公开(公告)号：US09385275B2

公开(公告)日：2016-07-05

申请号：US14830713

申请日：2015-08-19

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Atsushi Yamada ,  Akira Inoue

IPC: H01L33/00 ,  H01L33/24 ,  H01L33/20 ,  H01L33/38 ,  H01L33/16 ,  H01L33/32

CPC classification number: H01L33/24 ,  H01L33/0025 ,  H01L33/0075 ,  H01L33/16 ,  H01L33/20 ,  H01L33/32 ,  H01L33/38

Abstract: In a nitride semiconductor light-emitting diode having a shape of an isosceles triangle in a top view, either Group Aa consisting of the following two mathematical formulae (Ia) and (IIa) or Group Ab consisting of the following two mathematical formulae (Ib) and (IIb) is satisfied: 20 degrees≦Angle degree α≦40 degrees (Ia) and 0 degrees≦Angle degree θ≦40 degrees (IIa)  Group Aa: 90 degrees≦Angle degree α≦130 degrees (Ib) and 50 degrees≦Angle degree θ≦90 degrees (IIb).  Group Ab:

Abstract translation: 在顶视图中具有等腰三角形形状的氮化物半导体发光二极管中，由以下两个数学式（Ia）和（IIa）组成的组Aa或由以下两个数学式（Ib）组成的组Ab， 并且（IIb）满足：20度＆lt; nlE;角度α＆nlE; 40度（Ia）和0度＆amp; nlE;角度和角度;＆nlE; 40度（IIa）组Aa：90度和nlE;角度α＆ 50度＆nlE;角度和角度;＆nlE; 90度（IIb）。 组Ab：

公开(公告)号：US09142748B2

公开(公告)日：2015-09-22

申请号：US14572771

申请日：2014-12-17

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Hideki Ohmae ,  Junichi Hibino ,  Atsushi Yamada

IPC: H01L33/20 ,  H01L33/62 ,  H01L27/15 ,  H01L33/52 ,  H01L33/00

CPC classification number: H01L33/62 ,  G02F1/133603 ,  G02F1/133608 ,  H01L27/156 ,  H01L33/005 ,  H01L33/52 ,  H01L2224/24 ,  H01L2224/73267 ,  H01L2224/82 ,  H01L2224/92244 ,  H01L2924/3512 ,  H01L2933/0066

Abstract: A light emitting device in which a plurality of LED chips are arranged. Each of the plurality of LED chips include a light emitting region that is formed on a substrate, a first pad electrode that is formed on the substrate, and a through-hole that penetrates the substrate. First wiring that passes through the through-hole of one LED chip and the through-hole of an adjacent LED chip, and electrically connects the first pad electrode of the one LED chip and the first pad electrode of the adjacent LED chip is provided. The tip-end parts of the first wiring that have passed through the through-holes have, at a cross section cut at a plane that is parallel with a principal surface of the substrate, a larger cross-sectional area than the cross-sectional area of the first wiring inside the through-holes.

Abstract translation: 一种其中布置有多个LED芯片的发光器件。 多个LED芯片中的每一个包括形成在基板上的发光区域，形成在基板上的第一焊盘电极和穿透基板的通孔。 提供通过一个LED芯片的通孔和相邻LED芯片的通孔的第一布线，并且将一个LED芯片的第一焊盘电极和相邻LED芯片的第一焊盘电极电连接。 已经穿过通孔的第一布线的前端部分在与基板的主表面平行的平面处切割的横截面具有比横截面积更大的横截面积 的通孔内的第一布线。