公开(公告)号：US12249641B1

公开(公告)日：2025-03-11

申请号：US18383009

申请日：2023-10-23

Applicant: PsiQuantum Corp

Inventor： Faraz Najafi ,  Qiaodan Jin Stone ,  Andrea Bahgat Shehata

IPC: H01L29/66 ,  H01L23/34 ,  H01L29/861 ,  H01L29/868 ,  H01L31/09 ,  H01L31/107 ,  H10N60/30 ,  H10N69/00

Abstract: The various embodiments described herein include methods, devices, and systems for fabricating and operating diodes. In one aspect, an electrical circuit includes: (1) a diode component having a particular energy band gap; (2) an electrical source electrically coupled to the diode component and configured to bias the diode component in a particular state; and (3) a heating component thermally coupled to a junction of the diode component and configured to selectively supply heat corresponding to the particular energy band gap.

公开(公告)号：US11099211B1

公开(公告)日：2021-08-24

申请号：US16659535

申请日：2019-10-21

Applicant: PsiQuantum Corp.

Inventor： Faraz Najafi ,  Andrea Bahgat Shehata ,  Stephanie Meng-Yan Teo

IPC: G01R31/28 ,  G01R1/073 ,  F25D29/00

Abstract: The various embodiments described herein include methods for testing low temperature components. In some embodiments, a cryogenic testing system includes: (1) a cryostat chamber configured to maintain a sample at temperatures below a threshold temperature, where the sample includes a two-dimensional array of components to be tested, the two-dimensional array comprising a first number (n) of columns and a second number (m) of rows; (2) a probe card including: (a) a set of n column connectors configured to couple to respective columns of the two-dimensional array; and (b) a set of m row connectors configured to couple to respective rows of the two-dimensional array; and (3) a cryogenic connector for communicatively coupling the probe card to a processing unit outside of the cryostat chamber.

公开(公告)号：US11289590B1

公开(公告)日：2022-03-29

申请号：US16773921

申请日：2020-01-27

Applicant: PsiQuantum Corp.

Inventor： Faraz Najafi ,  Qiaodan Jin Stone ,  Andrea Bahgat Shehata

IPC: H01L29/868 ,  H01L29/66 ,  H01L29/861 ,  H01L23/34 ,  H01L27/18 ,  H01L31/09 ,  H01L39/16 ,  H01L31/107

Abstract: The various embodiments described herein include methods, devices, and systems for fabricating and operating diodes. In one aspect, an electrical circuit includes: (1) a diode component having a particular energy band gap; (2) an electrical source electrically coupled to the diode component and configured to bias the diode component in a particular state; and (3) a heating component thermally coupled to a junction of the diode component and configured to selectively supply heat corresponding to the particular energy band gap.

公开(公告)号：US11799020B1

公开(公告)日：2023-10-24

申请号：US17705201

申请日：2022-03-25

Applicant: PsiQuantum Corp

Inventor： Faraz Najafi ,  Qiaodan Jin Stone ,  Andrea Bahgat Shehata

IPC: H01L29/66 ,  H01L23/34 ,  H10N60/30 ,  H01L29/861 ,  H01L29/868 ,  H01L31/09 ,  H01L31/107 ,  H10N69/00

CPC classification number: H01L29/66992 ,  H01L23/345 ,  H01L29/861 ,  H01L29/868 ,  H01L31/09 ,  H01L31/107 ,  H10N60/30 ,  H10N69/00

Abstract: The various embodiments described herein include methods, devices, and systems for fabricating and operating diodes. In one aspect, an electrical circuit includes: (1) a diode component having a particular energy band gap; (2) an electrical source electrically coupled to the diode component and configured to bias the diode component in a particular state; and (3) a heating component thermally coupled to a junction of the diode component and configured to selectively supply heat corresponding to the particular energy band gap.