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    APPARATUS, METHODS, COMPUTER PROGRAMS AND NON-TRANSITORY COMPUTER READABLE STORAGE MEDIUMS FOR MACHINING OBJECTS
    1.
    发明申请
    APPARATUS, METHODS, COMPUTER PROGRAMS AND NON-TRANSITORY COMPUTER READABLE STORAGE MEDIUMS FOR MACHINING OBJECTS 审中-公开
    装置，方法，计算机程序和非终端计算机可读存储介质加工对象

    公开(公告)号：US20170075338A1

    公开(公告)日：2017-03-16

    申请号：US15235735

    申请日：2016-08-12

    Applicant: ROLLS-ROYCE PLC

    Inventor： Manikanta Saravanan RAJARATHINAM ,  Wu Xin Charles NG ,  Vigneshwaran RAMALINGAM

    IPC: G05B19/402

    CPC classification number: G05B19/402 ,  B23Q15/013 ,  B24B19/14 ,  B24B21/12 ,  B24B21/165 ,  B24B21/18 ,  B24B49/003 ,  B24B49/10 ,  B24B49/12 ,  B24B51/00 ,  B24D5/02 ,  B24D5/10 ,  G05B2219/32105 ,  G05B2219/39246 ,  G05B2219/50049

    Abstract: Apparatus for machining an object, the apparatus comprising: a wheel including; a first circular surface; a second circular surface oriented parallel to the first circular surface; a first rim surface extending from the first circular surface at a first edge, a gradient of the first rim surface having a radial component; and a second rim surface extending from the second circular surface at a second edge and towards the first rim surface, a gradient of the second rim surface having a radial component, the first edge defining a curved surface between the first circular surface and the first rim surface, and the second edge defining a curved surface between the second circular surface and the second rim surface.

    Abstract translation: 一种用于加工物体的装置，所述装置包括：轮，包括： 第一个圆形表面; 平行于所述第一圆形表面定向的第二圆形表面; 在第一边缘处从第一圆形表面延伸的第一边缘表面，第一边缘表面的梯度具有径向分量; 以及第二边缘表面，其在第二边缘处从所述第二圆形表面延伸并且朝向所述第一边缘表面，所述第二边缘表面的梯度具有径向分量，所述第一边缘在所述第一圆形表面和所述第一边缘之间限定弯曲表面 表面，并且第二边缘在第二圆形表面和第二边缘表面之间限定弯曲表面。

    LAYER DEBONDING
    2.
    发明申请
    LAYER DEBONDING 审中-公开

    公开(公告)号：US20200164626A1

    公开(公告)日：2020-05-28

    申请号：US16690321

    申请日：2019-11-21

    Applicant: ROLLS-ROYCE plc

    Inventor： Wu Xin Charles NG ,  Dharun VADUGAPPATTY SRINIVASAN ,  Atin AGGARWAL ,  Sridhar IDAPALAPATI

    IPC: B32B43/00 ,  B26D3/28

    Abstract: A method (1800) of debonding a first layer (404) from a second layer (408), wherein the first layer (404) is bonded to the second layer (408) by an adhesive (410) located between the first and second layers, comprises: inserting (1804) a blade (602) of a cleaving tool (600) between the first and second layers (404, 408); and exerting (1806) a controlled force on the cleaving tool (600) to move the cleaving tool so as to de-bond the first and second layers (404, 408) in a region, wherein the force exerted is controlled to match a de-bonding force calculated for the region, and such that the movement of the cleaving tool (600) stops if the calculated force is less than force required to move the cleaving tool (600) and continued if the calculated force is higher than or equal to the force required to move the cleaving tool.

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