公开(公告)号：US11653484B2

公开(公告)日：2023-05-16

申请号：US16678211

申请日：2019-11-08

Applicant: RAYTHEON COMPANY

Inventor： Mikhail Pevzner ,  James E. Benedict ,  Andrew R. Southworth ,  Wade A. Schwanda

IPC: H05K13/04 ,  H05K3/46 ,  H05K3/38 ,  H05K3/00 ,  B29C64/379 ,  B25J18/00

CPC classification number: H05K13/0409 ,  H05K3/38 ,  H05K3/465 ,  H05K3/4638 ,  H05K3/4679 ,  H05K13/0413 ,  B25J18/00 ,  B29C64/379 ,  B32B2457/08 ,  H05K3/0008 ,  H05K2203/167

Abstract: An apparatus to automatically place layers of a printed circuit board on a fixture includes a robotic device having a base that is secured to a surface, an upright column that extends upwardly from the base, and a movable arm rotatably coupled to the upright column. The movable arm is configured to rotate about a vertical axis defined by the upright column. The movable arm is further configured to rotate from a position in which the movable arm is disposed over a laminate sheet fixture and to pick up a laminate sheet to a position in which the movable arm is disposed over a board layup fixture to deposit the laminate sheet in the board layup fixture, and from a position in which the movable arm is disposed over a bond film fixture and to pick up a bond film to a position in which the movable arm is disposed over the board layup fixture to deposit the bond film in the board layup fixture.

公开(公告)号：US20210144892A1

公开(公告)日：2021-05-13

申请号：US16678211

申请日：2019-11-08

Applicant: RAYTHEON COMPANY

Inventor： Mikhail Pevzner ,  James E. Benedict ,  Andrew R. Southworth ,  Wade A. Schwanda

IPC: H05K13/04 ,  H05K3/38 ,  H05K3/46

Abstract: An apparatus to automatically place layers of a printed circuit board on a fixture includes a robotic device having a base that is secured to a surface, an upright column that extends upwardly from the base, and a movable arm rotatably coupled to the upright column. The movable arm is configured to rotate about a vertical axis defined by the upright column. The movable arm is further configured to rotate from a position in which the movable arm is disposed over a laminate sheet fixture and to pick up a laminate sheet to a position in which the movable arm is disposed over a board layup fixture to deposit the laminate sheet in the board layup fixture, and from a position in which the movable arm is disposed over a bond film fixture and to pick up a bond film to a position in which the movable arm is disposed over the board layup fixture to deposit the bond film in the board layup fixture.