公开(公告)号：US20240321724A1

公开(公告)日：2024-09-26

申请号：US18188965

申请日：2023-03-23

Applicant: QUALCOMM Incorporated

Inventor： Doosoub SHIN ,  Changhan Hobie YUN ,  Youngju PARK

IPC: H01L23/522 ,  H01L23/48 ,  H01L23/498

CPC classification number: H01L23/5223 ,  H01L23/481 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/5227 ,  H01L2223/6616 ,  H01L2223/6661

Abstract: A device includes a passive substrate having a first metallization layer on a first surface of the passive substrate. The first metallization layer is composed of a first passive component and a first plate portion. The device includes an insulator layer coupled to the first plate portion of the first metallization layer. The device also includes a first conductive interconnect coupled to the insulator layer to form a second passive component coupled to the first passive component. The device further includes a laminate substrate coupled to the first conductive interconnect.

公开(公告)号：US20240297165A1

公开(公告)日：2024-09-05

申请号：US18177404

申请日：2023-03-02

Applicant: QUALCOMM Incorporated

Inventor： Changhan Hobie YUN ,  Paragkumar Ajaybhai THADESAR ,  Sameer Sunil VADHAVKAR ,  Youngju PARK ,  Doosoub SHIN

IPC: H01L25/18 ,  H01L23/00 ,  H01L23/498 ,  H01L25/00 ,  H01L27/01

CPC classification number: H01L25/18 ,  H01L23/49822 ,  H01L23/49827 ,  H01L24/14 ,  H01L24/16 ,  H01L24/17 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/92 ,  H01L25/50 ,  H01L27/01 ,  H01L23/49811 ,  H01L2224/14181 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/17181 ,  H01L2224/32145 ,  H01L2224/73204 ,  H01L2224/81005 ,  H01L2224/81815 ,  H01L2224/92125

Abstract: A device is described, including a redistribution layer (RDL) substrate. The device also includes a passive component in the RDL substrate proximate a first surface of the RDL substrate. The device further includes a first die coupled to a second surface of the RDL substrate, opposite the first surface of the RDL substrate, through at least a first pair of conductive pillars. The device also includes a laminate substrate coupled to the first surface of the RDL substrate through at least a second pair of conductive pillars.