Abstract:
Carbon nanotube-based structures and methods for removing heat from solid-state devices are disclosed. In one embodiment, a copper substrate has thermal interface materials on top of front and back surfaces of the copper substrate. Each thermal interface material (TIM) comprises a layer of carbon nanotubes and a filler material located between the carbon nanotubes. The summation of the thermal resistance of the copper substrate, the bulk thermal resistance of each TIM, the contact resistance between each TIM and the copper substrate, the contact resistance between one TIM and a solid-state device, and the contact resistance between the other TIM and a heat conducting surface has a value of 0.06 cm2K/W or less.
Abstract:
A dual collimation deposition apparatus and method are disclosed in which the dual collimation apparatus includes at least a long-throw collimator in combination with one or more physical collimators. A new physical collimator and shield design are also disclosed for improved process uniformity and increased equipment productivity.
Abstract:
In a heat exchanger used especially as an exhaust heat exchanger, provision is made for tube sheets, the tubes of a tube bundle, and a housing to be shaped from stainless steel sheets. The tube sheets are formed as deep-drawn and stamped parts, each of which has a circumferential wall that projects outward beyond the ends of the tubes in the tube bundle. The walls are welded to the housing, and each of the walls is abutted by a diffuser.