
    7.
    发明授权
    Resonator sensor assembly 有权
    谐振器传感器组件

    公开(公告)号：US07721590B2

    公开(公告)日：2010-05-25

    申请号：US10550075

    申请日：2004-03-19

    申请人： Oleg Kolosov ,  Leonid Matsiev ,  John F. Varni ,  G. Cameron Dales ,  Olaf Ludtke ,  Dirk Wullner ,  Andreas Buhrdorf ,  Heiko Dobrinski

    发明人： Oleg Kolosov ,  Leonid Matsiev ,  John F. Varni ,  G. Cameron Dales ,  Olaf Ludtke ,  Dirk Wullner ,  Andreas Buhrdorf ,  Heiko Dobrinski

    IPC分类号： G01N11/16

    CPC分类号： G01F23/2966 ,  G01N2009/006 ,  G01N2291/0427 ,  Y10T29/42 ,  Y10T29/49005 ,  Y10T29/4908

    摘要： An improved method and assembly, wherein the method generally includes the steps of providing a coated or uncoated sensor element having an exposed sensing surface; attaching the sensor element to a platform so that the exposed sensing surface is spaced from the platform; and optionally applying a protective layer over the platform while maintaining the sensing surface as exposed. The assembly includes a resonator having a free portion with a sensing surface is incorporated onto a platform, components of the sensor are physically shielded from harsh operating conditions, the requisite space is maintained between the free portion of the resonator and the platform, and the sensing surface of the resonator remains exposed for sensing.

    摘要翻译： 一种改进的方法和组件，其中所述方法通常包括以下步骤：提供具有暴露的感测表面的涂覆或未涂覆的传感器元件; 将传感器元件附接到平台，使得暴露的感测表面与平台间隔开; 并且可选地在平台上施加保护层，同时保持感测表面暴露。 该组件包括具有感测表面的自由部分的谐振器被并入到平台上，传感器的部件在物理上不受恶劣的操作条件的影响，在谐振器的自由部分和平台之间保持必要的空间，并且感测 谐振器的表面保持暴露以进行感测。