公开(公告)号：US20180048270A1

公开(公告)日：2018-02-15

申请号：US15349225

申请日：2016-11-11

Applicant: QUALCOMM INCORPORATED

Inventor： Tianzuo Xi ,  Haichuan Kang ,  ZhenQi Chen ,  Zhenying Luo ,  Xiangdong Zhang ,  Xinwei Wang ,  Yanjie Sun ,  Yan Kit Gary Hau ,  Jing-Hwa Chen

IPC: H03F1/56 ,  H03F3/24 ,  H01L29/20 ,  H01L29/737 ,  H04B1/38 ,  H01L23/498 ,  H01L23/66 ,  H05K1/18 ,  H05K1/11 ,  G06F1/16 ,  H03F3/195 ,  H01L23/00

CPC classification number: H03F1/565 ,  G06F1/1616 ,  G06F1/1626 ,  H01L23/49827 ,  H01L23/49844 ,  H01L23/66 ,  H01L24/06 ,  H01L24/46 ,  H01L29/20 ,  H01L29/737 ,  H01L2223/6616 ,  H01L2223/6655 ,  H01L2224/04042 ,  H01L2224/16225 ,  H01L2224/4813 ,  H01L2224/4911 ,  H01L2224/73257 ,  H03F3/193 ,  H03F3/195 ,  H03F3/245 ,  H03F2200/387 ,  H04B1/38 ,  H05K1/115 ,  H05K1/18 ,  H05K2201/10015 ,  H05K2201/1003 ,  H05K2201/10166

Abstract: A circuit including a radio frequency (RF) amplifier including a transistor configured to receive an RF signal at its control terminal, a capacitor coupled to a first terminal of the transistor, an inductor coupled to a second terminal of the transistor, wherein the capacitor and inductor form a loop from the first terminal to the second terminal, wherein the loop bypasses a parasitic inductance between the second terminal and ground.