公开(公告)号：US08012866B2

公开(公告)日：2011-09-06

申请号：US12130386

申请日：2008-05-30

申请人： Ping Liang Tu ,  Chun Hung Samuel Ip

发明人： Ping Liang Tu ,  Chun Hung Samuel Ip

IPC分类号： H01L21/44

CPC分类号： H05K3/3478 ,  B23K1/0016 ,  B23K3/0623 ,  B23K2101/40 ,  H01L21/32 ,  H01L24/27 ,  H01L24/75 ,  H01L24/83 ,  H01L33/62 ,  H01L2224/2919 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2224/83801 ,  H01L2924/00011 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/12041 ,  H01L2924/15747 ,  H01L2924/3025 ,  H01L2933/0066 ,  H05K3/3494 ,  H05K2203/0195 ,  H05K2203/0338 ,  H05K2203/041 ,  H05K2203/082 ,  H05K2203/086 ,  H05K2203/1581 ,  H01L2924/00 ,  H01L2224/83205

摘要： A method for bonding a semiconductor device onto a substrate is provided which comprises the steps of picking up a solder ball with a pick head, placing the solder ball onto the substrate and melting the solder ball on the substrate and placing the semiconductor device on the molten solder ball. The molten solder ball is then allowed to cool to form a solder joint which bonds the semiconductor device to the substrate.

摘要翻译： 提供了将半导体器件接合到衬底上的方法，其包括以下步骤：用拾取头拾取焊球，将焊球放置在衬底上并熔化衬底上的焊球并将半导体器件放置在熔融 焊球 然后使熔融的焊球冷却，形成将半导体器件与衬底结合的焊点。

公开(公告)号：US07854365B2

公开(公告)日：2010-12-21

申请号：US12258675

申请日：2008-10-27

申请人： Ming Li ,  Ying Ding ,  Ping Liang Tu ,  King Ming Lo ,  Kwok Kee Chung

发明人： Ming Li ,  Ying Ding ,  Ping Liang Tu ,  King Ming Lo ,  Kwok Kee Chung

IPC分类号： B23K31/02

CPC分类号： H01L24/83 ,  H01L24/29 ,  H01L24/75 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/29144 ,  H01L2224/2919 ,  H01L2224/32506 ,  H01L2224/83191 ,  H01L2224/838 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/12041 ,  H01L2924/157 ,  H01L2924/15787 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00014

摘要： A method is provided for bonding a die comprising a solder layer which has a melting point Tm. A bond head is heated to a bond head setting temperature T1, which is higher than Tm, and a substrate is heated to a substrate setting temperature T2, which is lower than Tm. The bond head then picks up the die and heats the die towards temperature T1 so as to melt the solder layer. The solder layer of the die is pressed onto the substrate so as to bond the die to the substrate, and thereafter the bond head is separated from the die so that the solder layer is cooled towards T2 and solidifies.

摘要翻译： 提供一种用于接合包含熔点Tm的焊料层的管芯的方法。 将接合头加热到高于Tm的接合头设定温度T1，将衬底加热到​​低于Tm的衬底设定温度T2。 然后，接合头拾取模具并将模具朝向温度T1加热，以熔化焊料层。 将模具的焊料层压在基板上，以将模具结合到基板上，然后将结合头与模具分离，使得焊料层朝T2冷却并固化。

公开(公告)号：US07648901B2

公开(公告)日：2010-01-19

申请号：US11536051

申请日：2006-09-28

申请人： Ping Liang Tu ,  Deming Liu ,  Kui Kam Lam ,  Man Chung Raymond Ng

发明人： Ping Liang Tu ,  Deming Liu ,  Kui Kam Lam ,  Man Chung Raymond Ng

IPC分类号： H01L21/44

CPC分类号： B23K1/008 ,  B23K2101/40

摘要： A manufacturing process and apparatus therefore are provided for processing an electronic device comprising oxidizable material during processing. The electronic device is located inside a chamber and is heated a processing temperature with a heater. A reductive atmosphere is created in the chamber by supplying a gas comprising glycolic acid vapor while processing the electronic device at the processing temperature.

摘要翻译： 因此，提供了一种制造工艺和装置，用于在加工期间处理包括可氧化材料的电子装置。 电子设备位于室内并用加热器加热处理温度。 通过在加工温度下处理电子装置的同时供应包含乙醇酸蒸汽的气体，在室中产生还原性气氛。