公开(公告)号：US20140334606A1

公开(公告)日：2014-11-13

申请号：US14360706

申请日：2012-11-22

Applicant: PLANSEE SE

Inventor： Thomas Mueller ,  Klaus Ennemoser ,  Wolfgang Glatz ,  Andreas Menhard

IPC: H01J35/10 ,  H01J9/18

CPC classification number: H01J35/108 ,  B23K1/0008 ,  B23K1/19 ,  B23K35/005 ,  B23K35/32 ,  B23K35/325 ,  B23K2103/16 ,  C04B37/026 ,  C04B2235/6562 ,  C04B2235/6581 ,  C04B2235/661 ,  C04B2237/122 ,  C04B2237/126 ,  C04B2237/127 ,  C04B2237/36 ,  C04B2237/363 ,  C04B2237/365 ,  C04B2237/366 ,  C04B2237/368 ,  C04B2237/38 ,  C04B2237/385 ,  C04B2237/403 ,  C04B2237/52 ,  C04B2237/55 ,  C04B2237/62 ,  C04B2237/708 ,  C04B2237/72 ,  H01J1/36 ,  H01J1/44 ,  H01J35/10 ,  H01J2235/083

Abstract: A high-temperature-resistant composite body is formed by joining over an area of a first, nonmetallic section via a bonding solder layer to a second, metallic section composed of Mo, an Mo-based alloy, W or a W-based alloy. A first arrangement composed of the first section, a first Zr solder and an intermediate layer is firstly soldered together in a first soldering step. A second arrangement of the resulting partial composite body, a second solder adjoining the intermediate layer and the second section is subsequently soldered together in a second soldering step. The intermediate layer at least 90 atom % of at least one of the elements Ta, Nb, W. The second solder is formed by precisely one material selected from Ti, Ti-based solder combination, V-based solder combination, Zr or Zr-based solder combination and it melts at a lower temperature than the first Zr solder in the second arrangement.

Abstract translation: 通过接合焊料层将第一非金属部分的区域接合到由Mo，Mo基合金，W或W基合金构成的第二金属部分上，形成耐高温复合体。 在第一焊接步骤中首先将由第一部分，第一Zr焊料和中间层构成的第一布置在一起。 所得部分复合体的第二布置，邻接中间层和第二部分的第二焊料随后在第二焊接步骤中焊接在一起。 中间层至少为90原子％的元素Ta，Nb，W中的至少一种。第二焊料通过精确地选自Ti，Ti基焊料组合，V族焊料组合，Zr或Zr- 并且在第二配置中在比第一Zr焊料更低的温度下熔化。

公开(公告)号：US09543108B2

公开(公告)日：2017-01-10

申请号：US14371228

申请日：2013-01-07

Applicant: PLANSEE SE

Inventor： Peter Roedhammer ,  Juergen Schatte ,  Wolfgang Glatz ,  Thomas Mueller

IPC: H01J35/10 ,  H01J9/14

CPC classification number: H01J35/101 ,  H01J9/14 ,  H01J35/10 ,  H01J2235/083 ,  H01J2235/085 ,  H01J2235/1006

Abstract: A rotating x-ray anode has an annular focal track. The surface of the focal track has a directed ground structure. Over the circumference of the annular focal track and over the radial extent of the focal track, the alignment of the ground structure is inclined relative to a tangential reference direction in the respective surface portion in each case by an angle that lies in the range from 15°, including, up to and including 90°. A corresponding method for producing a rotating x-ray anode is described.

Abstract translation: 旋转的x射线阳极具有环形焦轨。 焦点轨迹的表面具有定向的地面结构。 在环形焦点轨道的圆周上并且在焦点轨迹的径向范围上，接地结构的对准相对于各个表面部分中的切向参考方向在每种情况下倾斜15°的范围内的角度 °，包括，最多和包括90°。 描述了用于生产旋转x射线阳极的相应方法。

公开(公告)号：US09269525B2

公开(公告)日：2016-02-23

申请号：US14360706

申请日：2012-11-22

Applicant: PLANSEE SE

Inventor： Thomas Mueller ,  Klaus Ennemoser ,  Wolfgang Glatz ,  Andreas Menhard

IPC: H01J35/10 ,  H01J1/44 ,  H01J1/36 ,  B23K35/32 ,  B23K35/00 ,  B23K1/19 ,  C04B37/02 ,  B23K1/00

CPC classification number: H01J35/108 ,  B23K1/0008 ,  B23K1/19 ,  B23K35/005 ,  B23K35/32 ,  B23K35/325 ,  B23K2103/16 ,  C04B37/026 ,  C04B2235/6562 ,  C04B2235/6581 ,  C04B2235/661 ,  C04B2237/122 ,  C04B2237/126 ,  C04B2237/127 ,  C04B2237/36 ,  C04B2237/363 ,  C04B2237/365 ,  C04B2237/366 ,  C04B2237/368 ,  C04B2237/38 ,  C04B2237/385 ,  C04B2237/403 ,  C04B2237/52 ,  C04B2237/55 ,  C04B2237/62 ,  C04B2237/708 ,  C04B2237/72 ,  H01J1/36 ,  H01J1/44 ,  H01J35/10 ,  H01J2235/083

Abstract: A high-temperature-resistant composite body is formed by joining over an area of a first, nonmetallic section via a bonding solder layer to a second, metallic section composed of Mo, an Mo-based alloy, W or a W-based alloy. A first arrangement composed of the first section, a first Zr solder and an intermediate layer is firstly soldered together in a first soldering step. A second arrangement of the resulting partial composite body, a second solder adjoining the intermediate layer and the second section is subsequently soldered together in a second soldering step. The intermediate layer at least 90 atom % of at least one of the elements Ta, Nb, W. The second solder is formed by precisely one material selected from Ti, Ti-based solder combination, V-based solder combination, Zr or Zr-based solder combination and it melts at a lower temperature than the first Zr solder in the second arrangement.

Abstract translation: 通过接合焊料层将第一非金属部分的区域接合到由Mo，Mo基合金，W或W基合金构成的第二金属部分上，形成耐高温复合体。 在第一焊接步骤中首先将由第一部分，第一Zr焊料和中间层构成的第一布置在一起。 所得部分复合体的第二布置，邻接中间层和第二部分的第二焊料随后在第二焊接步骤中焊接在一起。 中间层至少为90原子％的元素Ta，Nb，W中的至少一种。第二焊料通过精确地选自Ti，Ti基焊料组合，V族焊料组合，Zr或Zr- 并且在第二配置中在比第一Zr焊料更低的温度下熔化。