公开(公告)号：US10189554B1

公开(公告)日：2019-01-29

申请号：US15645940

申请日：2017-07-10

Applicant: QUALCOMM Incorporated

Inventor： Peng Wang ,  Vivek Sahu ,  Shujuan Wang ,  Don Le ,  Jon James Anderson ,  Chinchuan Chiu

IPC: B60H3/00 ,  B64C1/06 ,  B64C39/02 ,  B64C1/00

Abstract: Arrangements described herein relate to apparatuses, systems, and methods for a housing of an unmanned aerial vehicle (UAV), the housing includes but is not limited to a metallic porous material having a shape of an enclosure of the UAV, and a phase change material (PCM) provided in at least a portion of the metallic porous material. The metallic porous material and the PCM are configured to passively cool the UAV.

公开(公告)号：US10358230B2

公开(公告)日：2019-07-23

申请号：US15263267

申请日：2016-09-12

Applicant: QUALCOMM Incorporated

Inventor： Vivek Sahu ,  Mehdi Saeidi ,  Rajat Mittal ,  Melika Roshandell

IPC: B64D33/08 ,  B64C39/02 ,  B64D27/24

Abstract: A drone adapted for flight may include propellers that may be powered by motors to move the drone. The drone may include a processing component and arms for supporting each of the propellers. At least a portion of at least one of the arms may include a first thermal spreading material that is coupled to the processing component. Each of the arms may be exposed to the air.

公开(公告)号：US11042174B2

公开(公告)日：2021-06-22

申请号：US15424661

申请日：2017-02-03

Applicant: QUALCOMM INCORPORATED

Inventor： Vivek Sahu ,  Don Le ,  Jon Anderson ,  Peng Wang ,  Shujuan Wang

IPC: G05D23/19 ,  A61B5/1455 ,  A61B5/00 ,  G06F1/3231 ,  G06F1/20 ,  H04W52/02 ,  G06F1/16

Abstract: Because the touch temperature of a wearable computing device (“WCD”) may be an insignificant factor for user experience when the WCD is not being worn by a user, embodiments of the solution seek to modify thermal management policies based on an inferred user proximity state. Exemplary embodiments monitor one or more signals from readily available sensors in the WCD that have primary purposes other than measuring user proximity. Depending on embodiment, the sensors may be selected from a group consisting of a heart rate monitor, a pulse monitor, an O2 sensor, a bio-impedance sensor, a gyroscope, an accelerometer, a temperature sensor, a pressure sensor, a capacitive sensor, a resistive sensor and a light sensor. Using the signals generated by such sensors, relative physical proximity of the WCD to a user may be inferred and, based on the user proximity state, thermal policies either relaxed or tightened.

公开(公告)号：US10649503B2

公开(公告)日：2020-05-12

申请号：US15637901

申请日：2017-06-29

Applicant: QUALCOMM Incorporated

Inventor： Vivek Sahu ,  Mehdi Saeidi

IPC: G06F1/18 ,  H01L23/40 ,  H01L23/13 ,  H01L23/14 ,  H01L23/373 ,  H01L23/433 ,  H01L23/552 ,  H01L23/00 ,  H05K3/36 ,  H01L25/065 ,  H01L23/42 ,  H01L25/10 ,  H01L21/56 ,  H01L23/367

Abstract: A device that includes a die, a thermal interface material (TIM) coupled to the die, and an electromagnetic (EMI) shield coupled to the thermal interface material (TIM). The electromagnetic (EMI) shield is configured to compress the thermal interface material (TIM). The electromagnetic (EMI) shield comprises a flexible portion. In some implementations, the thermal interface material (TIM) is compressed by the electromagnetic (EMI) shield such that the thickness of the thermal interface material (TIM) is reduced by about at least 10˜20 percent.

公开(公告)号：US20190009878A1

公开(公告)日：2019-01-10

申请号：US15645940

申请日：2017-07-10

Applicant: QUALCOMM Incorporated

Inventor： Peng Wang ,  Vivek Sahu ,  Shujuan Wang ,  Don Le ,  Jon James Anderson ,  Chinchuan Chiu

IPC: B64C1/06 ,  B64C39/02

Abstract: Arrangements described herein relate to apparatuses, systems, and methods for a housing of an unmanned aerial vehicle (UAV), the housing includes but is not limited to a metallic porous material having a shape of an enclosure of the UAV, and a phase change material (PCM) provided in at least a portion of the metallic porous material. The metallic porous material and the PCM are configured to passively cool the UAV.

公开(公告)号：US09943008B2

公开(公告)日：2018-04-10

申请号：US15087864

申请日：2016-03-31

Applicant: QUALCOMM Incorporated

Inventor： Rajat Mittal ,  Mehdi Saeidi ,  Vivek Sahu ,  Ryan Coutts

IPC: H05K7/20 ,  H01L41/09 ,  H01L41/04

CPC classification number: H05K7/2039 ,  H01L41/042 ,  H01L41/0926 ,  H01L41/0973 ,  H05K7/20445 ,  H05K7/20472

Abstract: An electronic device includes an integrated circuit, a flexible heat spreader, an actuator, and a controller. The actuator is coupled to the flexible heat spreader and the controller is configured to control the actuator between a first actuation mode and a second actuation mode. When in the first actuation mode, the actuator positions the flexible heat spreader with an air gap between the flexible heat spreader and the integrated circuit such that the flexible heat spreader is thermally separated from the integrated circuit to increase a thermal impedance between the flexible heat spreader and the integrated circuit. When in the second actuation mode, the actuator positions the flexible heat spreader in thermal contact with the integrated circuit without the air gap there between to reduce the thermal impedance between the flexible heat spreader and the integrated circuit.

公开(公告)号：US20180143862A1

公开(公告)日：2018-05-24

申请号：US15373067

申请日：2016-12-08

Applicant: QUALCOMM INCORPORATED

Inventor： Mehdi Saeidi ,  Vivek Sahu ,  Taravat Khadivi ,  Ryan Coutts ,  Ronald Alton ,  Palkesh Jain ,  Rajat Mittal

IPC: G06F9/50 ,  G06F1/20

CPC classification number: G06F9/5044 ,  G06F1/206 ,  G06F9/5094 ,  Y02D10/22

Abstract: A method includes generating temperature information from a plurality of temperature sensors within a computing device, wherein a first one of the temperature sensors is physically located at a first processing unit of the computing device; processing the temperature information to identify that the first temperature sensor is associated with temperature that is at or above a threshold; and assigning a processing thread to a first core of a plurality of cores of a second processing unit in response to identifying that the first temperature sensor is associated with temperature that is at or above the threshold and based at least in part on a physical distance between the first core and the first temperature sensor.