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公开(公告)号：US11289571B2
公开(公告)日：2022-03-29
申请号：US16922109
申请日：2020-07-07
Applicant: ROHM CO., LTD.
Inventor： Keishi Watanabe
IPC: H01L29/06 , H01L23/00 , H01L27/08 , H01L29/866 , H01L27/02 , H01L27/07 , H01L29/40 , H01L29/861 , H01L29/66 , H01L29/868
Abstract: The present invention provides a diode chip, including: a semiconductor chip, including a p-type first semiconductor layer and an n-type second semiconductor layer formed on the first semiconductor layer; a first pad separation trench, formed on the semiconductor chip in a manner of penetrating the second semiconductor layer till reaching the first semiconductor layer, and forming a first internal parasitic capacitance between the first semiconductor layer and the second semiconductor layer by separating a portion of the semiconductor chip from other regions; an inter-insulation layer, covering the second semiconductor layer; and a first electrode layer, being opposite to the region separated by the first pad separation trench with the inter-insulation layer interposed in between, and forming, between the first electrode layer and the semiconductor chip, a first external parasitic capacitance connected in series to the first internal parasitic capacitance.
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公开(公告)号：US20200152380A1
公开(公告)日：2020-05-14
申请号：US16677591
申请日：2019-11-07
Applicant: ROHM CO., LTD.
Inventor： Keishi Watanabe
Abstract: The present disclosure provides a chip capacitor, including: a first capacitor unit formed over a substrate and including a first lower electrode, first dielectric layer and first upper electrode; a second insulating layer over the first capacitor unit; a second conductive layer over the second insulating layer, and includes a first wiring portion and a second wiring portion, the first wiring portion being connected to the first lower electrode by a first contact via and connected to a first pad by a third contact via, the second wiring portion being connected to the first upper electrode by a second contact via and connected to a second pad by a fourth contact via; a first external electrode connected to the first wiring portion; and a second external electrode connected to the second wiring portion.
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公开(公告)号：US10593480B2
公开(公告)日：2020-03-17
申请号：US16031212
申请日：2018-07-10
Applicant: ROHM CO., LTD.
Inventor： Hiroki Yamamoto , Keishi Watanabe , Hiroshi Tamagawa
IPC: H01G4/30 , H01L23/522 , H01L27/10 , H01L27/24 , H01L23/00 , H01L27/06 , H01L49/02 , H01G2/06 , H01G4/40 , H01L29/66 , H01L29/94 , H01L21/66 , H05K1/11 , H05K1/16 , H05K1/18 , H01G4/005 , H01G4/228 , H01G4/232 , H05K3/34
Abstract: A chip capacitor according to the present invention includes a substrate, a pair of external electrodes formed on the substrate, a capacitor element connected between the pair of external electrodes, and a bidirectional diode connected between the pair of external electrodes and in parallel to the capacitor element. Also, a circuit assembly according to the present invention includes the chip capacitor according to the present invention and a mounting substrate having lands, soldered to the external electrodes, on a mounting surface facing a front surface of the substrate.
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公开(公告)号：US09773588B2
公开(公告)日：2017-09-26
申请号：US14713684
申请日：2015-05-15
Applicant: ROHM CO., LTD.
Inventor： Takuma Shimoichi , Yasuhiro Kondo , Keishi Watanabe , Takamichi Torii , Katsuya Matsuura
CPC classification number: H01C1/01 , H01C1/02 , H01C1/14 , H01C1/142 , H01C7/006 , H01C13/02 , H01C17/267 , H01F17/0006 , H01F27/2804 , H01F27/292 , H01F2017/0026 , H01G4/228 , H01G4/30 , H01G4/33 , H01L23/5228 , H01L23/647 , H01L28/20 , H05K1/0293 , H05K1/162 , H05K1/165 , H05K1/167
Abstract: A chip part is provided that includes a substrate 2 in which an element region 5 and an electrode region 16 are set, an insulating film (a first insulating film 9 and a second insulating film 3) which is formed on the substrate 2 and which selectively includes an internal concave/convex structure 18 in the electrode region 16 on a surface, a first connection electrode 3 and a second connection electrode 4 which include, at a bottom portion, an anchor portion 24 entering the concave portion 17 of the internal concave/convex structure 18 and which include an external concave/convex structure 6, 7 on a surface on the opposite side and a circuit element which is disposed in the element region 5 and which is electrically connected to the first connection electrode 3 and the second connection electrode 4.
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公开(公告)号：US12113064B2
公开(公告)日：2024-10-08
申请号：US17018486
申请日：2020-09-11
Applicant: ROHM CO., LTD.
Inventor： Keishi Watanabe , Junya Yamagami
IPC: H01L27/08 , H01L29/861 , H01L29/866
CPC classification number: H01L27/0814 , H01L29/861 , H01L29/866
Abstract: The present disclosure provides a diode chip capable of attaining excellent electrical characteristics.
The present disclosure provides a diode chip (1), including: a semiconductor chip (10) having a first main surface (11); a first pin junction portion (31) formed on a surface of the first main surface (11) with a first polarity direction; a first diode pair (37) (rectifier pair) including a first pn junction portion (35) separated from the first pin junction portion (31) and formed in the semiconductor chip (10) with the first polarity direction and a first reversed pin junction portion (38) connected to the first pn junction portion (35) in reversed direction and formed on the first main surface (11) with a second polarity direction; and a first junction separation trench (46) formed on the first main surface (11) in a manner of separating the first pin junction portion (31) and the first diode pair (37).-
Patent Agency Ranking
公开(公告)号：US10681815B2
公开(公告)日：2020-06-09
申请号：US16286503
申请日：2019-02-26
Applicant: ROHM CO., LTD.
Inventor： Hiroshi Tamagawa , Koichi Niino , Eiji Nukaga , Keishi Watanabe
IPC: H05K1/18 , H01C1/14 , H01G4/228 , H05K1/11 , H05K5/02 , H01C1/012 , H01G2/06 , H05K3/34 , H01G4/40
Abstract: The composite chip component includes: plurality of chip elements which are disposed so as to be mutually spaced apart upon a common substrate, and which have mutually different functions; and a pair of electrodes which, in each of the chip elements, are formed on the surface of the substrate. As a result, it is possible to reduce the bond area (footprint) for the mounting substrate, and therefore, it is possible to provide a composite chip component capable of achieving efficiency of mounting operation.
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公开(公告)号：US11101071B2
公开(公告)日：2021-08-24
申请号：US16677591
申请日：2019-11-07
Applicant: ROHM CO., LTD.
Inventor： Keishi Watanabe
Abstract: The present disclosure provides a chip capacitor, including: a first capacitor unit formed over a substrate and including a first lower electrode, first dielectric layer and first upper electrode; a second insulating layer over the first capacitor unit; a second conductive layer over the second insulating layer, and includes a first wiring portion and a second wiring portion, the first wiring portion being connected to the first lower electrode by a first contact via and connected to a first pad by a third contact via, the second wiring portion being connected to the first upper electrode by a second contact via and connected to a second pad by a fourth contact via; a first external electrode connected to the first wiring portion; and a second external electrode connected to the second wiring portion.
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公开(公告)号：US10706993B2
公开(公告)日：2020-07-07
申请号：US15703954
申请日：2017-09-13
Applicant: ROHM CO., LTD.
Inventor： Takuma Shimoichi , Yasuhiro Kondo , Keishi Watanabe , Takamichi Torii , Katsuya Matsuura
IPC: H01F27/28 , H01C1/01 , H01F27/29 , H01G4/30 , H01G4/228 , H01F17/00 , H01C1/02 , H05K1/02 , H01C17/26 , H05K1/16 , H01C1/142 , H01C7/00 , H01L23/522 , H01C13/02 , H01L49/02 , H01G4/33 , H01C1/14
Abstract: A chip part is provided that includes a substrate in which an element region and an electrode region are set, an insulating film (a first insulating film and a second insulating film) which is formed on the substrate and which selectively includes an internal concave/convex structure in the electrode region on a surface, a first connection electrode and a second connection electrode which include, at a bottom portion, an anchor portion entering the concave portion of the internal concave/convex structure and which include an external concave/convex structure on a surface on the opposite side and a circuit element which is disposed in the element region and which is electrically connected to the first connection electrode and the second connection electrode.
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公开(公告)号：US09685273B2
公开(公告)日：2017-06-20
申请号：US15051648
申请日：2016-02-23
Applicant: ROHM CO., LTD.
Inventor： Hiroki Yamamoto , Keishi Watanabe , Hiroshi Tamagawa
IPC: H01L27/00 , H01G4/30 , H01L23/522 , H01L27/10 , H01L27/24 , H01L23/00 , H01G4/40 , H01L29/66 , H01L29/94 , H01G2/06 , H05K1/11 , H05K1/16 , H05K1/18 , H01L21/66 , H01L27/06 , H01G4/005 , H01G4/228 , H01G4/232
CPC classification number: H01G4/30 , H01G2/06 , H01G4/005 , H01G4/228 , H01G4/232 , H01G4/40 , H01L22/14 , H01L22/20 , H01L23/5223 , H01L24/48 , H01L24/49 , H01L27/0629 , H01L27/0676 , H01L27/101 , H01L27/2409 , H01L28/40 , H01L29/66189 , H01L29/94 , H01L2224/05644 , H01L2224/05655 , H01L2224/05664 , H01L2224/48227 , H01L2224/49175 , H01L2924/00014 , H01L2924/0002 , H05K1/111 , H05K1/162 , H05K1/18 , H05K1/181 , H05K3/3436 , H05K2201/10015 , H05K2201/10045 , Y02P70/611 , H01L2924/00 , H01L2224/05599 , H01L2224/45099 , H01L2224/85399
Abstract: A chip capacitor according to the present invention includes a substrate, a pair of external electrodes formed on the substrate, a capacitor element connected between the pair of external electrodes, and a bidirectional diode connected between the pair of external electrodes and in parallel to the capacitor element. Also, a circuit assembly according to the present invention includes the chip capacitor according to the present invention and a mounting substrate having lands, soldered to the external electrodes, on a mounting surface facing a front surface of the substrate.
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公开(公告)号：US10607779B2
公开(公告)日：2020-03-31
申请号：US15492109
申请日：2017-04-20
Applicant: ROHM CO., LTD.
Inventor： Keishi Watanabe , Yasuhiro Kondo
Abstract: A chip capacitor includes a substrate having a main surface, a first conductive film including a first connecting region and a first capacitor forming region and formed on the main surface of the substrate, a dielectric film covering the first capacitor forming region of the first conductive film, a second conductive film including a second connecting region facing to the first capacitor forming region of the first conductive film across the dielectric film, and a second capacitor forming region facing to the first capacitor forming region of the first conductive film across the dielectric film, a first external electrode electrically connected to the first connecting region of the first conductive film, and a second external electrode electrically connected to the second connecting region of the second conductive film.
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