公开(公告)号：US20050006115A1

公开(公告)日：2005-01-13

申请号：US10740496

申请日：2003-12-22

申请人： Pei-Pei Ding ,  Chang-Chi Lee ,  Jao-Ching Lin

发明人： Pei-Pei Ding ,  Chang-Chi Lee ,  Jao-Ching Lin

IPC分类号： B81B1/00 ,  F25D17/02 ,  F28D15/02 ,  H01L23/473 ,  H05K1/02 ,  H05K7/20 ,  H01B7/42

CPC分类号： H01L23/473 ,  F28D15/0266 ,  F28D2015/0225 ,  F28F2210/02 ,  H01L2924/0002 ,  H05K1/0272 ,  H01L2924/00

摘要： A heat dissipating microdevice includes a board, a fluid microsystem, and a coolant. The board includes an insulator layer that has first and second surfaces, a conductor layer formed on the first surface, and a cover member disposed on the second surface. The fluid microsystem is formed in the insulator layer of the board, and includes first and second micro-channel structures, and first and second micro-conduit structures that permit fluid communication between the first and second micro-channel structures. The coolant is contained in the fluid microsystem, and flows from the second micro-channel structure to the first micro-channel structure through the first micro-conduit structure, and from the first micro-channel structure back to the second micro-channel structure through the second micro-conduit structure.

摘要翻译： 散热微型装置包括板，流体微系统和冷却剂。 板包括具有第一表面和第二表面的绝缘体层，形成在第一表面上的导体层和设置在第二表面上的盖构件。 流体微系统形成在板的绝缘体层中，并且包括第一和第二微通道结构以及允许第一和第二微通道结构之间的流体连通的第一和第二微管结构。 冷却剂被包含在流体微系统中，并且通过第一微通道结构从第二微通道结构流动到第一微通道结构，并且从第一微通道结构返回到第二微通道结构 第二个微管道结构。

公开(公告)号：US07110258B2

公开(公告)日：2006-09-19

申请号：US10740496

申请日：2003-12-22

申请人： Pei-Pei Ding ,  Chang-Chi Lee ,  Jao-Ching Lin

发明人： Pei-Pei Ding ,  Chang-Chi Lee ,  Jao-Ching Lin

IPC分类号： H05K7/20

CPC分类号： H01L23/473 ,  F28D15/0266 ,  F28D2015/0225 ,  F28F2210/02 ,  H01L2924/0002 ,  H05K1/0272 ,  H01L2924/00

摘要： A heat dissipating microdevice includes a board, a fluid microsystem, and a coolant. The board includes an insulator layer that has first and second surfaces, a conductor layer formed on the first surface, and a cover member disposed on the second surface. The fluid microsystem is formed in the insulator layer of the board, and includes first and second micro-channel structures, and first and second micro-conduit structures that permit fluid communication between the first and second micro-channel structures. The coolant is contained in the fluid microsystem, and flows from the second micro-channel structure to the first micro-channel structure through the first micro-conduit structure, and from the first micro-channel structure back to the second micro-channel structure through the second micro-conduit structure.

摘要翻译： 散热微型装置包括板，流体微系统和冷却剂。 板包括具有第一表面和第二表面的绝缘体层，形成在第一表面上的导体层和设置在第二表面上的盖构件。 流体微系统形成在板的绝缘体层中，并且包括第一和第二微通道结构以及允许第一和第二微通道结构之间的流体连通的第一和第二微管结构。 冷却剂被包含在流体微系统中，并且通过第一微通道结构从第二微通道结构流动到第一微通道结构，并且从第一微通道结构返回到第二微通道结构 第二个微管道结构。

公开(公告)号：US20060225908A1

公开(公告)日：2006-10-12

申请号：US11422184

申请日：2006-06-05

申请人： Pei-Pei Ding ,  Chang-Chi Lee ,  Jao-Ching Lin

发明人： Pei-Pei Ding ,  Chang-Chi Lee ,  Jao-Ching Lin

IPC分类号： H01B7/42

CPC分类号： H01L23/473 ,  F28D15/0266 ,  F28D2015/0225 ,  F28F2210/02 ,  H01L2924/0002 ,  H05K1/0272 ,  H01L2924/00

摘要： A heat dissipating microdevice is made from comprising the steps of: a board including an insulator layer having a first and facing second surfaces and a conductor layer on the first surface by forming in the layer a hole that extends between the surfaces to form a fluid microsystem including: first and second micro-channel structures disposed respectively in first and second areas of the board and bounded by the layer, and first and second micro-conduit structures that permit fluid communication between the micro-channel structures. The first micro-conduit structure has a first end in fluid communication with the second micro-channel structure and a second end section in fluid communication with the first micro-channel structure. The second micro-conduit structure has a first end section in fluid communication with the first micro-channel structure and a second end section in fluid communication with the second micro-channel structure. A cover is put on the second surface.

摘要翻译： 散热微型装置包括以下步骤：通过在所述层中形成在所述表面之间延伸的孔以形成流体微系统，所述板包括具有第一和相对的第二表面的绝缘体层和所述第一表面上的导体层 包括：分别设置在板的第一和第二区域中并且被层限定的第一和第二微通道结构以及允许微通道结构之间的流体连通的第一和第二微管结构。 第一微导管结构具有与第二微通道结构流体连通的第一端和与第一微通道结构流体连通的第二端部。 第二微导管结构具有与第一微通道结构流体连通的第一端段和与第二微通道结构流体连通的第二端段。 盖子放在第二个表面上。

公开(公告)号：US20060213056A1

公开(公告)日：2006-09-28

申请号：US11219562

申请日：2005-09-02

申请人： Jao-Ching Lin ,  Pei-Pei Ding ,  Hsiu-Wei Yang ,  Wen-Hwa Yu ,  Yen-Wen Chen

发明人： Jao-Ching Lin ,  Pei-Pei Ding ,  Hsiu-Wei Yang ,  Wen-Hwa Yu ,  Yen-Wen Chen

IPC分类号： B23P15/26

CPC分类号： H01L21/4878 ,  B23P15/26 ,  B23P2700/10 ,  F28D15/0233 ,  F28D15/0283 ,  F28D15/04 ,  H01L23/427 ,  H01L2924/0002 ,  Y10T29/49353 ,  Y10T29/49359 ,  Y10T29/49366 ,  Y10T29/53113 ,  Y10T29/53122 ,  H01L2924/00

摘要： A manufacturing system for processing a container body into a heat dissipating device includes: a support for supporting the container body thereon; an elastically deformable member covering a periphery of an opening in an upper wall of the container body and defining a cavity in fluid communication with interior of the container body through the opening; a vacuuming device connected to the elastically deformable member for vacuuming the inner space; a working fluid-loading device connected to the elastically deformable member for filling a predetermined amount of the working fluid into the container body; a depressing device including opposite upper and lower pressing members; and a driving mechanism for driving movement of at least one of the upper and lower pressing members.

摘要翻译： 一种用于将容器主体加工成散热装置的制造系统包括：用于在其上支撑容器主体的支撑件; 一个可弹性变形的构件，其覆盖在容器主体的上壁中的开口的周边，并且限定通过开口与容器主体的内部流体连通的空腔; 连接到所述可弹性变形构件以抽吸所述内部空间的抽真空装置; 连接到所述可弹性变形构件的工作流体装载装置，用于将预定量的所述工作流体填充到所述容器主体中; 包括相对的上部和下部按压构件的按压装置; 以及用于驱动上部和下部按压构件中的至少一个的运动的驱动机构。

公开(公告)号：US07461450B2

公开(公告)日：2008-12-09

申请号：US11219001

申请日：2005-09-02

申请人： Jao-Ching Lin ,  Pei-Pei Ding ,  Hsiu-Wei Yang ,  Wen-Hwa Yu ,  Yen-Wen Chen

发明人： Jao-Ching Lin ,  Pei-Pei Ding ,  Hsiu-Wei Yang ,  Wen-Hwa Yu ,  Yen-Wen Chen

IPC分类号： B23P6/00

CPC分类号： H01L23/427 ,  B23P15/26 ,  B23P2700/10 ,  F28D15/0233 ,  F28D15/0283 ,  F28D15/046 ,  H01L21/4882 ,  H01L2924/0002 ,  Y10T29/49353 ,  H01L2924/00

摘要： A method for making a heat dissipating device includes the steps of: preparing a container body that has a fluid passage and opposite upper and lower walls, the fluid passage being in fluid communication with an inner space in the container body; vacuuming the inner space through the fluid passage; filling the inner space with a predetermined amount of a working fluid through the fluid passage; and depressing a wall portion of a selected one of the upper and lower walls in such a manner that the depressed wall portion is deformed toward the other of the upper and lower walls so as to form a depression in the selected one of the upper and lower walls, and so as to form a sealing mechanism that functions to isolate the fluid passage from the inner space.

摘要翻译： 制造散热装置的方法包括以下步骤：制备具有流体通道和相对的上壁和下壁的容器主体，所述流体通道与所述容器主体中的内部空间流体连通; 通过流体通道抽吸内部空间; 通过所述流体通道用预定量的工作流体填充所述内部空间; 并且以使得所述凹陷壁部分朝向所述上壁和下壁中的另一个的方式变形的方式按压所述上壁和所述下壁中的所选一个的壁部分，以在所述上壁和下壁中的所选择的一个中形成凹陷 壁，并且形成用于将流体通道与内部空间隔离的密封机构。

公开(公告)号：US20060213062A1

公开(公告)日：2006-09-28

申请号：US11219001

申请日：2005-09-02

申请人： Jao-Ching Lin ,  Pei-Pei Ding ,  Hsiu-Wei Yang ,  Wen-Hwa Yu ,  Yen-Wen Chen

发明人： Jao-Ching Lin ,  Pei-Pei Ding ,  Hsiu-Wei Yang ,  Wen-Hwa Yu ,  Yen-Wen Chen

IPC分类号： B23P6/00

CPC分类号： H01L23/427 ,  B23P15/26 ,  B23P2700/10 ,  F28D15/0233 ,  F28D15/0283 ,  F28D15/046 ,  H01L21/4882 ,  H01L2924/0002 ,  Y10T29/49353 ,  H01L2924/00

摘要： A method for making a heat dissipating device includes the steps of: preparing a container body that has a fluid passage and opposite upper and lower walls, the fluid passage being in fluid communication with an inner space in the container body; vacuuming the inner space through the fluid passage; filling the inner space with a predetermined amount of a working fluid through the fluid passage; and depressing a wall portion of a selected one of the upper and lower walls in such a manner that the depressed wall portion is deformed toward the other of the upper and lower walls so as to form a depression in the selected one of the upper and lower walls, and so as to form a sealing mechanism that functions to isolate the fluid passage from the inner space.

摘要翻译： 制造散热装置的方法包括以下步骤：制备具有流体通道和相对的上壁和下壁的容器主体，所述流体通道与所述容器主体中的内部空间流体连通; 通过流体通道抽吸内部空间; 通过所述流体通道用预定量的工作流体填充所述内部空间; 并且以使得所述凹陷壁部分朝向所述上壁和下壁中的另一个的方式变形的方式按压所述上壁和所述下壁中的所选一个的壁部分，以在所述上壁和下壁中的所选择的一个中形成凹陷 壁，并且形成用于将流体通道与内部空间隔离的密封机构。

公开(公告)号：US07464463B2

公开(公告)日：2008-12-16

申请号：US11219557

申请日：2005-09-02

申请人： Jao-Ching Lin ,  Pei-Pei Ding ,  Hsiu-Wei Yang ,  Wen-Hwa Yu ,  Yen-Wen Chen

发明人： Jao-Ching Lin ,  Pei-Pei Ding ,  Hsiu-Wei Yang ,  Wen-Hwa Yu ,  Yen-Wen Chen

IPC分类号： B23P6/00

CPC分类号： H01L23/427 ,  B23P15/26 ,  B23P2700/10 ,  F28D15/0233 ,  F28D15/0283 ,  F28D15/046 ,  H01L21/4882 ,  H01L2924/0002 ,  Y10T29/49353 ,  H01L2924/00

摘要： A method for making a heat dissipating device includes the steps of: mounting an elastically deformable member on a container body in such a manner that the elastically deformable member covers a periphery of an opening in the container body and that the elastically deformable member cooperates with the container body to define a cavity in fluid communication with an inner space in the container body through the opening; vacuuming the inner space in such a manner that air in the inner space is drawn through the opening and the cavity to the outside of the container body; filling the inner space with a predetermined amount of a working fluid through the opening and the cavity; and forming a sealing mechanism that functions to isolate the inner space from the opening.

摘要翻译： 一种制造散热装置的方法包括以下步骤：将可弹性变形的部件安装在容器本体上，使得可弹性变形的部件覆盖容器主体中的开口的周边，并且可弹性变形的部件与 容器体以限定通过开口与容器主体中的内部空间流体连通的空腔; 以使得内部空间中的空气通过开口和空腔被抽吸到容器主体的外部的方式抽吸内部空间; 通过所述开口和所述空腔用预定量的工作流体填充所述内部空间; 以及形成用于将内部空间与开口隔离的密封机构。

公开(公告)号：US07267755B2

公开(公告)日：2007-09-11

申请号：US10670190

申请日：2003-09-26

申请人： Jao-Ching Lin ,  Pei-Pei Ding

发明人： Jao-Ching Lin ,  Pei-Pei Ding

IPC分类号： C25D1/00 ,  H05K1/02

CPC分类号： B81C1/0015 ,  C25D1/08 ,  C25D5/022 ,  H05K1/0272 ,  H05K3/0017 ,  H05K3/002 ,  H05K3/0026 ,  H05K3/4092 ,  H05K3/423 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/09981 ,  H05K2203/0554 ,  H05K2203/0733 ,  H05K2203/1184

摘要： A method of making a microstructure includes the steps of providing a circuit board that includes a dielectric layer and a conductor layer formed on the dielectric layer, forming a metal structure on the circuit board such that the metal structure extends through the dielectric layer, and removing at least a portion of the dielectric layer adjacent to the conductor layer and the metal structure to result in the microstructure.

摘要翻译： 一种制造微结构的方法包括以下步骤：提供一种电路板，该电路板包括介电层和形成在电介质层上的导体层，在电路板上形成金属结构，使金属结构延伸穿过电介质层， 电介质层的至少一部分与导体层相邻并且金属结构导致微结构。

公开(公告)号：US20050000816A1

公开(公告)日：2005-01-06

申请号：US10670190

申请日：2003-09-26

申请人： Jao-Ching Lin ,  Pei-Pei Ding

发明人： Jao-Ching Lin ,  Pei-Pei Ding

IPC分类号： B81C1/00 ,  B81B3/00 ,  C23F1/02 ,  C25D1/08 ,  C25D5/02 ,  H05K3/00 ,  H05K3/40 ,  H05K3/42

CPC分类号： B81C1/0015 ,  C25D1/08 ,  C25D5/022 ,  H05K1/0272 ,  H05K3/0017 ,  H05K3/002 ,  H05K3/0026 ,  H05K3/4092 ,  H05K3/423 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/09981 ,  H05K2203/0554 ,  H05K2203/0733 ,  H05K2203/1184

摘要： A method of making a microstructure includes the steps of providing a circuit board that includes a dielectric layer and a conductor layer formed on the dielectric layer, forming a metal structure on the circuit board such that the metal structure extends through the dielectric layer, and removing at least a portion of the dielectric layer adjacent to the conductor layer and the metal structure to result in the microstructure.

摘要翻译： 一种制造微结构的方法包括以下步骤：提供一种电路板，该电路板包括介电层和形成在电介质层上的导体层，在电路板上形成金属结构，使金属结构延伸穿过电介质层， 电介质层的至少一部分与导体层相邻并且金属结构导致微结构。

公开(公告)号：US07721439B2

公开(公告)日：2010-05-25

申请号：US11219562

申请日：2005-09-02

申请人： Jao-Ching Lin ,  Pei-Pei Ding ,  Hsiu-Wei Yang ,  Wen-Hwa Yu ,  Yen-Wen Chen

发明人： Jao-Ching Lin ,  Pei-Pei Ding ,  Hsiu-Wei Yang ,  Wen-Hwa Yu ,  Yen-Wen Chen

IPC分类号： B23P15/26 ,  B21D39/06 ,  B21D53/00

CPC分类号： H01L21/4878 ,  B23P15/26 ,  B23P2700/10 ,  F28D15/0233 ,  F28D15/0283 ,  F28D15/04 ,  H01L23/427 ,  H01L2924/0002 ,  Y10T29/49353 ,  Y10T29/49359 ,  Y10T29/49366 ,  Y10T29/53113 ,  Y10T29/53122 ,  H01L2924/00

摘要： A manufacturing system for processing a container body into a heat dissipating device includes: a support for supporting the container body thereon; an elastically deformable member covering a periphery of an opening in an upper wall of the container body and defining a cavity in fluid communication with interior of the container body through the opening; a vacuuming device connected to the elastically deformable member for vacuuming the inner space; a working fluid-loading device connected to the elastically deformable member for filling a predetermined amount of the working fluid into the container body; a depressing device including opposite upper and lower pressing members; and a driving mechanism for driving movement of at least one of the upper and lower pressing members.

摘要翻译： 一种用于将容器主体加工成散热装置的制造系统包括：用于在其上支撑容器主体的支撑件; 一个可弹性变形的构件，其覆盖在容器主体的上壁中的开口的周边，并且限定通过开口与容器本体的内部流体连通的空腔; 连接到所述可弹性变形构件以抽吸所述内部空间的抽真空装置; 连接到所述可弹性变形构件的工作流体装载装置，用于将预定量的所述工作流体填充到所述容器主体中; 包括相对的上部和下部按压构件的按压装置; 以及用于驱动上部和下部按压构件中的至少一个的运动的驱动机构。