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公开(公告)号：USD523143S1
公开(公告)日：2006-06-13
申请号：US29223988
申请日：2005-02-10
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公开(公告)号：USD515742S1
公开(公告)日：2006-02-21
申请号：US29223995
申请日：2005-02-08
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公开(公告)号：USD560854S1
公开(公告)日：2008-01-29
申请号：US29223317
申请日：2005-02-07
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公开(公告)号：USD524441S1
公开(公告)日：2006-07-04
申请号：US29224909
申请日：2005-03-07
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公开(公告)号：US07278431B2
公开(公告)日：2007-10-09
申请号：US11073912
申请日：2005-03-07
申请人： Paul M. Anderson , Lisa F. Baumgarten , Antonette Bivona , John D. Butcher , Ingrid Yung-I Chen , Emily M. Cohen , Jeffery F. Feng , Stacey Leigh Grabiner , Jayne H. Lynch , Bryce G. Rutter , Heather S. Sopczynski
发明人： Paul M. Anderson , Lisa F. Baumgarten , Antonette Bivona , John D. Butcher , Ingrid Yung-I Chen , Emily M. Cohen , Jeffery F. Feng , Stacey Leigh Grabiner , Jayne H. Lynch , Bryce G. Rutter , Heather S. Sopczynski
IPC分类号： A45D29/18
CPC分类号： A61B17/54 , A61B2017/320004
摘要： A skin grooming device comprising a planar surface for removable attachment to a stationary surface, having affixed thereto an undulating abrasive block for use in abrading rough, dead, or dry skin from keratinous surfaces and a method for grooming skin using the device.
摘要翻译： 一种皮肤修饰装置，其包括用于可移除地附接到固定表面的平坦表面，其上固定有用于从角质表面研磨粗糙，死皮或干燥皮肤的起伏磨料块和使用该装置修护皮肤的方法。
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公开(公告)号：USD530451S1
公开(公告)日：2006-10-17
申请号：US29223316
申请日：2005-02-07
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公开(公告)号：USD530452S1
公开(公告)日：2006-10-17
申请号：US29225384
申请日：2005-02-28
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公开(公告)号：US06172412B2
公开(公告)日：2001-01-09
申请号：US09220133
申请日：1998-12-23
申请人： Deborah S. Wein , Paul M. Anderson , Alan W. Lindner , Martin Goetz , Joseph Babiarz , Timothy Going
发明人： Deborah S. Wein , Paul M. Anderson , Alan W. Lindner , Martin Goetz , Joseph Babiarz , Timothy Going
IPC分类号： H01L2940
CPC分类号： H01L21/67121 , H01L23/66 , H01L2223/6627 , H01L2223/6633 , H01L2924/0002 , H01L2924/19032 , H01L2924/19039 , H01L2924/3011 , H01L2924/00
摘要： A high frequency microelectronic package suitable for high-frequency microelectronic devices includes a base which is at least partially conductive and attached to an RF substrate with a cavity formed at its center. The base may be metal or ceramic with a metal layer deposited thereon. A pattern of conductive paths for providing interconnection from the inside to the outside of the package are formed on the surface of the RF substrate. These conductive patterns are designed to have a constant impedance when uncovered, regardless of the dielectric property of the material used to cover the conductive patterns. Namely, a sealing cap or a lid, made from a variety of dielectric materials, may be attached to the RF substrate by a non-conductive adhesive, such as a polymer adhesive or low temperature seal glass, to seal the package once the microelectronic device has been mounted inside.
摘要翻译： 适用于高频微电子器件的高频微电子封装包括至少部分导电并且附接到RF衬底的基底，其中心形成有空腔。 基底可以是金属或陶瓷，其上沉积有金属层。 在RF基板的表面上形成用于从封装的内部向外部提供互连的导电路径的图案。 这些导电图案被设计为当未覆盖时具有恒定的阻抗，而与用于覆盖导电图案的材料的介电性质无关。 也就是说，由各种介电材料制成的密封盖或盖子可以通过非导电粘合剂（例如聚合物粘合剂或低温密封玻璃）附接到RF基板上，以密封包装，一旦微电子器件 已经安装在里面
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公开(公告)号：US20100025529A1
公开(公告)日：2010-02-04
申请号：US12440662
申请日：2007-09-11
CPC分类号： B29C66/4344 , B29C53/821 , B29C53/822 , B29C65/562 , B29C65/60 , B29C66/1122 , B29C66/1222 , B29C66/1224 , B29C66/43441 , B29C66/71 , B29C66/721 , B29C66/7212 , B29C66/72141 , B29C70/30 , B29C70/48 , B29K2063/00 , B29K2105/0845 , B29K2105/108 , B29K2307/00 , B29K2309/08 , B29K2707/04 , B29K2709/08 , B29L2031/3082 , B29L2031/3085 , B29L2031/766 , B64C1/065 , Y10T29/49616 , B29K2307/04
摘要： A rib post (10) has a hollow substantially triangular cross-section comprising composite material. The rib post (10) can form a structural member to join two adjacently placed components together, for example a spar and internal rib in a wing of an aircraft. The rib post (10) can be formed from first (12), second (14) and third (16) walls. The first wall (12) can abut a surface of one component and the second wall (14) can abut a surface of a second component. The first and second walls (12, 14) can be attached to the respective components, such as a rib and spar, to join them together. The third wall (16) joins together the first and second walls (12, 14) to form the hollow triangular section.
摘要翻译： 肋柱（10）具有包括复合材料的中空的基本上三角形的横截面。 肋柱（10）可以形成结构构件以将两个相邻放置的部件连接在一起，例如飞行器翼中的翼梁和内肋。 肋柱（10）可以由第一（12），第二（14）和第三（16）壁形成。 第一壁（12）可以邻接一个部件的表面，第二壁（14）可以抵靠第二部件的表面。 第一和第二壁（12,14）可以附接到各个部件，例如肋和翼梁，以将它们连接在一起。 第三壁（16）将第一和第二壁（12,14）连接在一起以形成中空三角形部分。
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公开(公告)号：US5753972A
公开(公告)日：1998-05-19
申请号：US645729
申请日：1996-05-14
CPC分类号： H01L21/67121 , H01L23/66 , H01L2924/0002 , H01L2924/15787 , H01L2924/15788 , H01L2924/1579 , H01L2924/16152 , H01L2924/1616 , H01L2924/1617 , H01L2924/167 , H01L2924/16787 , H01L2924/16788 , H01L2924/1679 , H01L2924/3011
摘要： A microelectronic package suitable for high-frequency microelectronic devices includes a base which is at least partially conductive attached to an RF substrate with a cavity formed at its center and a pattern of conductive paths for providing interconnection from the inside to the outside of the package. The base may be metal or ceramic with a metal layer deposited thereon. A sealing cap is attached to the RF substrate by a non-conductive adhesive, such as a polymer adhesive or low temperature seal glass, to seal the package once the microelectronic device has been mounted inside.
摘要翻译： 适用于高频微电子器件的微电子封装包括：至少部分导电的基底，其附着到具有在其中心形成的空腔的RF衬底和用于提供从封装的内部到外部的互连的导电路径的图案。 基底可以是金属或陶瓷，其上沉积有金属层。 通过非导电粘合剂（例如聚合物粘合剂或低温密封玻璃）将密封帽附接到RF基板上，以在微电子器件安装在内部之后密封封装。
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