摘要:
An electronic device includes a multi-frequency antenna. The multi-frequency antenna includes a ground portion, a support body, a radiation portion, and a strap. The ground portion defines a gap, and two grooves communicating with the gap and located at opposite ends of the gap. The radiation portion resists against a sidewall bounding the gap, and is connected to the strap. The radiation portion is accommodated in the gap and substantially coplanar with the ground portion. The radiation portion defines a slot. The support body is located in the gap and on the radiation portion, to support the strap.
摘要:
A signal transmission apparatus includes two circuit layers. First and second ground sheets are arranged in the two circuit layers respectively. A third ground sheet is arranged between the two circuit layers. A differential pair includes a transmission line arranged between the first and third ground sheets and a transmission line arranged between the second and third ground sheets. The first to third ground sheets have same electric potential. Projections of the first and second ground sheets on the third ground sheet superpose a border of the third ground sheet. The third ground sheet is formed by extending the border along a signal transmission direction. A vertical distance between the first and second transmission lines is twice as each of a vertical distance from the first ground sheet to the first transmission line and a vertical distance from the second ground sheet to the second transmission line
摘要:
A performance evaluation system for a multiple-input multiple-output (MIMO) antenna system receives simulation parameters from an input device, and simulates a MIMO antenna system accordingly. A method, also provided, further evaluates performance of the simulated MIMO antenna system when a series of radio frequency (RF) signals are transmitted through the MIMO antenna system, and displays a performance analysis result of the MIMO antenna system on a display device for evaluation of the performance of the simulated MIMO antenna system.
摘要:
A signal transmission apparatus includes a first ground layer, a second ground layer and a band pass filter. The band pass filter includes a first transmission line positioned in a void defined in the first ground layer and a second transmission line positioned in a void defined in the second ground layer. Each of the first transmission line and the second transmission line includes a coil with a plurality of turns spirally extending in the same plane, a gasket extending from the coil and located in the center of the coil, and a signal terminal extending from extremity of the coil. According to employing the band pass filter, the signal transmission apparatus has filtering function, therefore, quality of signals transmitted through the signal transmission apparatus is improved.
摘要:
A computing device and a method determines port relationships of a differential transmission line of a circuit board according to an original scattering parameters file, which records scattering parameter values measured from ports of the differential transmission line under different signal frequencies. The computing device generates a new scattering parameters file matching a scattering parameters model predefined for the differential transmission line according to the determined port relationships. Design of the differential transmission line is analyzed to determine if the differential transmission line is qualified according to the new scattering parameters file and the scattering parameters model.
摘要:
An enclosure of an electronic device includes a ventilation plate. The ventilation plate is a grid including a number of crisscrossed connection bars and a number of through holes defined by the connection bars. A tab is formed at each of the connection bars bounding each of the through holes. The tabs are substantially angled from a plane of the grid to elongate a path electromagnetic signals must travel to pass through the ventilation plate. The enclosure with the shields can shield the electronic device from EMI.
摘要:
An enclosure of an electronic device includes a plate. The plate defines a number of through holes. A number of shields extend from the plate corresponding to the through holes. Each shield extends outwards from the outer surface of the plate, surrounding and partly covering a corresponding through hole. The enclosure with the shields can shield the electronic device from EMI.
摘要:
A printed circuit board includes a signal layer and a ground layer adjacent to the signal layer. The signal layer includes a pair of differential transmitting lines. The ground layer includes a common mode filter formed by hollow spiral patterns in the ground layer. The common mode filter includes two filter portions respectively arranged at opposite sides of a projection of the pair of differential transmitting lines onto the ground layer. Hollowed areas of the two filter portions are bridged by a void.
摘要:
An enclosure includes a plate. The plate defines a number of through holes. A first shield extends from an edge bounding each through hole. A second shield extends from the edge bounding each through hole, opposite to the first shields. Each through hole is partially covered by a corresponding first shield and a corresponding second shield. The enclosure with the shields can shield the electronic device from electromagnetic interference.
摘要:
A printed circuit board includes a number of signal layers, a number of ground layers, a first transmission line, a second transmission line, a first via, and a second via. The first transmission is located on one of the number of signal layers. The second transmission line is located on another of the number of signal layers. The first and second vias pass through the printed circuit board. The first via is electrically coupled to the first and second transmission lines, and is isolated from the number of ground layers. The second via is electrically coupled to one or more of the number of ground layers, and is isolated from the other of the number of ground layers to increase an inductance, thus compensating capacitive nature of an open stub and improving signal integrity.