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公开(公告)号：US20240145374A1
公开(公告)日：2024-05-02
申请号：US18548450
申请日：2022-03-16
发明人： Takayoshi NIRENGI , Akihiro OISHI , Tsutomu AISAKA , Daisuke MATSUSHITA , Jumpei IWANAGA , Tadashi TOJO
IPC分类号： H01L23/498 , H01L21/48
CPC分类号： H01L23/49838 , H01L21/4846
摘要： A wiring body disposed above a substrate including a conductor includes: a via electrode provided in a via hole formed in an insulating layer above the substrate and connected to the conductor through the via hole; and wiring provided above the substrate with the insulating layer interposed therebetween. The via electrode includes: a seed layer formed along an inner surface of the insulating layer from above the conductor in the via hole; a via electrode body layer formed to be located above the seed layer and fill the via hole; and an adhesion layer formed between the seed layer and the inner surface of the insulating layer in the via hole.
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公开(公告)号：US20240147617A1
公开(公告)日：2024-05-02
申请号：US18548458
申请日：2022-03-16
发明人： Takayoshi NIRENGI , Akihiro OISHI , Tsutomu AISAKA , Daisuke MATSUSHITA , Jumpei IWANAGA , Tadashi TOJO
CPC分类号： H05K1/09 , H05K3/46 , H05K2201/0753 , H05K2201/095
摘要： A wiring body disposed above a substrate including a conductor including: a via electrode provided in a via hole formed in an insulating layer above the substrate and connected to the conductor through the via hole; and wiring provided above the substrate with the insulating layer interposed therebetween. A lower layer included in the via electrode and located above the insulating layer and a lower layer included in the wiring include the same material.
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3.发明公开公开(公告)号：US20240153859A1
公开(公告)日：2024-05-09
申请号：US18549782
申请日：2022-03-16
发明人： Takayoshi NIRENGI , Akihiro OISHI , Tsutomu AISAKA , Daisuke MATSUSHITA , Jumpei IWANAGA , Tadashi TOJO
IPC分类号： H01L23/498 , H01L21/768 , H01L23/00 , H01L25/065
CPC分类号： H01L23/49838 , H01L21/76874 , H01L23/49822 , H01L24/29 , H01L24/45 , H01L25/0652 , H01L2224/29008 , H01L2224/29025 , H01L2224/45005 , H01L2224/4502 , H01L2924/01014 , H01L2924/01029 , H01L2924/182
摘要： A wiring body disposed above a substrate including a conductor includes: a via electrode provided in a via hole formed in an insulating layer above the substrate and connected to the conductor through the via hole; and wiring provided above the substrate with the insulating layer interposed therebetween. The material or structure of a lower layer in the via electrode and the material or structure of a lower layer in the wiring are different.
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公开(公告)号：US20240155774A1
公开(公告)日：2024-05-09
申请号：US18549826
申请日：2022-03-16
发明人： Takayoshi NIRENGI , Akihiro OISHI , Tsutomu AISAKA , Daisuke MATSUSHITA , Jumpei IWANAGA , Tadashi TOJO
CPC分类号： H05K3/20 , C23C18/38 , H01L21/4846 , H05K3/108 , H05K3/18 , H05K2203/072 , H05K2203/0723
摘要： A wiring transfer plate for forming wiring to be transferred to another component includes: a base; a plating base material layer formed as a release layer on the base; an insulating layer covering the base with an opening above the plating base material layer; and a projecting structure formed on the insulating layer for forming, in an insulating layer of a component to which the wiring is to be transferred, a via hole for a via electrode.
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