公开(公告)号：USD768661S1

公开(公告)日：2016-10-11

申请号：US29475195

申请日：2013-12-01

申请人： Matthew McRae ,  Peter Schwartz ,  Polly Elaine Stecyk

设计人： Matthew McRae ,  Peter Schwartz ,  Polly Elaine Stecyk

公开(公告)号：US08080871B2

公开(公告)日：2011-12-20

申请号：US12177815

申请日：2008-07-22

申请人： Carlos Dangelo ,  Ephraim Suhir ,  Subrata Dey ,  Barbara Wacker ,  Yuan Xu ,  Arthur Boren ,  Darin Olsen ,  Yi Zhang ,  Peter Schwartz ,  Bala Padmakumar

发明人： Carlos Dangelo ,  Ephraim Suhir ,  Subrata Dey ,  Barbara Wacker ,  Yuan Xu ,  Arthur Boren ,  Darin Olsen ,  Yi Zhang ,  Peter Schwartz ,  Bala Padmakumar

IPC分类号： H01L23/34

CPC分类号： B82Y10/00 ,  H01L23/373 ,  H01L23/473 ,  H01L25/0652 ,  H01L2224/45015 ,  H01L2224/45147 ,  H01L2924/00014 ,  Y10S977/742 ,  Y10S977/762 ,  H01L2224/48 ,  H01L2924/20752

摘要： One aspect of the invention includes a copper substrate; a catalyst on top of the copper substrate surface; and a thermal interface material that comprises a layer containing carbon nanotubes that contacts the catalyst. The carbon nanotubes are oriented substantially perpendicular to the surface of the copper substrate. A Raman spectrum of the layer containing carbon nanotubes has a D peak at ˜1350 cm−1 with an intensity ID, a G peak at ˜1585 cm−1 with an intensity IG, and an intensity ratio ID/IG of less than 0.7 at a laser excitation wavelength of 514 nm. The thermal interface material has: a bulk thermal resistance, a contact resistance at an interface between the thermal interface material and the copper substrate, and a contact resistance at an interface between the thermal interface material and a solid-state device. A summation of these resistances has a value of 0.06 cm2K/W or less.

摘要翻译： 本发明的一个方面包括铜基板; 在铜基材表面上的催化剂; 以及包含与催化剂接触的含有碳纳米管的层的热界面材料。 碳纳米管的取向基本上垂直于铜基底的表面。 含有碳纳米管的层的拉曼光谱在〜1350cm -1处具有强度为1D，在〜1585cm -1处具有强度IG的G峰和强度比ID / IG小于0.7的D峰 激光激发波长为514nm。 热界面材料具有体热阻，热界面材料和铜基底之间的界面处的接触电阻以及热界面材料和固态器件之间的界面处的接触电阻。 这些电阻的相加值为0.06cm 2 / W以下。

公开(公告)号：USD649530S1

公开(公告)日：2011-11-29

申请号：US29384615

申请日：2011-02-01

申请人： Scott McManigal ,  Wesley Millora ,  Matthew McRae ,  Peter Schwartz

设计人： Scott McManigal ,  Wesley Millora ,  Matthew McRae ,  Peter Schwartz

公开(公告)号：US20080131722A1

公开(公告)日：2008-06-05

申请号：US11749126

申请日：2007-05-15

申请人： Ephraim Suhir ,  Subrata Dey ,  Barbara Wacker ,  Peter Schwartz

发明人： Ephraim Suhir ,  Subrata Dey ,  Barbara Wacker ,  Peter Schwartz

IPC分类号： B32B15/04 ,  H05K3/00

CPC分类号： H01L23/3735 ,  B32B7/03 ,  B32B15/04 ,  B32B15/20 ,  B32B2255/06 ,  B32B2255/20 ,  B32B2264/108 ,  B32B2307/30 ,  B32B2457/00 ,  C23C16/27 ,  C23C28/021 ,  C23C28/023 ,  C23C28/028 ,  C23C28/322 ,  C23C28/34 ,  C23C28/345 ,  C23C28/36 ,  H01L21/4871 ,  H01L23/373 ,  H01L24/29 ,  H01L24/32 ,  H01L33/641 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/29193 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/19043 ,  H01L2924/351 ,  H01S5/02476 ,  Y10T428/125 ,  Y10T428/12583 ,  Y10T428/1259 ,  Y10T428/12611 ,  Y10T428/12625 ,  H01L2924/00014 ,  H01L2924/00

摘要： One embodiment includes: a copper substrate; a catalyst on top of a single surface of the copper substrate; and a thermal interface material on top of the single surface of the copper substrate. The thermal interface material comprises: a layer of carbon nanotubes that contacts the catalyst, and a filler material located between the carbon nanotubes. The carbon nanotubes are oriented substantially perpendicular to the single surface of the copper substrate. The thermal interface material has: a bulk thermal resistance, a contact resistance between the thermal interface material and the copper substrate, and a contact resistance between the thermal interface material and a solid-state device. The summation of the bulk thermal resistance, the contact resistance between the thermal interface material and the copper substrate, and the contact resistance between the thermal interface material and the solid-state device has a value of 0.06 cm2K/W or less.

摘要翻译： 一个实施例包括：铜基板; 在铜基材的单个表面的顶部上的催化剂; 以及在铜衬底的单个表面的顶部上的热界面材料。 热界面材料包括：与催化剂接触的碳纳米管层和位于碳纳米管之间的填料。 碳纳米管的取向基本上垂直于铜基底的单个表面。 热界面材料具有体积热阻，热界面材料和铜基底之间的接触电阻以及热界面材料和固态器件之间的接触电阻。 体热阻，热界面材料和铜基底之间的接触电阻以及热界面材料和固态器件之间的接触电阻的相加值为0.06cm 2， K / W以下。

公开(公告)号：US20060005985A1

公开(公告)日：2006-01-12

申请号：US11221126

申请日：2005-09-07

申请人： Jean-Jacques L'Henaff ,  William Cowles ,  Peter Schwartz

发明人： Jean-Jacques L'Henaff ,  William Cowles ,  Peter Schwartz

IPC分类号： H02G3/08

CPC分类号： H05K5/0204

摘要： An optional surface fastening system for an electronics housing facilitates its attachment to pre-manufactured fixed panel systems, enclosures and the like. The electronics housing has primary holes or slot features that interface standard screw hardware in order to fasten to varied surfaces or accepts specially designed connector pieces to mechanically attach to the aforementioned fixed enclosures. Connector pieces, designed to interface with any panel system, may be replaced interchangeably and are temporarily fixed by a snap detail located on the primary slots. Method of attaching the electronics housing to a fixed panel system requires integrated pin features on the connector pieces, employed to locate to corresponding holes on the fixed panel, in conjunction with operatives rotation of a specialized pin feature to temporarily lock the electronics housing to the panel system. Conversely while attached, operative rotation of the specialized pin feature disengages the electronics housing from the fixed panel system.

摘要翻译： 用于电子器件壳体的可选的表面紧固系统便于其附接到预制的固定面板系统，外壳等。 电子外壳具有主要孔或槽特征，其与标准螺钉硬件接合，以便紧固到各种表面，或接受专门设计的连接件，以机械连接到上述固定外壳。 设计成与任何面板系统连接的连接件可以互换替换，并通过位于主槽上的卡扣细节临时固定。 将电子设备外壳连接到固定面板系统的方法需要连接器片上的集成销特征，用于定位到固定面板上的相应孔，结合专用销特征的操作旋转，将电子设备外壳临时锁定到面板 系统。 相反，当连接时，专用销特征的操作旋转使电子设备外壳与固定面板系统脱离接触。

公开(公告)号：US20050188923A1

公开(公告)日：2005-09-01

申请号：US10966245

申请日：2004-10-15

申请人： Robert Cook ,  Ronald Stevens ,  Peter Schwartz ,  Cesar Tejamo ,  Vebjorn Nilsen ,  Gabriel Ormonde ,  Ajit Paranjpe ,  Somnath Nag ,  Michael Patten

发明人： Robert Cook ,  Ronald Stevens ,  Peter Schwartz ,  Cesar Tejamo ,  Vebjorn Nilsen ,  Gabriel Ormonde ,  Ajit Paranjpe ,  Somnath Nag ,  Michael Patten

IPC分类号： C23C16/24 ,  C23C16/34 ,  C23C16/44 ,  C23C16/455 ,  C23C16/458 ,  C23C16/46 ,  C23C16/48 ,  C23C16/509 ,  C23C16/54 ,  H01J37/32 ,  H01L21/00 ,  H01L21/205 ,  H01L21/318 ,  H01L21/673 ,  H01L21/677 ,  C23C16/00

CPC分类号： H01L21/67303 ,  C23C16/4584 ,  C23C16/54 ,  H01J37/32082 ,  H01J37/32733 ,  H01J2237/2001 ,  H01L21/02529 ,  H01L21/02532 ,  H01L21/0262 ,  H01L21/02658 ,  H01L21/3185 ,  H01L21/67017 ,  H01L21/67069 ,  H01L21/67115 ,  H01L21/67309 ,  H01L21/67346 ,  H01L21/67383

摘要： A substrate carrier for a parallel wafer processing reactor supports a plurality of substrates. The substrate carrier includes a plurality of susceptors, which may be thermal plates or annular rings that are arranged horizontally in a vertical stack. The substrates are mounted between pairs of susceptors on two or more supports provided around the outer periphery of the susceptors. The number of substrates mounted between each pair of susceptors may the same or different but is two or more between at least one pair of susceptors.

摘要翻译： 用于平行晶片处理反应器的衬底载体支撑多个衬底。 衬底载体包括多个基座，其可以是在垂直堆叠中水平布置的热板或环形环。 衬底被安置在两个或更多个支撑体之间的基座对之间，所述支撑件设置在基座的外周周围。 安装在每对感受体之间的衬底的数量可以相同或不同，但是在至少一对感受器之间是两个或更多个。

公开(公告)号：US06530538B2

公开(公告)日：2003-03-11

申请号：US09932147

申请日：2001-08-17

申请人： Detlev Trimborn ,  Christian Sturm ,  Peter Schwartz

发明人： Detlev Trimborn ,  Christian Sturm ,  Peter Schwartz

IPC分类号： B65H4918

CPC分类号： B65H54/2827 ,  B65H54/44 ,  B65H54/553 ,  B65H54/74 ,  B65H2701/31

摘要： A winding device (24) for a textile machine (1) producing cheeses has a creel (18) for holding a cheese (11) between tube receiving plates (38, 38′), a yarn traversing device (28) comprising a separate drive (31), and a speed-regulatable drive device (27) integrated in the creel (18) to move in a bearing housing (23) of the creel (18) and connected to one of the tube receiving plates (38, 38′). The drive device (27) can be loaded with a braking current which produces a moment opposite the direction of rotation (SR) of the cheese (11), for braking the cheese (11). The drive device (27) is arranged in a sliding sleeve (35) that can be loaded pneumatically against the displacement force of spring elements (43) to move one of the tube receiving plates (38) outwardly as needed in a creel opening direction.

公开(公告)号：USD768662S1

公开(公告)日：2016-10-11

申请号：US29475196

申请日：2013-12-01

申请人： Matthew McRae ,  Peter Schwartz ,  Polly Elaine Stecyk

设计人： Matthew McRae ,  Peter Schwartz ,  Polly Elaine Stecyk

公开(公告)号：USD768159S1

公开(公告)日：2016-10-04

申请号：US29475192

申请日：2013-12-01

申请人： Matthew McRae ,  Peter Schwartz ,  Polly Elaine Stecyk

设计人： Matthew McRae ,  Peter Schwartz ,  Polly Elaine Stecyk

公开(公告)号：USD499015S1

公开(公告)日：2004-11-30

申请号：US29156194

申请日：2002-02-26

申请人： Peter Schwartz

设计人： Peter Schwartz