公开(公告)号：US20050275089A1

公开(公告)日：2005-12-15

申请号：US10864909

申请日：2004-06-09

申请人： Rajeev Joshi ,  Maria Estacio ,  David Chong ,  B. H. Gooi ,  Stephen Martin

发明人： Rajeev Joshi ,  Maria Estacio ,  David Chong ,  B. H. Gooi ,  Stephen Martin

IPC分类号： H01L21/48 ,  H01L23/24 ,  H01L23/31 ,  H01L23/34 ,  H01L23/433 ,  H01L23/495

CPC分类号： H01L23/4334 ,  H01L23/3107 ,  H01L23/49548 ,  H01L23/49551 ,  H01L24/29 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/05647 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48471 ,  H01L2224/48479 ,  H01L2224/73265 ,  H01L2224/83805 ,  H01L2224/85051 ,  H01L2224/85399 ,  H01L2224/85986 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2224/85186 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/48227 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/4554

摘要： An integrated circuit assembly includes a lead frame having a plurality of leads with inner portions. A thermally-conductive clip member is bonded to the inner portions of the leads such that the clip member is electrically isolated from and yet thermally coupled to the lead frame. An integrated circuit die is bonded and thereby thermally coupled to the clip member. The die is electrically connected to the wire die by wire bonds. Encapsulant material is disposed over the inner portions of the leads and at least a portion of the clip member, and encapsulates the die and the wire bonds.

摘要翻译： 集成电路组件包括具有多个具有内部部分的引线的引线框架。 导热夹构件结合到引线的内部，使得夹构件与引线框架电隔离并且热耦合到引线框架。 集成电路芯片被结合，从而热耦合到夹子构件。 模具通过引线键与导线管芯电连接。 封装材料设置在引线的内部部分和夹子构件的至少一部分上，并封装模具和引线接合。