公开(公告)号：US09775239B2

公开(公告)日：2017-09-26

申请号：US15128093

申请日：2015-04-07

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Tatsuya Arisawa ,  Yoshihiko Nakamura ,  Tomoyuki Abe ,  Kiyotaka Komori ,  Syouji Hasimoto ,  Mitsuyoshi Nishino

IPC: H05K1/00 ,  H05K1/03 ,  B32B15/08 ,  B32B27/20 ,  C08J5/24 ,  H05K3/00 ,  C08J5/10

CPC classification number: H05K1/0373 ,  B32B15/08 ,  B32B27/20 ,  B32B2305/076 ,  B32B2457/08 ,  C08J5/10 ,  C08J5/24 ,  C08J2300/24 ,  C08J2363/00 ,  C08J2371/12 ,  H05K1/0366 ,  H05K3/0067 ,  H05K2201/0209 ,  H05K2201/0215

Abstract: A resin composition for printed circuit board contains a resin component containing a thermosetting resin, and an inorganic filler. The inorganic filler contains crushed silica having a specific surface area in a range from 0.1 m2/g to 15 m2/g, inclusive, and molybdenum compound particles each having a molybdenum compound in at least a surface layer portion. A content of the crushed silica is in a range from 10 parts by mass to 150 parts by mass inclusive with respect to 100 parts by mass of the resin component.