摘要:
An assembly, apparatus and method for fabricating a structural element of a hard disk drive air bearing. The method and apparatus provide an improved protective layer, an improved structural element consisting of a single layer of structural material, and a method consisting of applying the improved protective layer, applying a uniform layer of structural material, applying a resist layer, etching the structural material layer, and removing the resist layer.
摘要:
A method of forming a pole tip topography associated with an air bearing surface (ABS) of a hard disk drive slider is disclosed. The method etches an exposed pole tip region of an ABS at a first angle with respect to the ABS to remove an irregularity from the exposed pole tip region and to flatten the exposed pole tip region. The exposed pole tip region lacks a photo-resist layer. The method also includes etching the flattened exposed pole tip region of the ABS at a second angle with respect to the ABS to form a recession with reference to the ABS.
摘要:
A hard disk drive slider comprises an overcoat layer, which covers an air-bearing surface of the slider. The overcoat covers an exposed surface of a tunneling magnetoresistance transducer. An adhesion layer is coupled with the overcoat layer and the air-bearing surface. The adhesion layer comprises a compound of nitrogen. The compound of nitrogen reduces noise in read data from the tunneling magnetoresistance transducer.
摘要:
A hard disk drive slider comprises an overcoat layer, which covers an air-bearing surface of the slider. The overcoat covers an exposed surface of a tunneling magnetoresistance transducer. An adhesion layer is coupled with the overcoat layer and the air-bearing surface. The adhesion layer comprises a compound of nitrogen. The compound of nitrogen reduces noise in read data from the tunneling magnetoresistance transducer.
摘要:
An assembly, apparatus and method for fabricating a structural element of a hard disk drive air bearing. The method and apparatus provide an improved protective layer, an improved structural element consisting of a single layer of structural material, and a method consisting of applying the improved protective layer, applying a uniform layer of structural material, applying a resist layer, etching the structural material layer, and removing the resist layer.
摘要:
Embodiments of the present invention are directed to a frame component of a pallet assembly. In one embodiment, the frame comprises a plurality of arms for retaining at least one carrier component. The frame further comprises at least one spring disposed upon one of the plurality of arms. The spring for applying pressure upon the carrier.
摘要:
Embodiments of the present invention pertain to forming a head with reduced pole tip recession. According to one embodiment, a pole tip element is formed from a platinum containing material. During diamond like carbon (DLC) processing, hydrogen and hydrogen containing compounds are removed from a vacuum plasma processing environment that contains the head so that an amount of material that is removed from the pole tip element and other non-platinum containing elements associated with the head are approximately the same.
摘要:
Embodiments of the present invention are directed to a frame component of a pallet assembly. In one embodiment, the frame comprises a plurality of arms for retaining at least one carrier component. The frame further comprises at least one spring disposed upon one of the plurality of arms. The spring for applying pressure upon the carrier.
摘要:
Embodiments of the present invention are directed to a pallet assembly which facilitates direct cooling of the wafer carrier. In one embodiment, the pallet assembly comprises a frame which holds at least one carrier of a component. The pallet assembly further comprises a tray which is operable for being mechanically coupled with the frame. The tray comprises at least one discreet region which corresponds with the carrier when the tray is coupled with the frame. In embodiments of the present invention, the discreet region comprises at least one hole extending through the tray for permitting a coolant medium to dissipate heat from the carrier.
摘要:
Embodiments of the present invention are directed to a pallet assembly which facilitates direct cooling of the wafer carrier. In one embodiment, the pallet assembly comprises a frame which holds at least one carrier of a component. The pallet assembly further comprises a tray which is operable for being mechanically coupled with the frame. The tray comprises at least one discreet region which corresponds with the carrier when the tray is coupled with the frame. In embodiments of the present invention, the discreet region comprises at least one hole extending through the tray for permitting a coolant medium to dissipate heat from the carrier.