摘要:
A package substrate includes die solder pads and pin solder fillets. The pin solder fillets might comprise between approximately 90 wt % to approximately 99 wt % tin and approximately 10 wt % to 1 wt % antimony. The die solder pads might comprise between approximately 4 wt % to approximately 8 wt % bismuth, approximately 2 wt % to approximately 4 wt % silver, approximately 0 wt % to approximately 0.7 wt % copper, and approximately 87 wt % to approximately 92 wt % tin. The die solder pads might comprise between approximately 7 wt % to approximately 20 wt % indium, between approximately 2 wt % to approximately 4.5 wt % silver, between approximately 0 wt % to approximately 0.7 wt % copper, between approximately 0 wt % to approximately 0.5 wt % antimony, and between approximately 74.3 wt % to approximately 90 wt % tin.
摘要:
A method for forming a solder joint for a package arrangement with a dispersed Sn microstructure provides a flip chip on a package, with a flip chip having solder bumps to be connected by eutectic solder joints to pads on the package. The eutectic solder is reflowed at a solder bump/pad interface with a eutectic reflow profile that is configured to achieve eutectic solder joints having substantially evenly distributed Sn grains. The eutectic reflow profile includes an increased cooling rate and decreased hold time with a higher peak temperature. A defined ratio of the pad openings in the solder mask to the under bump metallurgy is provided. The eutectic reflow profile and the defined ratio prolong fatigue life in the package arrangement.
摘要:
According to an exemplary embodiment of the present invention, a method to configure a network of classifiers includes configuring a plurality of classifiers in a network of classifiers, such that the configuring associates a plurality of operating points with each output branch, associating a different quality profile with each output point for each output branch in the plurality of classifiers, and storing the configured network of classifiers and quality profile associations in the computer system to be used for classifying future input data according to the network configuration and quality profile association. Each classifier comprises executable code that classifies the data. Each of said classifiers has a plurality of the output branches that each output the data to another classifier. Each operating point comprises a probability of determining that a data item input to the classifier has a particular characteristic and a probability that said determination falsely detected the characteristic.
摘要:
A program interface which provides access from a business management application to an accounting application to share account information. As described in illustrative embodiments, the system includes an interface module to instantiate and invoke an interface from the business management application to generate an accounting record from an opportunity or prospect record in the business management application. Thus, the accounting record is generated through the interface from the business management application to eliminate the need for duplicate data entry in the accounting application.
摘要:
The present invention describes a method and system for optimizing a test flow within each ATE (Automated Test Equipment) station. The test flow includes a plurality of test blocks. A test block includes a plurality of individual tests. A computing system schedule the test flow based one or more of: a test failure model, test block duration and a yield model. The failure model determines an order or sequence of the test blocks. There are at least two failure models: independent failure model and dependant failure model. The yield model describes whether a semiconductor chip is defective or not. Upon completing the scheduling, the ATE station conducts tests according to the scheduled test flow. The present invention can also be applied to software testing.
摘要:
An edge-covering based greedy method for shared filter ordering includes receiving a plurality of queries, wherein each query is a conjunction of filters, and each filter is shared across multiple queries of the plurality of queries, evaluating a unit price of each filter, evaluating, sequentially, each filter in order of a lowest to a highest unit price, to determine a value for each filter, and changing an ordering of the filters according to the values. An edge-covering based harmonic method for shared filter ordering includes receiving a plurality of queries, wherein each query is a conjunction of filters, and each filter is shared across multiple queries of the plurality of queries, evaluating a weight of each filter, evaluating, randomly, each filter having a probability inversely proportionally to its weight, to determine a value, and changing an ordering of the filters according to the values.
摘要:
An edge-covering based greedy method for shared filter ordering includes receiving a plurality of queries, wherein each query is a conjunction of filters, and each filter is shared across multiple queries of the plurality of queries, evaluating a unit price of each filter, evaluating, sequentially, each filter in order of a lowest to a highest unit price, to determine a value for each filter, and changing an ordering of the filters according to the values.An edge-covering based harmonic method for shared filter ordering includes receiving a plurality of queries, wherein each query is a conjunction of filters, and each filter is shared across multiple queries of the plurality of queries, evaluating a weight of each filter, evaluating, randomly, each filter having a probability inversely proportionally to its weight, to determine a value, and changing an ordering of the filters according to the values.
摘要:
A package substrate includes die solder pads and pin solder fillets. The pin solder fillets might comprise between approximately 90 wt % to approximately 99 wt % tin and approximately 10 wt % to 1 wt % antimony. The die solder pads might comprise between approximately 4 wt % to approximately 8 wt % bismuth, approximately 2 wt % to approximately 4 wt % silver, approximately 0 wt % to approximately 0.7 wt % copper, and approximately 87 wt % to approximately 92 wt % tin. The die solder pads might comprise between approximately 7 wt % to approximately 20 wt % indium, between approximately 2 wt % to approximately 4.5 wt % silver, between approximately 0 wt % to approximately 0.7 wt % copper, between approximately 0 wt % to approximately 0.5 wt % antimony, and between approximately 74.3 wt % to approximately 90 wt % tin.
摘要:
A horizontal anomaly detection method includes receiving at plurality of objects described in a plurality of information sources, wherein each individual information source captures a plurality of similarity relationships between the objects, combining the information sources to determine a similarity matrix whose entries represent quantitative scores of similarity between pairs of the objects, and identifying at least one horizontal anomaly of the objects within the similarity matrix, wherein the horizontal anomalies are anomalous relationships across the plurality of information sources.
摘要:
A method and system for configuring an instance of a business information application program based on data exported from an instance of the application program is provided. Each instance of the application program has a database storing an organizations' business data. Template providers desiring to provide a template containing configuration and instance data to organizations using the application program may use the application program to set up configuration and instance data for a particular type of organization. Once the database is populated with configuration and instance data, the template provider can use an export function to export the configuration and instance data to a template file. The template file is then provided to an organization that wants to initialize its database based on the template. The organization uses an import function to import configuration and instance data from the template into the organization's database.