公开(公告)号：US10450405B2

公开(公告)日：2019-10-22

申请号：US15501200

申请日：2015-08-25

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Daisuke Nii ,  Hidetsugu Motobe ,  Toshiyuki Higashida

IPC: C08G59/42 ,  C08J5/24 ,  H05K1/03 ,  C08K3/36

Abstract: A resin composition contains an epoxy resin, and a curing agent including a first acid anhydride and a second acid anhydride. An unsaturated bond concentration in the second acid anhydride is not higher than 0.7%. The unsaturated bond concentration is represented by following formula (1). The ratio of the number of acid anhydride equivalents of the first acid anhydride to the number of epoxy equivalents of the epoxy resin is between 0.05 and 0.5 (inclusive). The ratio of the total number of acid anhydride equivalents of the first acid anhydride and the second acid anhydride to the number of epoxy equivalents is between 0.5 and 1.1 (inclusive). Unsaturated bond concentration={(number of unsaturated bonds per molecule)/(molecular weight)}/(number of acid anhydride groups per molecule)×100  (1)

公开(公告)号：US09681541B2

公开(公告)日：2017-06-13

申请号：US15130943

申请日：2016-04-16

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Toshiyuki Higashida ,  Hidetsugu Motobe ,  Daisuke Nii

IPC: H05K1/02 ,  H05K1/03 ,  C08J5/24 ,  C08G59/40 ,  C08K5/09 ,  C08L25/08 ,  C08L63/00 ,  C08G59/42 ,  C08L63/08 ,  B32B5/02 ,  B32B15/082 ,  B32B15/14 ,  B32B15/20 ,  B32B27/18 ,  B32B27/20 ,  B32B27/30 ,  B32B15/092

CPC classification number: H05K1/0353 ,  B32B5/02 ,  B32B15/082 ,  B32B15/092 ,  B32B15/14 ,  B32B15/20 ,  B32B27/18 ,  B32B27/20 ,  B32B27/302 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2264/102 ,  B32B2270/00 ,  B32B2307/20 ,  B32B2307/206 ,  B32B2307/30 ,  B32B2307/306 ,  B32B2307/3065 ,  B32B2307/50 ,  B32B2457/08 ,  C08G59/40 ,  C08G59/4261 ,  C08G59/4284 ,  C08J5/24 ,  C08J2363/08 ,  C08J2363/10 ,  C08J2435/06 ,  C08K5/09 ,  C08L25/08 ,  C08L63/00 ,  C08L63/08 ,  C08L2203/206 ,  H05K1/0296 ,  H05K1/03 ,  H05K1/0366 ,  H05K1/0373 ,  H05K3/022 ,  H05K2201/012

Abstract: Resin composition of the present disclosure includes: an epoxy resin; and a hardener, in which the hardener contains a styrene-maleic anhydride copolymer (SMA) and an anhydride having only one anhydride group in a molecule. An acid value of the SMA is in a range from 300 to 550, inclusive. A ratio of an anhydride equivalent number of the anhydride with respect to an epoxy group equivalent number of the epoxy resin is in a range from 0.05 to 0.5, inclusive. A ratio of the total number of the equivalent numbers of the anhydride groups of the anhydride and the SMA with respect to the epoxy group equivalent number is a range from 0.5 to 1.2, inclusive.