利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

34 条记录 (耗时 0.021 秒)

    Molding composition and method, and molded article
    7.
    发明授权
    Molding composition and method, and molded article 失效
    成型组合物和成型品

    公开(公告)号：US07378455B2

    公开(公告)日：2008-05-27

    申请号：US11172308

    申请日：2005-06-30

    申请人： Qiwei Lu ,  Michael O'Brien ,  Michael Vallance

    发明人： Qiwei Lu ,  Michael O'Brien ,  Michael Vallance

    IPC分类号： C08F2/50 ,  B29C41/00 ,  B29C39/00

    CPC分类号： C08G59/68 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/73265 ,  Y10T428/31511 ,  H01L2924/00014 ,  H01L2924/00

    摘要： A curable method useful for encapsulating solid state devices includes (A) an epoxy resin; (B) an effective amount of a cure catalyst comprising (B1) a first latent cationic cure catalyst comprising a diaryl iodonium hexafluoroantimonate salt; (B2) a second latent cationic cure catalyst comprising (B2a) a diaryl iodonium cation, and (B2b) an anion selected from perchlorate, imidodisulfurylfluoride anion, unsubstituted and substituted (C1-C12)-hydrocarbylsulfonates, (C2-C12)-perfluoroalkanoates, tetrafluoroborate, unsubstituted and substituted tetra-(C1-C12)-hydrocarbylborates, hexafluorophosphate, hexafluoroarsenate, tris(trifluoromethylsulfonyl)methyl anion, bis(trifluoromethylsulfonyl)methyl anion, bis(trifluoromethylsulfuryl)imide anion, and combinations thereof; and (B3) a cure co-catalyst selected from free-radical generating aromatic compounds, peroxy compounds, copper (II) salts of aliphatic carboxylic acids, copper (II) salts of aromatic carboxylic acids, copper (II) acetylacetonate, and combinations thereof; and (C) about 70 to about 95 weight percent of an inorganic filler, based on the total weight of the curable composition. The composition's cure catalyst allows the use of increased filler loadings, which in turn reduces moisture absorption and thermal expansion of the cured composition.

    摘要翻译： 用于封装固态器件的可固化方法包括（A）环氧树脂; （B）有效量的固化催化剂，其包含（B1）包含二芳基碘鎓六氟锑酸盐的第一潜阳离子固化催化剂; （B2）包含（B2a）二芳基碘鎓阳离子的第二潜在阳离子固化催化剂和（B2b）选自高氯酸盐，亚氨基二硫基氟化物阴离子，未取代和取代的（C 1 -C 12） 全氟链烷酸酯，四氟硼酸酯，未取代和取代的四 - （C 1 -C 12 - ）烷基磺酸酯，（C 2 -C 12 -C 12 - 六氟磷酸盐，六氟砷酸盐，三（三氟甲基磺酰基）甲基阴离子，双（三氟甲基磺酰基）甲基阴离子，双（三氟甲基磺酰基）亚胺阴离子及其组合; 和（B3）选自自由基产生芳族化合物，过氧化合物，脂族羧酸的铜（II）盐，芳族羧酸的铜（II）盐，乙酰丙酮化的铜（II）及其组合）的固化助催化剂 ; 和（C）约70至约95重量％的无机填料，基于可固化组合物的总重量。 组合物的固化催化剂允许使用增加的填料负载，这进而降低固化的组合物的吸湿和热膨胀。

    Molding composition and method, and molded article
    8.
    发明申请
    Molding composition and method, and molded article 失效
    成型组合物和成型品

    公开(公告)号：US20070004819A1

    公开(公告)日：2007-01-04

    申请号：US11172308

    申请日：2005-06-30

    申请人： Qiwei Lu ,  Michael O'Brien ,  Michael Vallance

    发明人： Qiwei Lu ,  Michael O'Brien ,  Michael Vallance

    IPC分类号： C08F2/46 ,  C08L63/00 ,  C08L71/02

    CPC分类号： C08G59/68 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/73265 ,  Y10T428/31511 ,  H01L2924/00014 ,  H01L2924/00

    摘要： A curable method useful for encapsulating solid state devices includes (A) an epoxy resin; (B) an effective amount of a cure catalyst comprising (B1) a first latent cationic cure catalyst comprising a diaryl iodonium hexafluoroantimonate salt; (B2) a second latent cationic cure catalyst comprising (B2a) a diaryl iodonium cation, and (B2b) an anion selected from perchlorate, imidodisulfurylfluoride anion, unsubstituted and substituted (C1-C12)-hydrocarbylsulfonates, (C2-C12)-perfluoroalkanoates, tetrafluoroborate, unsubstituted and substituted tetra-(C1-C12)-hydrocarbylborates, hexafluorophosphate, hexafluoroarsenate, tris(trifluoromethylsulfonyl)methyl anion, bis(trifluoromethylsulfonyl)methyl anion, bis(trifluoromethylsulfuryl)imide anion, and combinations thereof; and (B3) a cure co-catalyst selected from free-radical generating aromatic compounds, peroxy compounds, copper (II) salts of aliphatic carboxylic acids, copper (II) salts of aromatic carboxylic acids, copper (II) acetylacetonate, and combinations thereof; and (C) about 70 to about 95 weight percent of an inorganic filler, based on the total weight of the curable composition. The composition's cure catalyst allows the use of increased filler loadings, which in turn reduces moisture absorption and thermal expansion of the cured composition.

    摘要翻译： 用于封装固态器件的可固化方法包括（A）环氧树脂; （B）有效量的固化催化剂，其包含（B1）包含二芳基碘鎓六氟锑酸盐的第一潜阳离子固化催化剂; （B2）包含（B2a）二芳基碘鎓阳离子的第二潜在阳离子固化催化剂和（B2b）选自高氯酸盐，亚氨基二硫基氟化物阴离子，未取代和取代的（C 1 -C 12） 全氟链烷酸酯，四氟硼酸酯，未取代和取代的四 - （C 1 -C 12 - ）烷基磺酸酯，（C 2 -C 12 -C 12 - 六氟磷酸盐，六氟砷酸盐，三（三氟甲基磺酰基）甲基阴离子，双（三氟甲基磺酰基）甲基阴离子，双（三氟甲基磺酰基）亚胺阴离子及其组合; 和（B3）选自自由基产生芳族化合物，过氧化合物，脂族羧酸的铜（II）盐，芳族羧酸的铜（II）盐，乙酰丙酮化的铜（II）及其组合）的固化助催化剂 ; 和（C）约70至约95重量％的无机填料，基于可固化组合物的总重量。 组合物的固化催化剂允许使用增加的填料负载，这进而降低固化的组合物的吸湿和热膨胀。

    RUBBER COMPOSITION, METHOD FOR ITS FORMATION, AND AUTOMOTIVE TIRE CONTAINING THE COMPOSITION
    9.
    发明申请
    RUBBER COMPOSITION, METHOD FOR ITS FORMATION, AND AUTOMOTIVE TIRE CONTAINING THE COMPOSITION 有权
    橡胶组合物，其形成方法和含有组合物的汽车轮胎

    公开(公告)号：US20140011926A1

    公开(公告)日：2014-01-09

    申请号：US14010959

    申请日：2013-08-27

    申请人： Scott Michael Fisher ,  Qiwei Lu ,  William Eugene Pecak ,  Michael J. O'Brien

    发明人： Scott Michael Fisher ,  Qiwei Lu ,  William Eugene Pecak ,  Michael J. O'Brien

    IPC分类号： C08L71/12 ,  C08K5/523 ,  C08K5/01

    CPC分类号： C08K5/01 ,  C04B24/26 ,  C04B28/02 ,  C08K3/04 ,  C08K5/523 ,  C08L9/00 ,  C08L9/06 ,  C08L21/00 ,  C08L25/06 ,  C08L71/12 ,  C08L91/00 ,  C08L7/00

    摘要： A rubber composition with disperse phase particles containing poly(phenylene ether) can be formed by a method that includes melt blending an uncured rubber with a poly(phenylene ether) composition containing a poly(phenylene ether) and an oil to form an uncured rubber composition, then curing the uncured rubber composition. Before being blended with the rubber, the poly(phenylene ether) composition exhibits a glass transition temperature of about 40 to about 140° C., and during blending with the rubber, the oil component of poly(phenylene ether) composition migrates from the poly(phenylene ether) composition to the rubber, leaving a poly(phenylene ether)-containing disperse phase that gives rise to a second hysteresis peak temperature of about 160 to about 220° C. as measured by dynamic mechanical analysis of the cured rubber composition. Also described are the poly(phenylene ether) composition used in the method, a cured rubber composition formed by the method, and a tire containing the cured rubber composition.

    摘要翻译： 含有聚（苯醚）的分散相颗粒的橡胶组合物可以通过包括将未固化的橡胶与含有聚（苯醚）和油的聚（苯醚）组合物熔融共混以形成未固化的橡胶组合物的方法形成 ，然后固化未固化的橡胶组合物。 在与橡胶混合之前，聚（苯醚）组合物的玻璃化转变温度为约40至约140℃，并且在与橡胶共混期间，聚（苯醚）组合物的油组分从聚 （亚苯基醚）组合物与橡胶反应，留下含聚亚苯基醚的分散相，其通过固化的橡胶组合物的动态机械分析测量，产生约160至约220℃的第二滞后峰值温度。 还描述了该方法中使用的聚（苯醚）组合物，通过该方法形成的固化橡胶组合物和含有固化橡胶组合物的轮胎。

    Salt Modified Inherently Electrostatic Dissipative Polymers
    10.
    发明申请
    Salt Modified Inherently Electrostatic Dissipative Polymers 审中-公开
    盐改性固有静电耗散聚合物

    公开(公告)号：US20130202970A1

    公开(公告)日：2013-08-08

    申请号：US13880999

    申请日：2011-10-26

    申请人： Qiwei Lu ,  Carlos A. Piedrahita ,  Yona Eckstein ,  James M. Ludlow, III

    发明人： Qiwei Lu ,  Carlos A. Piedrahita ,  Yona Eckstein ,  James M. Ludlow, III

    IPC分类号： H01B1/12

    CPC分类号： H01B1/124 ,  C08K5/0075 ,  C08K5/42 ,  C08K2201/014 ,  H01B1/125

    摘要： The present invention relates to inherently electrostatic dissipative polymers, such as thermoplastic urethanes (TPU), and compositions thereof. The present invention provides a composition comprising: (a) an inherently dissipative polymer and (b) a halogen-free metal salt of an amidoalkanesulfonic acid, a hydrocarbyl-substituted benzenesulfonic acid, or a mixture thereof, or a polymer derived therefrom. The invention also provides a shaped polymeric article comprising the inherently dissipative polymer compositions described herein. The invention also provides a process of making the inherently dissipative polymer compositions described herein. The process includes the step of mixing a halogen-free metal-containing salt into an inherently dissipative polymer.

    摘要翻译： 本发明涉及固有的静电消散聚合物，例如热塑性聚氨酯（TPU）及其组合物。 本发明提供一种组合物，其包含：（a）固有耗散聚合物和（b）酰胺基烷基磺酸的无卤素金属盐，烃基取代的苯磺酸或其混合物，或由其衍生的聚合物。 本发明还提供了包含本文所述的固有耗散聚合物组合物的成型聚合物制品。 本发明还提供了制备本文所述固有耗散聚合物组合物的方法。 该方法包括将含卤素的含金属盐混合到固有的耗散聚合物中的步骤。