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公开(公告)号：US11618110B2
公开(公告)日：2023-04-04
申请号：US17073461
申请日：2020-10-19
Inventor： Naomichi Ohashi , Koso Matsuno , Yasuhiro Okawa
IPC: B23K35/362 , B23K35/36 , B23K35/26
Abstract: A solder paste includes a solder powder; and a flux component containing a compound having at least one carboxyl group protected by a trialkylsilyl group.
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公开(公告)号：US11053328B2
公开(公告)日：2021-07-06
申请号：US16836946
申请日：2020-04-01
Inventor： Keisuke Kawashima , Koso Matsuno
IPC: C08F2/46 , C08F2/50 , C08G61/04 , C08F2/48 , C08F2/52 , C08F20/18 , C08F20/32 , C08G75/26 , C08K5/07 , C08K5/31
Abstract: Provided is a photocurable composition including a component (A) which is an acrylic ester compound containing one or more acryloyl groups in one molecule; a component (B) which is an acrylic ester compound containing one or more acryloyl groups and one or more epoxy groups in one molecule; a component (C) which is a compound containing two or more thiol groups in one molecule; a component (D) which is a photoradical generator; and a component (E) which is a photobase generator, in which a ratio between a total mass of the component (A) and the component (B) and a mass of the component (C) is in a range of 67.8:32.2 to 88.0:12.0, inclusive.
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Patent Agency Ranking
公开(公告)号：US12028986B2
公开(公告)日：2024-07-02
申请号：US17367269
申请日：2021-07-02
Inventor： Naomichi Ohashi , Yasuhiro Okawa , Koso Matsuno
IPC: B23K1/00 , H05K1/03 , H05K1/09 , H05K3/34 , B23K101/40 , B23K103/00
CPC classification number: H05K3/341 , B23K1/0016 , H05K1/032 , H05K1/092 , B23K2101/40 , B23K2103/42
Abstract: A method for mounting an electronic component on a resin base material, the method including:
(1) preparing the resin base material having a wiring pattern formed of a conductive paste;
(2) supplying a solder paste which contains solder particles and a thermosetting resin in a state before curing to a predetermined portion of the resin base material;
(3) placing the electronic component on the solder paste; and
(4) heating the resin base material to heat the solder paste to a temperature in a range from 105° C. to 130° C., inclusive to melt the solder particles, and starting a curing exothermic reaction of the thermosetting resin, wherein
a melting temperature of the solder particles is in a range from 90° C. to 130° C., inclusive, and a peak temperature of the curing exothermic reaction of the thermosetting resin is in a range from 135° C. to 165° C., inclusive.-
公开(公告)号：US11623307B2
公开(公告)日：2023-04-11
申请号：US17235080
申请日：2021-04-20
Inventor： Hirohisa Hino , Koso Matsuno
IPC: B23K35/36 , B23K35/362 , B23K35/02 , B23K35/26 , H05K3/34 , H05K1/09 , B23K101/42
Abstract: A resin flux solder paste includes a solder powder, and a flux, in which the flux contains at least an epoxy resin, a curing agent, a curing accelerator, and an activator, the epoxy resin contains 10% to 90% by weight of one or more of a biphenyl aralkyl type epoxy resin, a naphthalene type epoxy resin, and a dicyclopentadiene type epoxy resin, having an epoxy equivalent of 200 to 400, with respect to a total amount of the epoxy resin, and the curing agent contains 30% to 95% by weight of a biphenyl aralkyl phenol resin having a hydroxyl group equivalent of 150 to 350 with respect to a total amount of the curing agent, and 5% to 70% by weight of a phenol novolac resin having an allyl group having a hydroxyl group equivalent of 100 to 200 with respect to the total amount of the curing agent.
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公开(公告)号：US11822168B2
公开(公告)日：2023-11-21
申请号：US17282695
申请日：2019-09-30
Inventor： Keisuke Kawashima , Koso Matsuno
IPC: G02F1/1333 , C08G18/00 , C08F283/10 , C08G59/68 , C08G59/66 , C08G18/79 , C08L63/00 , C08G59/22 , C08G18/38
CPC classification number: G02F1/1333 , C08F283/10 , C08G18/003 , C08G18/3876 , C08G18/792 , C08G59/22 , C08G59/66 , C08G59/68 , C08L63/00 , C09K2323/055 , C09K2323/057 , G02F2202/28 , C08F283/10 , C08F222/103
Abstract: There is provided a photocurable composition including Component (A): epoxy compound, Component (B): acrylic ester compound, Component (C): isocyanate compound, Component (D): photobase generator, and Component (E): compound having a thiol group, in which Component (A) has two or more epoxy groups in one molecule, Component (B) has two or more acryloyl groups in one molecule, Component (C) has two or more isocyanate groups in one molecule, and Component (E) has two or more thiol groups in one molecule, and a ratio of a total mass of Component (A), Component (B), Component (C), and Component (D) to a mass of Component (E) is (Component (A)+Component (B)+Component (C)+Component (D)):Component (E)=74:26 to 20:80.
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公开(公告)号：US20210354251A1
公开(公告)日：2021-11-18
申请号：US17235080
申请日：2021-04-20
Inventor： Hirohisa Hino , Koso Matsuno
Abstract: A resin flux solder paste includes a solder powder, and a flux, in which the flux contains at least an epoxy resin, a curing agent, a curing accelerator, and an activator, the epoxy resin contains 10% to 90% by weight of one or more of a biphenyl aralkyl type epoxy resin, a naphthalene type epoxy resin, and a dicyclopentadiene type epoxy resin, having an epoxy equivalent of 200 to 400, with respect to a total amount of the epoxy resin, and the curing agent contains 30% to 95% by weight of a biphenyl aralkyl phenol resin having a hydroxyl group equivalent of 150 to 350 with respect to a total amount of the curing agent, and 5% to 70% by weight of a phenol novolac resin having an allyl group having a hydroxyl group equivalent of 100 to 200 with respect to the total amount of the curing agent.
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公开(公告)号：US11970631B2
公开(公告)日：2024-04-30
申请号：US17805328
申请日：2022-06-03
Inventor： Naomichi Ohashi , Koso Matsuno
Abstract: A conductive paste includes: a solder powder having a melting point of less than or equal to 120° C.; a conductive filler; a flux for removing an oxide film of the solder powder; and a solvent, wherein a ratio of a mass of the conductive filler to a mass of the solder powder is 20% to 80%.
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