公开(公告)号：US20230099295A1

公开(公告)日：2023-03-30

申请号：US17485140

申请日：2021-09-24

Applicant: QUALCOMM Incorporated

Inventor： Arjang SHAHRIARI ,  Ajay VADAKKEPATT ,  Ajit Kumar VALLABHANENI ,  Melika ROSHANDELL ,  Mahdi NABIL ,  Mehdi SAEIDI ,  Paul PENZES

IPC: G02B26/00 ,  G09G3/34 ,  H01L23/473

Abstract: A device that includes a first integrated device, a second integrated device configured to be electrically coupled to the first integrated device and an electrowetting device configured to be electrically coupled to the second integrated device. The electrowetting device is configured to redistribute heat across a back surface of the device by looping a liquid in the electrowetting device, along the back surface of the device.

公开(公告)号：US20180072431A1

公开(公告)日：2018-03-15

申请号：US15263267

申请日：2016-09-12

Applicant: QUALCOMM Incorporated

Inventor： Vivek SAHU ,  Mehdi SAEIDI ,  Rajat MITTAL ,  Melika ROSHANDELL

IPC: B64D33/08 ,  B64C39/02 ,  B64C27/08

CPC classification number: B64D33/08 ,  B64C39/024 ,  B64C2201/027 ,  B64C2201/042 ,  B64C2201/108 ,  B64D27/24 ,  Y02T50/44

Abstract: A drone adapted for flight may include propellers that may be powered by motors to move the drone. The drone may include a processing component and arms for supporting each of the propellers. At least a portion of at least one of the arms may include a first thermal spreading material that is coupled to the processing component. Each of the arms may be exposed to the air.

公开(公告)号：US20180220553A1

公开(公告)日：2018-08-02

申请号：US15423474

申请日：2017-02-02

Applicant: QUALCOMM Incorporated

Inventor： Mehdi SAEIDI ,  Ali Akbar MERRIKH ,  Melika ROSHANDELL

IPC: H05K7/20 ,  H01L23/427

CPC classification number: H05K7/20309 ,  G06F1/203 ,  G06F2200/201 ,  H01L23/427 ,  H05K1/0209 ,  H05K7/20327 ,  H05K7/20409 ,  H05K2201/0323

Abstract: An apparatus and method of the disclosure provides a cooling mechanism for a handheld electronic device. The cooling mechanism includes a heat sink and an evaporative cooling mechanism. The evaporative cooling mechanism includes liquid retaining structures. The liquid retaining structures are located in proximity to the at least one IC of the handheld electronic device. Each liquid retaining structure is coated with a temperature sensitive polymer that act as hydrophilic when the temperature of the surface of the handheld electronic device is below a threshold temperature. To maintain the temperature of the surface of the handheld electronic device below the threshold temperature, the temperature sensitive polymer act as hydrophobic and evaporates the liquid stored in the liquid retaining structures to the atmosphere surrounding the handheld electronic device when the temperature of the surface of the electronic device is above the threshold temperature.

公开(公告)号：US20160363623A1

公开(公告)日：2016-12-15

申请号：US15177964

申请日：2016-06-09

Applicant: QUALCOMM Incorporated

Inventor： Rajit CHANDRA ,  Melika ROSHANDELL ,  Niladri MOJUMDER

IPC: G01R31/28

CPC classification number: G01R31/2853 ,  G01R31/2837 ,  G01R31/2858

Abstract: An apparatus is disclosed. The apparatus includes a circuit, a conductor interconnecting a portion of the circuit, and a processor configured to determine a temperature of the conductor and adjust at least one parameter related to the conductor in response to the determined temperature rising above a threshold. The at least one parameter includes a lifetime estimate for the conductor. A method of operating an apparatus including a circuit and a conductor interconnecting a portion of the circuit is disclosed. The method includes determining a temperature of the conductor, and adjusting at least one parameter related to the conductor in response to the determined temperature rising above a threshold. The parameter includes a lifetime estimate for the conductor.

Abstract translation: 公开了一种装置。 该装置包括电路，互连电路的一部分的导体以及被配置为响应于所确定的温度升高到高于阈值而调整与导体相关的至少一个参数的导体的温度的处理器。 所述至少一个参数包括所述导体的寿命估计。 公开了一种操作包括电路和连接电路的一部分的导体的装置的方法。 该方法包括确定导体的温度，以及响应于所确定的温度升高到高于阈值，调整与导体相关的至少一个参数。 该参数包括导体的寿命估计。