公开(公告)号：US07215030B2

公开(公告)日：2007-05-08

申请号：US11167425

申请日：2005-06-27

申请人： Raj N. Master ,  Srinivasan Ashok Anand ,  Srinivasan Parthasarathy ,  Yew Cheong Mui

发明人： Raj N. Master ,  Srinivasan Ashok Anand ,  Srinivasan Parthasarathy ,  Yew Cheong Mui

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： C22C13/02 ,  B23K35/262 ,  H01L23/49811 ,  H01L24/81 ,  H01L24/97 ,  H01L2224/16225 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/97 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15312 ,  H01L2924/19105 ,  H05K3/3463 ,  H05K2201/10318 ,  H05K2201/10674 ,  H05K2203/047 ,  H01L2224/81 ,  H01L2224/0401

摘要： A package substrate includes die solder pads and pin solder fillets. The pin solder fillets might comprise between approximately 90 wt % to approximately 99 wt % tin and approximately 10 wt % to 1 wt % antimony. The die solder pads might comprise between approximately 4 wt % to approximately 8 wt % bismuth, approximately 2 wt % to approximately 4 wt % silver, approximately 0 wt % to approximately 0.7 wt % copper, and approximately 87 wt % to approximately 92 wt % tin. The die solder pads might comprise between approximately 7 wt % to approximately 20 wt % indium, between approximately 2 wt % to approximately 4.5 wt % silver, between approximately 0 wt % to approximately 0.7 wt % copper, between approximately 0 wt % to approximately 0.5 wt % antimony, and between approximately 74.3 wt % to approximately 90 wt % tin.

摘要翻译： 封装衬底包括管芯焊盘和焊脚焊脚。 针焊料焊片可以包含约90重量％至约99重量％的锡和约10重量％至1重量％的锑。 模焊盘可以包括约4重量％至约8重量％的铋，约2重量％至约4重量％的银，约0重量％至约0.7重量％的铜，以及约87重量％至约92重量％ 锡。 模焊盘可以包括约7重量％至约20重量％的铟，约2重量％至约4.5重量％的银之间，约0重量％至约0.7重量％的铜之间，约0重量％至约0.5重量％ 重量锑，以及约74.3重量％至约90重量％的锡。