公开(公告)号：US20070254469A1

公开(公告)日：2007-11-01

申请号：US11617220

申请日：2006-12-28

Applicant: Pai-Chou Liu ,  Wen-Shin Lin ,  Sheng-Hong Cheng ,  Yu-Hsin Lee ,  Ming-Chia Hsieh ,  Kuan-Hung Yeh ,  Chia-Wei Chang ,  Tsung-Chi Chen

Inventor： Pai-Chou Liu ,  Wen-Shin Lin ,  Sheng-Hong Cheng ,  Yu-Hsin Lee ,  Ming-Chia Hsieh ,  Kuan-Hung Yeh ,  Chia-Wei Chang ,  Tsung-Chi Chen

IPC: H01L21/4763

CPC classification number: H05K3/3484 ,  H05K3/3442 ,  H05K2201/10636 ,  H05K2203/0545 ,  Y02P70/611 ,  Y02P70/613

Abstract: An improved surface mounting method applied in a semiconductor package process is provided, wherein the method comprises the following steps: First a substrate having at least one pad set on one surface of the substrate is provided. Then a mask having at least one opening associated with one of the at least one pad is set on the substrate, wherein each opening is separated into a plurality of sub-openings by a segregator to expose the pad. Subsequently, a printing process is conducted to form a conductive layer on each pad. After removing the mask, a passive device is set on the conductive layer over the pad, and a heating treatment is conducted to fix the passive device on the pad.

Abstract translation: 提供了一种应用于半导体封装工艺中的改进的表面安装方法，其中该方法包括以下步骤：首先提供在衬底的一个表面上具有至少一个衬垫的衬底。 然后，在衬底上设置具有至少一个与至少一个衬垫中的一个相关联的开口的掩模，其中通过分离器将每个开口分隔成多个子开口以露出衬垫。 随后，进行打印处理以在每个垫上形成导电层。 在去除掩模之后，在焊盘上的导电层上设置无源器件，并且进行加热处理以将无源器件固定在焊盘上。

公开(公告)号：US07662709B2

公开(公告)日：2010-02-16

申请号：US11617220

申请日：2006-12-28

Applicant: Pai-Chou Liu ,  Wen-Shin Lin ,  Sheng-Hong Cheng ,  Yu-Hsin Lee ,  Ming-Chia Hsieh ,  Kuan-Hung Yeh ,  Chia-Wei Chang ,  Tsung-Chi Chen

Inventor： Pai-Chou Liu ,  Wen-Shin Lin ,  Sheng-Hong Cheng ,  Yu-Hsin Lee ,  Ming-Chia Hsieh ,  Kuan-Hung Yeh ,  Chia-Wei Chang ,  Tsung-Chi Chen

IPC: H01L21/4763

CPC classification number: H05K3/3484 ,  H05K3/3442 ,  H05K2201/10636 ,  H05K2203/0545 ,  Y02P70/611 ,  Y02P70/613

Abstract: An improved surface mounting method applied in a semiconductor package process is provided, wherein the method comprises the following steps: First a substrate having at least one pad set on one surface of the substrate is provided. Then a mask having at least one opening associated with one of the at least one pad is set on the substrate, wherein each opening is separated into a plurality of sub-openings by a segregator to expose the pad. Subsequently, a printing process is conducted to form a conductive layer on each pad. After removing the mask, a passive device is set on the conductive layer over the pad, and a heating treatment is conducted to fix the passive device on the pad.

Abstract translation: 提供了一种应用于半导体封装工艺中的改进的表面安装方法，其中该方法包括以下步骤：首先提供在衬底的一个表面上具有至少一个衬垫的衬底。 然后，在衬底上设置具有至少一个与至少一个衬垫中的一个相关联的开口的掩模，其中通过分离器将每个开口分隔成多个子开口以露出衬垫。 随后，进行打印处理以在每个垫上形成导电层。 在去除掩模之后，在焊盘上的导电层上设置无源器件，并且进行加热处理以将无源器件固定在焊盘上。

公开(公告)号：US07911056B2

公开(公告)日：2011-03-22

申请号：US11651540

申请日：2007-01-10

Applicant: Pai-Chou Liu ,  Yu-Hsin Lee

Inventor： Pai-Chou Liu ,  Yu-Hsin Lee

IPC: H01L23/48

CPC classification number: H05K3/3452 ,  H01L23/49816 ,  H01L23/49838 ,  H01L2224/05552 ,  H01L2224/05555 ,  H01L2224/05571 ,  H05K2201/0989 ,  H05K2201/10734 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: A substrate structure having non-solder mask design (N-SMD) ball pads. The substrate structure includes a substrate and a solder mask. The substrate has a first surface, a trace layer and at least one ball pad. The ball pad and the trace layer are disposed on the first surface. The trace layer has a plurality of traces, and at least one trace electrically connects to the ball pad. The solder mask has at least one opening corresponding to the ball pad. The size of the opening is larger than that of the ball pad. The solder mask covers the trace connecting to the ball pad. The problem of non-alignment of the solder ball can thus be solved, and the hole in the solder ball can be prevented when the substrate structure is welded with a PCB so that the reliability of solder ball welding can be improved.

Abstract translation: 具有非焊锡掩模设计（N-SMD）球垫的衬底结构。 衬底结构包括衬底和焊接掩模。 基板具有第一表面，迹线层和至少一个球垫。 球垫和轨迹层设置在第一表面上。 迹线层具有多个迹线，并且至少一个轨迹电连接到球垫。 焊接掩模具有至少一个对应于球垫的开口。 开口的尺寸大于球垫的尺寸。 焊接掩模覆盖连接到球垫的迹线。 因此可以解决焊球不对准的问题，并且当用PCB焊接衬底结构时可以防止焊球中的孔，从而可以提高焊球焊接的可靠性。

公开(公告)号：US20080042278A1

公开(公告)日：2008-02-21

申请号：US11651540

申请日：2007-01-10

Applicant: Pai-Chou Liu ,  Yu-Hsin Lee

Inventor： Pai-Chou Liu ,  Yu-Hsin Lee

IPC: H01L23/48

CPC classification number: H05K3/3452 ,  H01L23/49816 ,  H01L23/49838 ,  H01L2224/05552 ,  H01L2224/05555 ,  H01L2224/05571 ,  H05K2201/0989 ,  H05K2201/10734 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: The present invention relates to a substrate structure having non-solder mask design (N-SMD) ball pads. The substrate structure comprises a substrate and a solder mask. The substrate has a first surface, a trace layer and at least one ball pad. The ball pad and the trace layer are disposed on the first surface. The trace layer has a plurality of traces, and at least one trace electrically connects to the ball pad. The solder mask has at least one opening corresponding the ball pad. The size of the opening is larger than that of the ball pad. The solder mask covers the trace connecting to the ball pad. By utilizing the substrate structure of the invention, the problem of non-alignment of the solder ball can be solved, and the hole in the solder ball can be prevented when the substrate structure is welded with a PCB so that the reliability of solder ball welding can be improved.

Abstract translation: 本发明涉及具有非阻焊掩模设计（N-SMD）球垫的衬底结构。 衬底结构包括衬底和焊接掩模。 基板具有第一表面，迹线层和至少一个球垫。 球垫和轨迹层设置在第一表面上。 迹线层具有多个迹线，并且至少一个轨迹电连接到球垫。 焊接掩模具有至少一个对应于球垫的开口。 开口的尺寸大于球垫的尺寸。 焊接掩模覆盖连接到球垫的迹线。 通过利用本发明的衬底结构，可以解决焊球不对准的问题，并且当衬底结构用PCB焊接时可以防止焊球中的孔，从而焊球焊接的可靠性 可以改进。