利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

26 条记录 (耗时 0.022 秒)

    Cleaning process
    1.
    发明授权
    Cleaning process 失效
    清洁过程

    公开(公告)号：US5849106A

    公开(公告)日：1998-12-15

    申请号：US70308

    申请日：1993-05-26

    申请人： Paul L. Bolden ,  Michael E. Hayes ,  John E. Braddy

    发明人： Paul L. Bolden ,  Michael E. Hayes ,  John E. Braddy

    IPC分类号： B08B3/08 ,  C11D3/18 ,  C11D3/20 ,  C11D3/43 ,  C11D7/24 ,  C11D7/26 ,  C11D7/50 ,  C11D11/00 ,  C23G5/024 ,  C23G5/032 ,  H05K3/26

    CPC分类号： C11D7/5027 ,  C11D11/0047 ,  C11D3/18 ,  C11D3/2093 ,  C11D3/43 ,  C23G5/024 ,  C23G5/032 ,  H05K3/26 ,  C11D7/24 ,  C11D7/263 ,  C11D7/264 ,  C11D7/266 ,  H05K2203/0783

    摘要： An industrial cleaning process in which a contaminant comprising soldering flux and/or adhesive tape residue is removed from a substrate contaminated therewith, for example, a printed circuit board contaminated with rosin flux, comprising: (A) contacting the substrate with a terpene-based cleaning composition which is substantially free of water-soluble organic material, for example, a surfactant, for a period of time sufficient to solubilize the contaminant; (B) removing the composition and solubilized contaminant from the substrate by contact with water having a temperature of about 70.degree. F. to about 140.degree. F. (but preferably lower) for a period of time of no longer than about 10 minutes to provide a substrate having a contamination rating of no greater than about 14 micrograms NaCl equivalent/square inch (MIL-P-28809A), and to thereby form a mixture comprising the composition, contaminant and water; and (C) separating the water from said mixture, the separated water being substantially free of water-soluble organic material and having a chemical oxygen demand of no greater than about 1,000 ppm. and also a cleaning process utilizing a cleaning composition comprising a major amount of a monobasic ester to clean surfaces that are contaminated with an organic residue.

    摘要翻译： 一种工业清洁方法，其中包含焊剂和/或胶带残留物的污染物从被污染的基底例如被松香助焊剂污染的印刷电路板上除去，包括：（A）使基材与萜烯基 清洁组合物，其基本上不含水溶性有机材料，例如表面活性剂，持续足以溶解污染物的时间; （B）通过与温度为约70°F至约140°F（但优选较低）的水接触不超过约10分钟的时间，从基材中除去组合物和溶解的污染物，以提供 污染等级不超过约14微克NaCl当量/平方英寸（MIL-P-28809A）的底物，从而形成包含组合物，污染物和水的混合物; 和（C）从所述混合物中分离水，所分离的水基本上不含水溶性有机材料，并且化学需氧量不大于约1,000ppm。 以及使用包含主要量的一元酯的清洁组合物以清洁被有机残余物污染的表面的清洁方法。

    Process of removing soldering flux and/or adhesive tape residue from a substrate
    2.
    发明授权
    Process of removing soldering flux and/or adhesive tape residue from a substrate 失效
    从基材去除焊剂和/或胶带残留物的工艺

    公开(公告)号：US5340407A

    公开(公告)日：1994-08-23

    申请号：US896051

    申请日：1992-06-09

    申请人： Paul L. Bolden ,  Michael E. Hayes

    发明人： Paul L. Bolden ,  Michael E. Hayes

    IPC分类号： B41N3/06 ,  C11D3/18 ,  C11D3/20 ,  C11D3/43 ,  C11D7/24 ,  C11D7/26 ,  C11D7/50 ,  C11D11/00 ,  C23G5/024 ,  C23G5/032 ,  G03F7/42 ,  H05K3/26 ,  B08B3/08

    CPC分类号： H05K3/26 ,  C11D11/0047 ,  C11D3/18 ,  C11D3/2093 ,  C11D3/43 ,  C11D7/5027 ,  C23G5/024 ,  C23G5/032 ,  G03F7/422 ,  C11D7/24 ,  C11D7/263 ,  C11D7/264 ,  C11D7/266 ,  H05K2203/0783

    摘要： Disclosed is an industrial cleaning process in which a contaminant comprising soldering flux and/or adhesive tape residue is removed from a substrate contaminated therewith. The process comprises the steps of contacting the substrate with a terpene-based cleaning composition which is substantially free of water-soluble organic material; removing the composition and solubilized contaminant from the substrate by contact with water having a temperature of about 70.degree. F. to about 140.degree. F. for a period of time of no longer than about 10 minutes to provide a substrate having a contamination rating of no greater than about 14 micrograms NaCl equivalent/square inch (MIL-P-28809A), and to thereby form a mixture comprising the composition, contaminant and water. The process also comprises separating the water from said mixture, the separated water being substantially free of water-soluble organic material and having a chemical oxygen demand of no greater than about 1,000 ppm.

    摘要翻译： 公开了一种工业清洗方法，其中包含焊剂和/或粘合带残留物的污染物从被污染的基底上除去。 该方法包括以下步骤：使基材与基本上不含水溶性有机材料的基于萜烯的清洁组合物接触; 通过与温度为约70°F至140°F的水接触，不要超过约10分钟的时间，从基材中除去组合物和溶解的污染物，以提供污染等级为无 大于约14微克NaCl当量/平方英寸（MIL-P-28809A），从而形成包含组合物，污染物和水的混合物。 该方法还包括从所述混合物中分离水，所分离的水基本上不含水溶性有机材料，并且化学需氧量不大于约1,000ppm。

    Process of cleaning soldering flux and/or adhesive tape with terpenet and monobasic ester
    7.
    发明授权
    Process of cleaning soldering flux and/or adhesive tape with terpenet and monobasic ester 失效
    清洁焊接和/或胶带的过程与TERPENET和单粒子

    公开(公告)号：US5120371A

    公开(公告)日：1992-06-09

    申请号：US620500

    申请日：1990-11-29

    申请人： Paul L. Bolden ,  Michael E. Hayes

    发明人： Paul L. Bolden ,  Michael E. Hayes

    IPC分类号： B08B3/08 ,  C11D3/18 ,  C11D3/20 ,  C11D3/43 ,  C11D7/24 ,  C11D7/26 ,  C11D7/50 ,  C11D11/00 ,  C23G5/024 ,  C23G5/032 ,  H05K3/26

    CPC分类号： C11D7/5027 ,  C11D11/0047 ,  C11D3/18 ,  C11D3/2093 ,  C11D3/43 ,  C23G5/024 ,  C23G5/032 ,  H05K3/26 ,  C11D7/24 ,  C11D7/263 ,  C11D7/264 ,  C11D7/266 ,  H05K2203/0783

    摘要： Disclosed is an industrial cleaning process in which a contaminant comprising soldering flux and/or adhesive tape residue is removed from a substrate contaminated therewith. The process comprises the steps of contacting the substrate with a terpene-based cleaning composition which is substantially free of water-soluble organic material; removing the composition and solubilized contaminant from the substrate by contact with water having a temperature of about 70.degree. F. to about 140.degree. F. for a period of time of no longer than about 10 minutes to provide a substrate having a contamination rating of no greater than about 14 micrograms NaCl equivalent/square inch (MIL-P-28809A), and to thereby form a mixture comprising the composition, contaminant and water. The process also comprises separating the water from said mixture, the separated water being substantially free of water-soluble organic material and having a chemical oxygen demand of no greater than about 1,000 ppm.

    摘要翻译： 公开了一种工业清洗方法，其中包含焊剂和/或粘合带残留物的污染物从被污染的基底上除去。 该方法包括以下步骤：使基材与基本上不含水溶性有机材料的基于萜烯的清洁组合物接触; 通过与温度为约70°F至140°F的水接触，不要超过约10分钟的时间，从基材中除去组合物和溶解的污染物，以提供污染等级为无 大于约14微克NaCl当量/平方英寸（MIL-P-28809A），从而形成包含组合物，污染物和水的混合物。 该方法还包括从所述混合物中分离水，所分离的水基本上不含水溶性有机材料，并且化学需氧量不大于约1,000ppm。