公开(公告)号：US20240183064A1

公开(公告)日：2024-06-06

申请号：US18286023

申请日：2022-03-14

申请人： PEKING UNIVERSITY

发明人： Kaihui LIU ,  Can LIU ,  Enge WANG ,  Dapeng YU

IPC分类号： C30B25/18 ,  C30B25/16 ,  C30B25/22 ,  C30B29/02 ,  C30B29/40 ,  C30B29/68 ,  C30B33/06 ,  C30B33/10

CPC分类号： C30B25/18 ,  C30B25/165 ,  C30B25/22 ,  C30B29/02 ,  C30B29/403 ,  C30B29/68 ,  C30B33/06 ,  C30B33/10

摘要： A method for preparing a large-scale two-dimensional single crystal material stack which has an interlayer rotation angle. Single crystal substrates are stacked and rotated at a specific angle, a two-dimensional single crystal material is epitaxial on the surface thereof, and then an upper layer and a lower layer of the two-dimensional single crystal material are attached, and a layer of the single crystal substrates on the surface is removed so as to obtain a two-dimensional single crystal stack which has a specific rotation angle. A large-scale two-dimensional single crystal material stack which has an interlayer rotation angle prepared by the described method.

公开(公告)号：US20230080832A1

公开(公告)日：2023-03-16

申请号：US17798116

申请日：2020-09-04

申请人： PEKING UNIVERSITY

发明人： Kaihui LIU ,  Muhong WU ,  Dapeng YU ,  Enge WANG

IPC分类号： C30B29/68 ,  C30B29/02 ,  C30B33/02 ,  B32B15/01 ,  C22F1/08 ,  B21B3/00

摘要： Provided is a preparation method for an ultrahigh-conductivity multilayer single-crystal laminated copper material, where multiple layers of single-crystal copper foils are laminated together to form a laminate, and the laminate is pressurized and annealed as one piece by performing pressurizing and high-temperature annealing at the same time, or the laminate is pressed as one piece by means of direct hot rolling, thereby obtaining an ultrahigh-conductivity multi-layer single-crystal laminated copper material, whereby, according to the method, multiple layers of single-crystal copper foils are used as raw materials, an ultrahigh-conductivity multi-layer single-crystal laminated copper material is prepared by means of hot rolling or pressing and annealing, and the conductivity of the copper material is greater than or equal to 105% IACS.