MEMORY MODULE AND SYSTEM SUPPORTING PARALLEL AND SERIAL ACCESS MODES
    1.
    发明申请
    MEMORY MODULE AND SYSTEM SUPPORTING PARALLEL AND SERIAL ACCESS MODES 有权
    存储器模块和系统支持并行和串行访问模式

    公开(公告)号:US20150363107A1

    公开(公告)日:2015-12-17

    申请号:US14737147

    申请日:2015-06-11

    Applicant: Rambus Inc.

    CPC classification number: G11C7/1093 G11C5/04 G11C7/1003 G11C7/1066

    Abstract: A memory module can be programmed to deliver relatively wide, low-latency data in a first access mode, or to sacrifice some latency in return for a narrower data width, a narrower command width, or both, in a second access mode. The narrow, higher-latency mode requires fewer connections and traces. A controller can therefore support more modules, and thus increased system capacity. Programmable modules thus allow computer manufacturers to strike a desired balance between memory latency, capacity, and cost.

    Abstract translation: 存储器模块可以被编程为在第一访问模式下提供相对宽的,低延迟的数据,或者在第二访问模式中牺牲一些延迟,以换取较窄的数据宽度,较窄的命令宽度或两者。 窄的,更高延迟的模式需要更少的连接和跟踪。 因此,控制器可以支持更多的模块,从而增加系统容量。 因此可编程模块允许计算机制造商在存储器延迟,容量和成本之间达到期望的平衡。

    MEMORY MODULE AND SYSTEM SUPPORTING PARALLEL AND SERIAL ACCESS MODES

    公开(公告)号:US20210350838A1

    公开(公告)日:2021-11-11

    申请号:US17328211

    申请日:2021-05-24

    Applicant: Rambus Inc.

    Abstract: A memory module can be programmed to deliver relatively wide, low-latency data in a first access mode, or to sacrifice some latency in return for a narrower data width, a narrower command width, or both, in a second access mode. The narrow, higher-latency mode requires fewer connections and traces. A controller can therefore support more modules, and thus increased system capacity. Programmable modules thus allow computer manufacturers to strike a desired balance between memory latency, capacity, and cost.

    Memory module and system supporting parallel and serial access modes

    公开(公告)号:US11049532B2

    公开(公告)日:2021-06-29

    申请号:US15721755

    申请日:2017-09-30

    Applicant: Rambus Inc.

    Abstract: A memory module can be programmed to deliver relatively wide, low-latency data in a first access mode, or to sacrifice some latency in return for a narrower data width, a narrower command width, or both, in a second access mode. The narrow, higher-latency mode requires fewer connections and traces. A controller can therefore support more modules, and thus increased system capacity. Programmable modules thus allow computer manufacturers to strike a desired balance between memory latency, capacity, and cost.

    Memory module and system supporting parallel and serial access modes

    公开(公告)号:US11562778B2

    公开(公告)日:2023-01-24

    申请号:US17328211

    申请日:2021-05-24

    Applicant: Rambus Inc.

    Abstract: A memory module can be programmed to deliver relatively wide, low-latency data in a first access mode, or to sacrifice some latency in return for a narrower data width, a narrower command width, or both, in a second access mode. The narrow, higher-latency mode requires fewer connections and traces. A controller can therefore support more modules, and thus increased system capacity. Programmable modules thus allow computer manufacturers to strike a desired balance between memory latency, capacity, and cost.

    MEMORY MODULE AND SYSTEM SUPPORTING PARALLEL AND SERIAL ACCESS MODES

    公开(公告)号:US20180090187A1

    公开(公告)日:2018-03-29

    申请号:US15721755

    申请日:2017-09-30

    Applicant: Rambus Inc.

    Abstract: A memory module can be programmed to deliver relatively wide, low-latency data in a first access mode, or to sacrifice some latency in return for a narrower data width, a narrower command width, or both, in a second access mode. The narrow, higher-latency mode requires fewer connections and traces. A controller can therefore support more modules, and thus increased system capacity. Programmable modules thus allow computer manufacturers to strike a desired balance between memory latency, capacity, and cost.

    TESTING THROUGH-SILICON-VIAS
    10.
    发明申请
    TESTING THROUGH-SILICON-VIAS 有权
    通过硅玻璃测试

    公开(公告)号:US20140376324A1

    公开(公告)日:2014-12-25

    申请号:US14241407

    申请日:2012-08-31

    Applicant: RAMBUS INC.

    Abstract: Embodiments generally relate to integrated circuit devices having through silicon vias (TSVs). In one embodiment, an integrated circuit (IC) device includes a field of TSVs and an address decoder that selectably couples at least one of the TSVs to at least one of a test input and a test evaluation circuit. In another embodiment, a method includes selecting one or more TSVs from a field of TSVs in at least one IC device, and coupling each selected TS V to at least one of a test input and a test evaluation circuit.

    Abstract translation: 实施例通常涉及具有硅通孔(TSV)的集成电路器件。 在一个实施例中,集成电路(IC)装置包括TSV的场和地址解码器,其将至少一个TSV可选地耦合到测试输入和测试评估电路中的至少一个。 在另一实施例中,一种方法包括从至少一个IC器件中的TSV领域中选择一个或多个TSV,以及将每个选择的TS V耦合到测试输入和测试评估电路中的至少一个。

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