公开(公告)号：US09077127B2

公开(公告)日：2015-07-07

申请号：US13935280

申请日：2013-07-03

Applicant: PANASONIC CORPORATION

Inventor： Hiroshi Iwano ,  Mitsuru Iida ,  Daisuke Sato ,  Hidetoshi Takeyama

IPC: H01R12/77 ,  H01R13/20 ,  H01R12/79

CPC classification number: H01R12/777 ,  H01R12/79 ,  H01R13/20

Abstract: A film substrate with flexibility includes connection through holes and combining through holes into which connection posts and combining posts of the header are inserted, respectively. Each connection pad is formed around a corresponding connection through hole and adapted to be electrically connected to a corresponding connection post. Each combining pad is formed around a corresponding combining through hole and adapted to be electrically connected to a corresponding combining post. The film substrate includes slots each of which is formed to extend along a plane of the film substrate with a first end side thereof connected to a corresponding through hole. The film substrate includes pad-free parts with neither connection pad nor combining pad each of which is present at a second end side of a corresponding slot on the surface of the film substrate.

Abstract translation: 具有柔性的薄膜基材分别包括连接通孔和组合通孔，连接柱和组合柱分别插入其中。 每个连接焊盘围绕相应的连接通孔形成并且适于电连接到相应的连接柱。 每个组合焊盘围绕相应的组合通孔形成并适于与相应的组合柱电连接。 薄膜基板包括槽，每个槽形成为沿着薄膜基板的平面延伸，其第一端侧连接到相应的通孔。 薄膜基片包括无衬垫部分，既没有连接垫，也没有组合垫，它们都存在于薄膜基底表面上的相应狭缝的第二端侧。

公开(公告)号：US09478879B2

公开(公告)日：2016-10-25

申请号：US13935292

申请日：2013-07-03

Applicant: PANASONIC CORPORATION

Inventor： Hiroshi Iwano ,  Mitsuru Iida ,  Daisuke Sato ,  Hidetoshi Takeyama

IPC: H01R12/79 ,  H05K1/11 ,  H01R12/61 ,  H05K3/00 ,  H05K3/36 ,  H05K3/40

CPC classification number: H01R12/613 ,  H01R12/79 ,  H05K1/11 ,  H05K1/114 ,  H05K1/117 ,  H05K3/0038 ,  H05K3/365 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2201/0394 ,  H05K2201/09409 ,  H05K2201/09427 ,  H05K2201/09445 ,  H05K2201/0949 ,  H05K2201/09509 ,  H05K2201/0969 ,  H05K2201/09781 ,  H05K2201/10189 ,  H05K2201/2009 ,  H05K2201/2072 ,  H05K2203/167

Abstract: A socket (female connector) used for a connector assembly includes a film substrate constituted by a flexible thin board made of insulation material. The film substrate is provided with connection through holes adapted to be inserted therein connection posts of a header (male connector). Connection pads are formed on a first surface of the film substrate around respective connection through holes. The connection pads include a first pad and a second pad. The film substrate is provided on the first surface with a first patterned conductor connected to the first pad and a third patterned conductor connected to the second pad. The third patterned conductor is connected to a second patterned conductor formed on a second surface of the film substrate by means of a blind via that is formed by boring the film substrate from the second surface so as to reach the third patterned conductor.

Abstract translation: 用于连接器组件的插座（母连接器）包括由绝缘材料制成的柔性薄板构成的薄膜基片。 薄膜基片设置有适于插入插头（公连接器）的连接柱中的连接通孔。 连接衬垫围绕各个连接通孔形成在薄膜基片的第一表面上。 连接焊盘包括第一焊盘和第二焊盘。 薄膜基板在第一表面上设置有连接到第一焊盘的第一图案化导体和连接到第二焊盘的第三图案化导体。 第三图案化导体通过盲孔通过第二图案导体连接到形成在膜基板的第二表面上的第二图案化导体，所述盲孔通过从第二表面镗孔而形成，以到达第三图案化导体。