公开(公告)号：US11975846B2

公开(公告)日：2024-05-07

申请号：US17247546

申请日：2020-12-16

Applicant: QUALCOMM Incorporated

Inventor： Peng Wang ,  Don Le ,  Jon James Anderson ,  Chinchuan Chiu

IPC: B64D13/00 ,  B64C39/02 ,  B64D33/08 ,  B64U10/13 ,  B64U30/20 ,  F28D15/02 ,  F28D15/04 ,  F28D21/00

CPC classification number: B64D13/006 ,  B64C39/024 ,  B64D33/08 ,  F28D15/0275 ,  F28D15/04 ,  B64U10/13 ,  B64U30/20 ,  F28D2021/0021

Abstract: An innovative passive cooling solution with sealed UAV enclosure system allows heat from a semiconductor chip to be dissipated to the ambient environment through evaporation/condensation phase-change cooling and air cooling a heat sink such as a fin without any additional power consumption to operate cooling solution. One example of such a solution may include a pipe with a fin and a fluid. The pipe may include a wick structure along an inner surface of the pipe configured to allow the fluid to travel within the wick structure and to allow a vapor form of the fluid to exit the wick structure towards a center of the pipe.

公开(公告)号：US20190009878A1

公开(公告)日：2019-01-10

申请号：US15645940

申请日：2017-07-10

Applicant: QUALCOMM Incorporated

Inventor： Peng Wang ,  Vivek Sahu ,  Shujuan Wang ,  Don Le ,  Jon James Anderson ,  Chinchuan Chiu

IPC: B64C1/06 ,  B64C39/02

Abstract: Arrangements described herein relate to apparatuses, systems, and methods for a housing of an unmanned aerial vehicle (UAV), the housing includes but is not limited to a metallic porous material having a shape of an enclosure of the UAV, and a phase change material (PCM) provided in at least a portion of the metallic porous material. The metallic porous material and the PCM are configured to passively cool the UAV.

公开(公告)号：US10189554B1

公开(公告)日：2019-01-29

申请号：US15645940

申请日：2017-07-10

Applicant: QUALCOMM Incorporated

Inventor： Peng Wang ,  Vivek Sahu ,  Shujuan Wang ,  Don Le ,  Jon James Anderson ,  Chinchuan Chiu

IPC: B60H3/00 ,  B64C1/06 ,  B64C39/02 ,  B64C1/00

Abstract: Arrangements described herein relate to apparatuses, systems, and methods for a housing of an unmanned aerial vehicle (UAV), the housing includes but is not limited to a metallic porous material having a shape of an enclosure of the UAV, and a phase change material (PCM) provided in at least a portion of the metallic porous material. The metallic porous material and the PCM are configured to passively cool the UAV.

公开(公告)号：US11042174B2

公开(公告)日：2021-06-22

申请号：US15424661

申请日：2017-02-03

Applicant: QUALCOMM INCORPORATED

Inventor： Vivek Sahu ,  Don Le ,  Jon Anderson ,  Peng Wang ,  Shujuan Wang

IPC: G05D23/19 ,  A61B5/1455 ,  A61B5/00 ,  G06F1/3231 ,  G06F1/20 ,  H04W52/02 ,  G06F1/16

Abstract: Because the touch temperature of a wearable computing device (“WCD”) may be an insignificant factor for user experience when the WCD is not being worn by a user, embodiments of the solution seek to modify thermal management policies based on an inferred user proximity state. Exemplary embodiments monitor one or more signals from readily available sensors in the WCD that have primary purposes other than measuring user proximity. Depending on embodiment, the sensors may be selected from a group consisting of a heart rate monitor, a pulse monitor, an O2 sensor, a bio-impedance sensor, a gyroscope, an accelerometer, a temperature sensor, a pressure sensor, a capacitive sensor, a resistive sensor and a light sensor. Using the signals generated by such sensors, relative physical proximity of the WCD to a user may be inferred and, based on the user proximity state, thermal policies either relaxed or tightened.

公开(公告)号：US10746474B2

公开(公告)日：2020-08-18

申请号：US16398001

申请日：2019-04-29

Applicant: QUALCOMM Incorporated

Inventor： Jorge Luis Rosales ,  Le Gao ,  Don Le ,  Jon James Anderson

IPC: F28D15/02 ,  H05K7/20 ,  F04B49/06 ,  F04B17/00 ,  H01L23/427

Abstract: A device that includes a region comprising an integrated device, and a heat dissipating device coupled to the region comprising the integrated device. The heat dissipating device is configured to dissipate heat away from the region. The heat dissipating device includes a fluid, an evaporator configured to evaporate the fluid, a condenser configured to condense the fluid, an inner wall coupled to the evaporator and the condenser, an outer shell encapsulating the fluid, the evaporator, the condenser and the inner wall, an evaporation portion configured to channel an evaporated fluid from the evaporator to the condenser, and a collection portion configured to channel a condensed fluid from the condenser to the evaporator. The heat dissipating device includes one or more piezo structures configured to move fluid inside the heat dissipating device.

公开(公告)号：US11437328B2

公开(公告)日：2022-09-06

申请号：US16874542

申请日：2020-05-14

Applicant: QUALCOMM Incorporated

Inventor： Peng Wang ,  Le Gao ,  Jorge Luis Rosales ,  Don Le

IPC: H01L23/552 ,  H01L23/427 ,  H01L25/065 ,  H01L21/48 ,  H01L23/00

Abstract: Aspects of the disclosure relate to thermal management of devices, such as mobile devices configured for wireless communication in wireless communication networks. A device includes a plurality of electronic components. An electromagnetic interference (EMI) shield is disposed on the electronic components, and a plurality of EMI gaskets are disposed between the electronic components. Each of the EMI gaskets surrounds a respective one of the plurality of electronic components. An evaporative cooler device embedded within the EMI shield is configured to transfer heat away from at least a portion of the electronic components.