公开(公告)号：US09423304B2

公开(公告)日：2016-08-23

申请号：US14915509

申请日：2015-03-13

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Ryosuke Meshii ,  Toshinari Noda ,  Hiroki Kamiguchi ,  Takashi Kubo ,  Nobuo Sashinaka ,  Shoichi Taji ,  Naoki Ota ,  Naoto Onodera

IPC: G01J5/34

CPC classification number: G01J5/34 ,  G01J5/10 ,  H01L37/025

Abstract: An infrared ray detecting element includes: a substrate having a cavity; an infrared ray detecting portion including, sequentially stacked, a lower electrode layer, a detection layer, and an upper electrode layer; first and second support portions which support the infrared ray detecting portion above the cavity; and first and second external lead portions for leading electrical signals outputted from the infrared ray detecting portion, to the outside. The first support portion includes, sequentially stacked, a first upper wiring pattern, a first insulating layer, and a first lower wiring pattern. The upper electrode layer is connected to the first external lead portion via the first upper wiring pattern. The second support portion includes, sequentially stacked, a second upper wiring pattern, a second insulating layer, and a second lower wiring pattern. The lower electrode layer is connected to the second external lead portion via the second lower wiring pattern.

Abstract translation: 红外线检测元件包括：具有空腔的基板; 红外线检测部分，包括依次层叠下电极层，检测层和上电极层; 第一和第二支撑部分，其支撑在腔体上方的红外线检测部分; 以及用于将从红外线检测部分输出的电信号引导到外部的第一和第二外部引线部分。 第一支撑部包括依次堆叠的第一上布线图案，第一绝缘层和第一下布线图案。 上电极层经由第一上布线图案连接到第一外引线部分。 第二支撑部包括依次堆叠的第二上布线图案，第二绝缘层和第二下布线图案。 下部电极层经由第二下部布线图案与第二外部引线部连接。

公开(公告)号：US10609817B2

公开(公告)日：2020-03-31

申请号：US15577011

申请日：2016-06-22

Applicant: Panasonic Intellectual Property Management Co. Ltd.

Inventor： Ryosuke Meshii ,  Kazuo Goda ,  Takahiro Shinohara ,  Takanori Aoyagi ,  Kensaku Yamamoto ,  Hitoshi Yoshida

IPC: H05K1/02 ,  G01P15/125 ,  G01P15/08 ,  B81B7/00 ,  H05K1/03 ,  G01P1/00

Abstract: A wiring-buried glass substrate includes a glass substrate and a first wiring. The glass substrate includes a first surface, a second surface perpendicular to the first surface, and a third surface facing the first surface. The first wiring includes a first pillar portion and a first beam portion. The first pillar portion extends in a first direction perpendicular to the first surface of the glass substrate. The first beam portion is connected to a first surface of the first pillar portion and extends to a second direction perpendicular to a second surface of the glass substrate. The first wiring is buried in the glass substrate. The first surface of the first beam portion is exposed from a third surface of the glass substrate.