摘要:
Apparatus and methods are provided for packaging IC (integrated circuit) chips to enable both optical access to the back side of an IC chip and electrical access to the front side of the IC chip.
摘要:
Apparatus and methods are provided for packaging IC (integrated circuit) chips to enable both optical access to the back side of an IC chip and electrical access to the front side of the IC chip.
摘要:
Optical triggering system and method for synchronizing a test of an integrated circuit chip with its operation. An optical triggering system includes a testing mechanism, such as a PICA testing mechanism, for testing an integrated circuit chip. An optical trigger mechanism generates an optical trigger signal for synchronizing a test of the integrated circuit chip with its operation. The optical trigger mechanism provides an optical trigger signal having reduced jitter and a higher frequency rate than an electrical trigger signal resulting in a more accurate test of the integrated circuit chip.
摘要:
A system and method for localization and resolvability of an integrated circuit includes selecting one or more electrical stimuli to be applied to a device under test such that the electrical stimuli are chosen to provide a baseline image and a distinguishing image effect as a result of the chosen stimuli when applied to the device under test. The one or more electrical stimuli are applied to the device under test. Emissions from the device under test are measured to provide a measurement data set from the one or more electrical stimuli using one or more measurement tools for collecting the baseline image and the distinguishing image effect. The measurement data set is analyzed to localize and evaluate circuit structures by comparing the baseline image and the distinguishing image effect.
摘要:
Methods for reliability testing include applying a stress voltage to a device under test (DUT); measuring a leakage current across the DUT; triggering measurement of optical emissions from the DUT based on the timing of the measurement of the leakage current; and correlating measurements of the leakage current with measurements of the optical emissions to determine a time and location of a defect occurrence within the DUT by locating instances of increased noise in the leakage current that correspond in time with instances of increased optical emissions.
摘要:
Systems for reliability testing include a picometer configured to measure a leakage current across a device under test (DUT); a camera configured to measure optical emissions from the DUT based on a timing of the measurement of the leakage current; and a test system configured to apply a stress voltage to the DUT and to correlate the leakage current with the optical emissions using a processor to determine a time and location of a defect occurrence within the DUT by locating instances of increased noise in the leakage current that correspond in time with instances of increased optical emissions.
摘要:
A background process installs a system hook for message interception of integrated circuit chip layout display software. A call message is intercepted through the system hook, and current layout coordinates are read from the integrated circuit chip layout display software. A representation of the current layout coordinates is entered into tool control software configured to control a physical tool for analyzing integrated circuits, and the physical tool is controlled with the tool control software. In an “inverse” approach, a background process is used to install at least one system hook for message interception of tool control software configured to control a physical tool for analyzing integrated circuits, and a call message is intercepted through the system hook. Current coordinates are read from the tool control software. A representation of the current coordinates is entered into integrated circuit chip layout display software, and at least a portion of an integrated circuit layout is displayed.
摘要:
Methods for reliability testing include applying a stress voltage to a device under test (DUT); measuring a leakage current across the DUT; triggering measurement of optical emissions from the DUT based on the timing of the measurement of the leakage current; and correlating measurements of the leakage current with measurements of the optical emissions to determine a time and location of a defect occurrence within the DUT by locating instances of increased noise in the leakage current that correspond in time with instances of increased optical emissions.
摘要:
A method for adjusting timing of multiple cores within an integrated circuit includes selecting a reference core and a target core from among a plurality of cores of an integrated circuit. Self-test circuitry of the integrated circuit is used to generate a response signature for each of the reference core and the target core. The response signature of the reference core is compared with the response signature of the target core. A local clock buffer of the target core is adjusted until the response signature of the target core matches the response signature of the reference core.
摘要:
A method, system and computer program product are disclosed for creating an image from a device. In one embodiment, the method comprises acquiring first and second images from the device, said first and second images having overlapping portions, and estimating said overlapping portions to obtain an approximate shift amount to align approximately said first and second images. This method further comprises analyzing the overlapping portions, using a defined cross-correlation algorithm, to calculate a precise shift amount to align the first and second images; and using said precise shift amount to join the first and second images together. In one embodiment, an optical system is used to acquire the images, a stage is used to move either the device or the optical system to acquire the first and second images, and the estimating includes using movement of the stage to estimate the overlapping areas.