公开(公告)号：US12184118B2

公开(公告)日：2024-12-31

申请号：US18257816

申请日：2021-12-20

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Hiroki Akashi ,  Masafumi Nakamura ,  Masatoshi Nakase ,  Yuta Nagatomi ,  Kinya Kato

IPC: B60R16/033 ,  H02J7/00 ,  H02J7/34 ,  H02J9/06

Abstract: A backup power supply control system includes: a first semiconductor switch that switches a main power supply line to an electrically conductive state or an electrically non-conductive state; and an auxiliary power supply switch that switches an auxiliary power supply line to the electrically conductive state or the electrically non-conductive state. A first driving unit controls, in a non-failure state, a second semiconductor switch, connected between a gate and source of a first semiconductor switch, OFF and thereby controls the first semiconductor switch ON. The first driving unit ensures, in the failure state, at least a gate-plateau voltage of the first semiconductor switch as a drive voltage for the second semiconductor switch. When a failure detection unit detects the failure state, the first driving unit controls the first semiconductor switch OFF by controlling the second semiconductor switch ON and a second driving unit controls the auxiliary power supply switch ON.

公开(公告)号：US12074516B2

公开(公告)日：2024-08-27

申请号：US17758404

申请日：2020-12-17

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Hiroki Akashi ,  Takuya Ishii ,  Yoshihito Kawakami ,  Kazuhiro Yahata ,  Takeshi Azuma ,  Yoshihisa Minami

IPC: H02M3/156 ,  H02M1/08 ,  H03F3/217

CPC classification number: H02M3/156 ,  H02M1/08 ,  H03F3/217

Abstract: A switch circuit is configured of a first semiconductor element and a second semiconductor element connected in series, and receives a DC voltage of 100 V or more. The drive circuit causes the first semiconductor element or the second semiconductor element to perform a switching operation. The isolated power supply circuit converts a predetermined power supply voltage into an isolated first power supply voltage, and outputs the first power supply voltage to the drive circuit. The isolation signal converter converts a first signal of 6 MHz or more into an isolated first drive signal, and outputs the first drive signal to the drive circuit. The single substrate mounts the isolated power supply circuit and the isolation signal converter. Both the first semiconductor element and the second semiconductor element are wide bandgap semiconductor elements.

公开(公告)号：US11749578B2

公开(公告)日：2023-09-05

申请号：US17431657

申请日：2020-01-14

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Koji Takahashi ,  Kazuhiro Yahata ,  Yoshihisa Minami ,  Hiroki Akashi ,  Shinya Miyazaki

IPC: H01L23/367 ,  H01L23/00 ,  H01L25/065

CPC classification number: H01L23/3672 ,  H01L24/05 ,  H01L24/09 ,  H01L24/45 ,  H01L24/48 ,  H01L25/0655 ,  H01L2224/04042 ,  H01L2224/05144 ,  H01L2224/09515 ,  H01L2224/45144 ,  H01L2224/48155 ,  H01L2924/014 ,  H01L2924/13091 ,  H01L2924/30107

Abstract: The semiconductor module includes: a heat dissipation board including first to third wiring patterns; a first metal plate on the first wiring pattern, a second metal plate on the second wiring pattern, a first semiconductor chip and a first intermediate board which are on the first metal plate, a second semiconductor chip and a second intermediate board which are on the second metal plate. A first metal film on the first intermediate board is electrically connected to the first semiconductor chip and the second metal plate, and a second metal film on the second intermediate board is electrically connected to the second semiconductor chip and the third wiring pattern.