摘要:
A performance evaluation system for a multiple-input multiple-output (MIMO) antenna system receives simulation parameters from an input device, and simulates a MIMO antenna system accordingly. A method, also provided, further evaluates performance of the simulated MIMO antenna system when a series of radio frequency (RF) signals are transmitted through the MIMO antenna system, and displays a performance analysis result of the MIMO antenna system on a display device for evaluation of the performance of the simulated MIMO antenna system.
摘要:
An enclosure of an electronic device includes a plate. The plate defines a number of through holes. A number of shields extend from the plate corresponding to the through holes. Each shield extends outwards from the outer surface of the plate, surrounding and partly covering a corresponding through hole. The enclosure with the shields can shield the electronic device from EMI.
摘要:
A printed circuit board includes a first signal layer, a second signal layer, and a dielectric layer sandwiched between the first signal layer and the second signal layer. The first signal layer includes two pads. The second signal layer includes two conducting pieces connected to two signal traces. The shape and material of the pads are the same as the shape and material of the conducting pieces. The projections of the pads on the second signal layer are overlapping with the conducting pieces.
摘要:
A high-frequency module includes an antenna, an impedance matching circuit, and a transmission wire. The transmission wire is connected between the antenna and the impedance matching circuit. The transmission wire includes a dielectric layer, a signal layer, and two ground layers. The signal layer and the ground layers are located on the dielectric layer. The ground layers are located at opposite sides of the signal layer respectively. A space is formed between a signal and each ground layer.
摘要:
An enclosure includes a plate. The plate defines a number of through holes. A first shield extends from an edge bounding each through hole. A second shield extends from the edge bounding each through hole, opposite to the first shields. Each through hole is partially covered by a corresponding first shield and a corresponding second shield. The enclosure with the shields can shield the electronic device from electromagnetic interference.
摘要:
A printed circuit board includes a number of signal layers, a number of ground layers, a first transmission line, a second transmission line, a first via, and a second via. The first transmission is located on one of the number of signal layers. The second transmission line is located on another of the number of signal layers. The first and second vias pass through the printed circuit board. The first via is electrically coupled to the first and second transmission lines, and is isolated from the number of ground layers. The second via is electrically coupled to one or more of the number of ground layers, and is isolated from the other of the number of ground layers to increase an inductance, thus compensating capacitive nature of an open stub and improving signal integrity.
摘要:
A compensation method compensates for a length offset between a first transmission line and a second transmission line of a differential signal transmission. The compensation method includes calculating a transmission speed of a first signal in the first transmission line, measuring lengths of the first and second transmission lines, calculating a transmission time of the first signal in the first transmission line, and calculating a relationship between permittivity values of the first and second transmission lines. The compensation method further changes the permittivity values of the first and second transmission lines according to the relationship.
摘要:
A method of testing a printed circuit board (PCB) acquires test points from a wiring diagram of the PCB. Frequency domain tested items for each test point and a standard value of each frequency domain tested item are preset. A distance between a preset fiducial point and each test point is computed to create a testing order of the test points according to the distances. The frequency domain tested items of each test point are computed according to the testing order. A pass or a failure of each test point is displayed according to a determination of if each of the computed frequency domain tested items within the corresponding standard value, and a test result of the PCB is output according to the passes or the failures.
摘要:
A signal transmission apparatus includes two circuit layers. First and second ground sheets each has a rectangular area are arranged in the two circuit layers respectively. A third ground sheet is arranged between the two circuit layers. A differential pair includes a transmission line arranged between the first and third ground sheets and a transmission line arranged between the second and third ground sheets. The first to third ground sheets have same electric potential. Projections of the two rectangular areas on a surface where the third ground sheet in only have one common border with the third ground sheet. The third ground sheet is formed by extending the common border along a signal transmission direction. The differential pair includes a number of section pairs each composed of two sections arranged in the two transmission lines symmetrically. Every two adjacent section pairs are equivalent to a capacitor and an inductor.
摘要:
A signal transmission apparatus includes two circuit layers. First and second ground sheets are arranged in the two circuit layers respectively. A third ground sheet is arranged between the two circuit layers. A differential pair includes a transmission line arranged between the first and third ground sheets and a transmission line arranged between the second and third ground sheets. The first to third ground sheets have same electric potential. Projections of the first and second ground sheets on the third ground sheet superpose a border of the third ground sheet. The third ground sheet is formed by extending the border along a signal transmission direction. A vertical distance between the first and second transmission lines is twice as each of a vertical distance from the first ground sheet to the first transmission line and a vertical distance from the second ground sheet to the second transmission line