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    Probe card
    2.
    发明授权
    Probe card 有权
    探针卡

    公开(公告)号：US09410987B2

    公开(公告)日：2016-08-09

    申请号：US14598280

    申请日：2015-01-16

    Applicant: ROHM CO., LTD.

    Inventor： Goro Nakatani ,  Masahiro Sakuragi ,  Koichi Niino

    IPC: G01R1/073 ,  H05K3/40 ,  G01R31/26 ,  G01R3/00

    CPC classification number: G01R1/07307 ,  G01R1/07342 ,  G01R3/00 ,  G01R31/26 ,  H05K3/4084 ,  H05K2203/0195 ,  Y10T29/41 ,  Y10T29/49002 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49151 ,  Y10T29/49155 ,  Y10T29/49165

    Abstract: A probe card includes a board or silicon substrate; a plurality of probes (terminals) at a first surface of the board, the respective probes having a first extending portion extending along the first surface of the board; a plurality of through-holes formed in correspondence to the respective probes and penetrating between the first and second surfaces of the board; through electrodes embedded in the respective through-holes and conductively connected to the probes in the respective through-holes; and a wiring at the second surface of the board conductively connected to the through electrodes, the wiring having a second extending portion extending along the second surface of the board, wherein the first extending portion and the second extending portion extend in different directions from each other, and a space is formed across the entire width of the first extending portion between the first extending portion and the first surface of the board.

    Abstract translation: 探针卡包括基板或硅基板; 在所述板的第一表面处的多个探针（端子），所述各个探针具有沿所述板的所述第一表面延伸的第一延伸部分; 多个通孔，其形成为与所述各个探针对应并且穿过所述板的所述第一表面和所述第二表面之间; 通过嵌入相应通孔中的电极，并在相应的通孔中与探针导电连接; 以及在所述基板的与所述贯通电极导通的第二面的配线，所述布线具有沿着所述基板的第二面延伸的第二延伸部，所述第一延伸部和所述第二延伸部在彼此的不同方向上延伸 并且在第一延伸部分和第一表面之间的第一延伸部分的整个宽度上形成空间。

    METHOD FOR MANUFACTURING PROBE CARD, PROBE CARD, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND METHOD FOR FORMING PROBE
    3.
    发明申请
    METHOD FOR MANUFACTURING PROBE CARD, PROBE CARD, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND METHOD FOR FORMING PROBE 有权
    用于制造探针卡的方法，探针卡，制造半导体器件的方法和形成探针的方法

    公开(公告)号：US20150123691A1

    公开(公告)日：2015-05-07

    申请号：US14598280

    申请日：2015-01-16

    Applicant: ROHM CO., LTD.

    Inventor： Goro Nakatani ,  Masahiro Sakuragi ,  Koichi Niino

    IPC: G01R1/073 ,  G01R31/26

    CPC classification number: G01R1/07307 ,  G01R1/07342 ,  G01R3/00 ,  G01R31/26 ,  H05K3/4084 ,  H05K2203/0195 ,  Y10T29/41 ,  Y10T29/49002 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49151 ,  Y10T29/49155 ,  Y10T29/49165

    Abstract: Provided is a method for manufacturing a probe card which inspects electrical characteristics of a plurality of semiconductor devices in batch. The method includes: a step of forming a plurality of probes, which are to be brought into contact with external terminals of the semiconductor devices, on one side of a board which forms the base body of the probe card; a step of forming on the board, by photolithography and etching, a plurality of through-holes which reach the probes from the other side of the board; a step of forming, in the through-holes, through electrodes to be conductively connected with the probes, respectively; and a step of forming wiring, which is conductively connected with the through electrodes, on the other side of the board.

    Abstract translation: 提供一种用于制造分批检查多个半导体器件的电特性的探针卡的方法。 该方法包括：在形成探针卡的基体的基板的一侧上形成与半导体器件的外部端子接触的多个探针的步骤; 通过光刻和蚀刻在板上形成从板的另一侧到达探针的多个通孔的步骤; 在通孔中分别形成与探针导电连接的电极的步骤; 以及在所述板的另一侧上形成与所述贯通电极导电连接的布线的步骤。

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