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公开(公告)号：US09711459B2
公开(公告)日：2017-07-18
申请号：US15133995
申请日：2016-04-20
Applicant: RF Micro Devices, Inc.
Inventor： Bryan McChesney , John Avery Capwell , Mark Alan Crandall
IPC: H01L23/538 , H01L23/00
CPC classification number: H01L23/5389 , H01L23/5383 , H01L23/5384 , H01L24/09 , H01L24/32 , H01L2224/05082 , H01L2224/05124 , H01L2224/05144 , H01L2224/05147 , H01L2224/05155 , H01L2224/2919 , H01L2224/32225 , H01L2924/01073 , H01L2924/05042 , H01L2924/0535 , H01L2924/05442 , H01L2924/0665 , H01L2924/07025 , H01L2924/15153 , H01L2924/19011 , H01L2924/19041 , H01L2924/19042 , H01L2924/19104 , H01L2924/2064
Abstract: The present disclosure relates to a multi-layer substrate structure with an embedded die to miniaturize designs and improve performance. The multi-layer substrate structure includes a core layer having a cavity and a die mounted within the cavity. The die has a die body, a die conductive element on a top surface of the die body, and a dielectric layer over the die conductive element. The multi-layer substrate structure also includes a substrate conductive element formed over a portion of a top surface of the core layer and extending over at least a portion of the die conductive element. Overlapping portions of the die conductive element and the substrate conductive element are separated by the dielectric layer and form an electronic component.
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公开(公告)号：US20170025358A1
公开(公告)日：2017-01-26
申请号：US15133995
申请日：2016-04-20
Applicant: RF Micro Devices, Inc.
Inventor： Bryan McChesney , John Avery Capwell , Mark Alan Crandall
IPC: H01L23/538 , H01L23/00
CPC classification number: H01L23/5389 , H01L23/5383 , H01L23/5384 , H01L24/09 , H01L24/32 , H01L2224/05082 , H01L2224/05124 , H01L2224/05144 , H01L2224/05147 , H01L2224/05155 , H01L2224/2919 , H01L2224/32225 , H01L2924/01073 , H01L2924/05042 , H01L2924/0535 , H01L2924/05442 , H01L2924/0665 , H01L2924/07025 , H01L2924/15153 , H01L2924/19011 , H01L2924/19041 , H01L2924/19042 , H01L2924/19104 , H01L2924/2064
Abstract: The present disclosure relates to a multi-layer substrate structure with an embedded die to miniaturize designs and improve performance. The multi-layer substrate structure includes a core layer having a cavity and a die mounted within the cavity. The die has a die body, a die conductive element on a top surface of the die body, and a dielectric layer over the die conductive element. The multi-layer substrate structure also includes a substrate conductive element formed over a portion of a top surface of the core layer and extending over at least a portion of the die conductive element. Overlapping portions of the die conductive element and the substrate conductive element are separated by the dielectric layer and form an electronic component.
Abstract translation: 本公开涉及具有嵌入式管芯的多层衬底结构，以使设计小型化并提高性能。 多层基板结构包括具有空腔的核心层和安装在空腔内的管芯。 模具具有模具本体，在模具主体顶表面上的裸片导电元件，以及在芯片导电元件上的电介质层。 多层基板结构还包括在芯层的顶表面的一部分上形成并在芯片导电元件的至少一部分上延伸的衬底导电元件。 芯片导电元件和基板导电元件的重叠部分被电介质层分离并形成电子部件。
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公开(公告)号：US09799444B2
公开(公告)日：2017-10-24
申请号：US14840216
申请日：2015-08-31
Applicant: RF Micro Devices, Inc.
Inventor： Marcus Granger-Jones , John Robert Siomkos , Jeppe Korshøj Bendixen , John Avery Capwell , Jayanti Jaganatha Rao
CPC classification number: H01F38/14 , H01F21/12 , H01F2038/146 , H03H7/465 , H03H7/48
Abstract: This disclosure relates generally to directional couplers. In one embodiment, a directional coupler includes a first port, a second port, a third port, a first inductive element, a second inductive element, a first switchable path, and a second switchable path. The first inductive element is coupled between the first port and the second port, while the second inductive element is mutually coupled to the first inductive element. The first switchable path is configured to be opened and closed, wherein the first switchable path is coupled between a first location of the second inductive element and the third port. The second switchable path is configured to be opened and closed, wherein the second switchable path is coupled between a second location of the second inductive element and the third port. In this manner, a directivity of the directional coupler can be switched between a forward direction and a reverse direction.
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公开(公告)号：US20160065167A1
公开(公告)日：2016-03-03
申请号：US14840216
申请日：2015-08-31
Applicant: RF Micro Devices, Inc.
Inventor： Marcus Granger-Jones , John Robert Siomkos , Jeppe Korshøj Bendixen , John Avery Capwell , Jayanti Jaganatha Rao
CPC classification number: H01F38/14 , H01F21/12 , H01F2038/146 , H03H7/465 , H03H7/48
Abstract: This disclosure relates generally to directional couplers. In one embodiment, a directional coupler includes a first port, a second port, a third port, a first inductive element, a second inductive element, a first switchable path, and a second switchable path. The first inductive element is coupled between the first port and the second port, while the second inductive element is mutually coupled to the first inductive element. The first switchable path is configured to be opened and closed, wherein the first switchable path is coupled between a first location of the second inductive element and the third port. The second switchable path is configured to be opened and closed, wherein the second switchable path is coupled between a second location of the second inductive element and the third port. In this manner, a directivity of the directional coupler can be switched between a forward direction and a reverse direction.
Abstract translation: 本公开一般涉及定向耦合器。 在一个实施例中，定向耦合器包括第一端口，第二端口，第三端口，第一感应元件，第二感应元件，第一可切换路径和第二可切换路径。 第一电感元件耦合在第一端口和第二端口之间，而第二电感元件相互耦合到第一电感元件。 第一可切换路径被配置为打开和关闭，其中第一可切换路径耦合在第二电感元件的第一位置和第三端口之间。 第二可切换路径被配置为打开和关闭，其中第二可切换路径耦合在第二电感元件的第二位置和第三端口之间。 以这种方式，定向耦合器的方向性可以在正向和反向之间切换。
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