公开(公告)号：US20240147617A1

公开(公告)日：2024-05-02

申请号：US18548458

申请日：2022-03-16

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Takayoshi NIRENGI ,  Akihiro OISHI ,  Tsutomu AISAKA ,  Daisuke MATSUSHITA ,  Jumpei IWANAGA ,  Tadashi TOJO

IPC: H05K1/09 ,  H05K3/46

CPC classification number: H05K1/09 ,  H05K3/46 ,  H05K2201/0753 ,  H05K2201/095

Abstract: A wiring body disposed above a substrate including a conductor including: a via electrode provided in a via hole formed in an insulating layer above the substrate and connected to the conductor through the via hole; and wiring provided above the substrate with the insulating layer interposed therebetween. A lower layer included in the via electrode and located above the insulating layer and a lower layer included in the wiring include the same material.

公开(公告)号：US20240040696A1

公开(公告)日：2024-02-01

申请号：US18178877

申请日：2023-03-06

Applicant: Kabushiki Kaisha Toshiba ,  Toshiba Electronic Devices & Storage Corporation

Inventor： Yoshihiro AMEMIYA

IPC: H05K1/11 ,  H05K3/10 ,  G11B5/012

CPC classification number: H05K1/111 ,  H05K1/115 ,  H05K3/103 ,  G11B5/012 ,  H05K2201/0302 ,  H05K2201/0753

Abstract: According to one embodiment, a printed circuit board includes a first conductive layer on an insulating layer, including connection pads, a first mounting pad, a second mounting pad, a second wiring connecting the first mounting pad and one of the connection pads, and a first reinforcing pattern extending from the second mounting pad, a second conductive layer on another surface of the insulating layer, including a third wiring connected to one of the connection pads, and a conductive via connecting the second mounting pad and the third wiring. The second conductive layer includes a pad portion on the third wiring, opposed to the second mounting pad, and a third reinforcing pattern extending from the pad portion and opposed to the first reinforcing pattern.

公开(公告)号：US20240268034A1

公开(公告)日：2024-08-08

申请号：US18382278

申请日：2023-10-20

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jesang Park ,  Changgun Oh ,  Yangje Lee ,  Hyun Kyung Park

IPC: H05K3/10 ,  H05K1/03 ,  H05K3/46

CPC classification number: H05K3/103 ,  H05K1/0306 ,  H05K3/4697 ,  H05K2201/0212 ,  H05K2201/0753 ,  H05K2201/099 ,  H05K2201/10204 ,  H05K2203/0186 ,  H05K2203/1377

Abstract: A circuit board according to an embodiment includes: a first insulation layer, a first circuit wire that is disposed on the first insulation layer, a second insulation layer that covers the first insulation layer and the first circuit wire, and includes a material that is different from that of the first insulation layer, and a third insulation layer that is disposed on the second insulation layer and includes a cavity. A bottom surface of the cavity is a top surface of the second insulation layer.

公开(公告)号：US08749989B1

公开(公告)日：2014-06-10

申请号：US12655318

申请日：2009-12-28

Applicant: Harvey L. Kaylie ,  Aron Raklyar

Inventor： Harvey L. Kaylie ,  Aron Raklyar

IPC: H05K7/10 ,  H05K7/12

CPC classification number: H05K1/111 ,  H01L23/13 ,  H01L23/15 ,  H01L23/49805 ,  H01L2924/0002 ,  H05K1/0271 ,  H05K1/0306 ,  H05K1/09 ,  H05K1/113 ,  H05K2201/032 ,  H05K2201/0753 ,  H05K2201/10378 ,  H01L2924/00

Abstract: An LTCC carrier composed of thermosetting polymer, woven glass fiber and ceramic has gold over nickel contact pads on top and bottom surfaces and conductive vias therethrough between aligned pairs of top and bottom pads. The vias prevent undesirable inductive paths from limiting high frequency operation of the circuitry. Solder deposits on the top pads attach the LTCC component, which is further secured to the carrier by epoxy, thus improving resistance to thermal stress and mechanical shock. A slot through the carrier body between top and bottom surfaces further reduces thermal stress and mechanical shock. Metallized castellations on opposite carrier sides provide additional surface area for reflow solder joints with the PCB, and a means for visually inspecting the solder joint quality. A gap in the metallization on the top layer of the carrier prevents solder spreading during multiple soldering cycles, which may result in poor solder joints.

Abstract translation: 由热固性聚合物，编织玻璃纤维和陶瓷组成的LTCC载体在顶部和底部表面上的镍接触焊盘上具有金，并且在对准的顶部和底部焊盘对之间穿过其中的导电通孔。 通孔防止不期望的电感路径限制电路的高频操作。 顶部焊盘上的焊料沉积物连接LTCC部件，其通过环氧树脂进一步固定到载体上，从而改善对热应力和机械冲击的抗性。 在顶面和底面之间穿过承载体的槽进一步降低了热应力和机械冲击。 在相对的载体侧上的金属化的蓖耳体为PCB的回流焊接提供额外的表面积，以及用于目视检查焊点质量的手段。 载体顶层上的金属化中的间隙防止在多个焊接周期期间的焊料扩散，这可能导致差的焊接点。

公开(公告)号：US20240224413A1

公开(公告)日：2024-07-04

申请号：US18555866

申请日：2021-11-16

Applicant: Resonac Corporation

Inventor： Kosuke URASHIMA ,  Motoki YONEKURA ,  Motohiro ARIFUKU ,  Tomohiko KOTAKE ,  Etsuo MIZUSHIMA

IPC: H05K1/02 ,  H05K3/06 ,  H05K3/28

CPC classification number: H05K1/0237 ,  H05K3/06 ,  H05K3/28 ,  H05K2201/0753 ,  H05K2201/083 ,  H05K2201/10287 ,  H05K2203/063

Abstract: A wiring substrate includes a substrate, conductor wiring provided on the substrate, and an insulator positioned on at least a part of the periphery of the conductor wiring, in which the insulator contains a magnetic material. The wiring substrate ensures little loss in transmission even in high-frequency band.

公开(公告)号：US09167690B1

公开(公告)日：2015-10-20

申请号：US14299701

申请日：2014-06-09

Applicant: SCIENTIFIC COMPONENTS CORPORATION

Inventor： Harvey L. Kaylie ,  Aron Raklyar

IPC: H05K7/10 ,  H05K7/12 ,  H05K1/11 ,  H05K1/09

CPC classification number: H05K1/111 ,  H01L23/13 ,  H01L23/15 ,  H01L23/49805 ,  H01L2924/0002 ,  H05K1/0271 ,  H05K1/0306 ,  H05K1/09 ,  H05K1/113 ,  H05K2201/032 ,  H05K2201/0753 ,  H05K2201/10378 ,  H01L2924/00

Abstract: An LTCC carrier composed of thermosetting polymer, woven glass fiber and ceramic has gold over nickel contact pads on top and bottom surfaces and conductive vias therethrough between aligned pairs of top and bottom pads. The vias prevent undesirable inductive paths from limiting high frequency operation of the circuitry. Solder deposits on the top pads attach the LTCC component, which is further secured to the carrier by epoxy, thus improving resistance to thermal stress and mechanical shock. A slot through the carrier body between top and bottom surfaces further reduces thermal stress and mechanical shock. Metallized castellations on opposite carrier sides provide additional surface area for reflow solder joints with the PCB, and a means for visually inspecting the solder joint quality. A gap in the metallization on the top layer of the carrier prevents solder spreading during multiple soldering cycles, which may result in poor solder joints.

Abstract translation: 由热固性聚合物，编织玻璃纤维和陶瓷组成的LTCC载体在顶部和底部表面上的镍接触焊盘上具有金，并且在对准的顶部和底部焊盘对之间穿过其中的导电通孔。 通孔防止不期望的电感路径限制电路的高频操作。 顶部焊盘上的焊料沉积物连接LTCC部件，其通过环氧树脂进一步固定到载体上，从而改善对热应力和机械冲击的抗性。 在顶面和底面之间穿过承载体的槽进一步降低了热应力和机械冲击。 在相对的载体侧上的金属化的蓖耳体为PCB的回流焊接提供额外的表面积，以及用于目视检查焊点质量的手段。 载体顶层上的金属化中的间隙防止在多个焊接周期期间的焊料扩散，这可能导致差的焊接点。