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Patent Agency Ranking
公开(公告)号：US11037859B2
公开(公告)日：2021-06-15
申请号：US16359861
申请日：2019-03-20
Inventor： Hayata Onaga , Tomonari Nebashi
IPC: G06F1/16 , H05K5/00 , H05K7/00 , H01L23/42 , G01R15/20 , G01R19/00 , H01L23/14 , H01L23/40 , H01L23/552 , H01L25/18 , H02M1/08 , H02M7/00 , H05K7/20 , H05K9/00 , H05K7/14 , H02M1/00
Abstract: To improve cooling capability, power conversion apparatus 1 that converts a direct current voltage into an alternating current voltage includes: first substrate 100 on which power conversion circuit 2 is mounted; second substrate 200 on which driving circuit 3 that drives power conversion circuit 2 is mounted; and shield plate 300 that is disposed between first substrate 100 and second substrate 200, and first substrate 100 is a metal substrate.
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公开(公告)号：US20210257276A1
公开(公告)日：2021-08-19
申请号：US17306667
申请日：2021-05-03
Inventor： Hayata Onaga , Tomonari Nebashi
IPC: H01L23/42 , G01R15/20 , G01R19/00 , H01L23/14 , H01L23/40 , H01L23/552 , H01L25/18 , H02M1/08 , H02M7/00 , H05K7/20 , H05K9/00 , H05K7/14
Abstract: To improve cooling capability, power conversion apparatus 1 that converts a direct current voltage into an alternating current voltage includes: first substrate 100 on which power conversion circuit 2 is mounted; second substrate 200 on which driving circuit 3 that drives power conversion circuit 2 is mounted; and shield plate 300 that is disposed between first substrate 100 and second substrate 200, and first substrate 100 is a metal substrate.
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公开(公告)号：US11892248B2
公开(公告)日：2024-02-06
申请号：US17664664
申请日：2022-05-24
Inventor： Shozo Ochi , Masato Maede , Tomonari Nebashi , Ryo Ishikawa
IPC: F28F21/08 , B23K20/12 , H05K7/20 , B23K103/10
CPC classification number: F28F21/084 , B23K20/122 , H05K7/20927 , B23K2103/10
Abstract: A cooling unit includes a unit main body including a bottom portion, a peripheral wall portion rising from the peripheral edge of the bottom portion, and a seal for sealing an opening of the unit main body. The unit main body is joined to the seal through a plasticized region, and a void is defined in the peripheral wall portion of the unit main body.
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公开(公告)号：US11817370B2
公开(公告)日：2023-11-14
申请号：US18053707
申请日：2022-11-08
Inventor： Hayata Onaga , Tomonari Nebashi
IPC: G06F1/16 , H05K5/00 , H05K7/00 , H01L23/42 , G01R15/20 , G01R19/00 , H01L23/14 , H01L23/40 , H01L23/552 , H01L25/18 , H02M1/08 , H02M7/00 , H05K7/20 , H05K9/00 , H05K7/14 , H02M1/00
CPC classification number: H01L23/42 , G01R15/207 , G01R19/0092 , H01L23/142 , H01L23/4006 , H01L23/552 , H01L25/18 , H02M1/08 , H02M7/003 , H05K7/1432 , H05K7/209 , H05K9/00 , H01L2023/4087 , H02M1/0009
Abstract: To improve cooling capability, power conversion apparatus 1 that converts a direct current voltage into an alternating current voltage includes: first substrate 100 on which power conversion circuit 2 is mounted; second substrate 200 on which driving circuit 3 that drives power conversion circuit 2 is mounted; and shield plate 300 that is disposed between first substrate 100 and second substrate 200, and first substrate 100 is a metal substrate.
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公开(公告)号：US11521913B2
公开(公告)日：2022-12-06
申请号：US17306667
申请日：2021-05-03
Inventor： Hayata Onaga , Tomonari Nebashi
IPC: G06F1/16 , H05K5/00 , H05K7/00 , H01L23/42 , G01R15/20 , G01R19/00 , H01L23/14 , H01L23/40 , H01L23/552 , H01L25/18 , H02M1/08 , H02M7/00 , H05K7/20 , H05K9/00 , H05K7/14 , H02M1/00
Abstract: To improve cooling capability, power conversion apparatus 1 that converts a direct current voltage into an alternating current voltage includes: first substrate 100 on which power conversion circuit 2 is mounted; second substrate 200 on which driving circuit 3 that drives power conversion circuit 2 is mounted; and shield plate 300 that is disposed between first substrate 100 and second substrate 200, and first substrate 100 is a metal substrate.
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