公开(公告)号：US09944766B2

公开(公告)日：2018-04-17

申请号：US15502514

申请日：2015-08-21

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Masaaki Matsumoto ,  Takatoshi Mito ,  Tatuo Yonemoto

IPC: C08J5/24 ,  C09D163/00 ,  H05K1/03 ,  B32B15/08

CPC classification number: C08J5/24 ,  B32B15/08 ,  B32B2457/08 ,  C08J2363/00 ,  C08J2433/14 ,  C08K3/36 ,  C08L63/00 ,  C09D163/00 ,  H05K1/0366 ,  H05K1/0373 ,  H05K3/022 ,  H05K2201/0129 ,  H05K2201/0209 ,  H05K2201/029

Abstract: A prepreg includes a fiber base material and a thermosetting resin composition impregnated into the fiber base material. The thermosetting resin composition contains a thermosetting resin including an epoxy resin; a curing agent; an inorganic filler; and an acrylic acid ester copolymer having a weight average molecular weight of 10×104 or more and less than 45×104. A content of the inorganic filler is 150 parts by mass or more relative to a total of 100 parts by mass of the thermosetting resin and the curing agent. A content of the acrylic acid ester copolymer is more than 30 parts by mass and 90 parts by mass or less relative to the total of 100 parts by mass of the thermosetting resin and the curing agent.