公开(公告)号：US11618110B2

公开(公告)日：2023-04-04

申请号：US17073461

申请日：2020-10-19

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Naomichi Ohashi ,  Koso Matsuno ,  Yasuhiro Okawa

IPC: B23K35/362 ,  B23K35/36 ,  B23K35/26

Abstract: A solder paste includes a solder powder; and a flux component containing a compound having at least one carboxyl group protected by a trialkylsilyl group.

公开(公告)号：US12028986B2

公开(公告)日：2024-07-02

申请号：US17367269

申请日：2021-07-02

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Naomichi Ohashi ,  Yasuhiro Okawa ,  Koso Matsuno

IPC: B23K1/00 ,  H05K1/03 ,  H05K1/09 ,  H05K3/34 ,  B23K101/40 ,  B23K103/00

CPC classification number: H05K3/341 ,  B23K1/0016 ,  H05K1/032 ,  H05K1/092 ,  B23K2101/40 ,  B23K2103/42

Abstract: A method for mounting an electronic component on a resin base material, the method including:



(1) preparing the resin base material having a wiring pattern formed of a conductive paste;
(2) supplying a solder paste which contains solder particles and a thermosetting resin in a state before curing to a predetermined portion of the resin base material;
(3) placing the electronic component on the solder paste; and
(4) heating the resin base material to heat the solder paste to a temperature in a range from 105° C. to 130° C., inclusive to melt the solder particles, and starting a curing exothermic reaction of the thermosetting resin, wherein
a melting temperature of the solder particles is in a range from 90° C. to 130° C., inclusive, and a peak temperature of the curing exothermic reaction of the thermosetting resin is in a range from 135° C. to 165° C., inclusive.