公开(公告)号：US20180068867A1

公开(公告)日：2018-03-08

申请号：US15688238

申请日：2017-08-28

申请人： R&D CIRCUITS, INC.

发明人： Donald Thompson ,  Cosimo Cantatore

IPC分类号： H01L21/48 ,  H01R12/70 ,  H01R12/52 ,  H01R13/11 ,  H01R13/24

CPC分类号： H01L21/486 ,  B33Y80/00 ,  G01R1/0483 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L2224/16227 ,  H01L2224/1623 ,  H01L2224/16235 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01R12/52 ,  H01R12/7082 ,  H01R13/112 ,  H01R13/2414 ,  H05K1/092 ,  H05K3/4069 ,  H05K7/1061 ,  H05K2203/107 ,  H05K2203/1131

摘要： The present invention provides for a structure and a mechanism by which by utilizing additive manufacturing processes electrical connections are created that connect the top and bottom of a block in a customizable pattern. Specifically connection points can be created on the surface of the block and route them to alternate locations transforming the original pattern to a smaller, larger, or alternate pattern.

公开(公告)号：US10559476B2

公开(公告)日：2020-02-11

申请号：US15688238

申请日：2017-08-28

申请人： R&D Circuits, Inc.

发明人： Donald Thompson ,  Cosimo Cantatore

IPC分类号： H01L21/48 ,  H01R12/52 ,  H01R12/70 ,  H01R13/11 ,  H01R13/24

摘要： The present invention provides for a structure and a mechanism by which by utilizing additive manufacturing processes electrical connections are created that connect the top and bottom of a block in a customizable pattern. Specifically connection points can be created on the surface of the block and route them to alternate locations transforming the original pattern to a smaller, larger, or alternate pattern.