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公开(公告)号：US20180091987A1
公开(公告)日：2018-03-29
申请号：US15280986
申请日：2016-09-29
申请人： Ralph V. Miele , Eduardo Escamilla , James Utz , James M. Yoder , Tongyan Zhai , Baomin Liu , Meenakshi Gupta , Brian R. Peil , Venkat R. Gaurav , Drew G. Damm , Andrew Larson , Ricky O. Branner , Steven J. Lofland , George H. Daskalakis , James C. Raupp , Michael Ahrens , David Pidwerbecki , Bo Qiu , Stacy L. Yee
发明人： Ralph V. Miele , Eduardo Escamilla , James Utz , James M. Yoder , Tongyan Zhai , Baomin Liu , Meenakshi Gupta , Brian R. Peil , Venkat R. Gaurav , Drew G. Damm , Andrew Larson , Ricky O. Branner , Steven J. Lofland , George H. Daskalakis , James C. Raupp , Michael Ahrens , David Pidwerbecki , Bo Qiu , Stacy L. Yee
CPC分类号： H04W4/50 , G06F1/1613
摘要： Disclosed is a mobile device. The mobile device may be located proximate a mobile terminal and controlled by the mobile terminal. The mobile device may include a processor and a memory. The memory may store instructions that, when executed by the processor, cause the processor to: determine a mode of operation of the mobile device, determine a thermal profile for the mode of operation of the mobile device, and implement a power profile to achieve the thermal profile.
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公开(公告)号：US10412560B2
公开(公告)日：2019-09-10
申请号：US15280986
申请日：2016-09-29
申请人： Ralph V. Miele , Eduardo Escamilla , James Utz , James M. Yoder , Tongyan Zhai , Baomin Liu , Meenakshi Gupta , Brian R Peil , Venkat R Gaurav , Drew G Damm , Andrew Larson , Ricky O Branner
发明人： Ralph V. Miele , Eduardo Escamilla , James Utz , James M. Yoder , Tongyan Zhai , Baomin Liu , Meenakshi Gupta , Brian R Peil , Venkat R Gaurav , Drew G Damm , Andrew Larson , Ricky O Branner
摘要： Disclosed is a mobile device. The mobile device may be located proximate a mobile terminal and controlled by the mobile terminal. The mobile device may include a processor and a memory. The memory may store instructions that, when executed by the processor, cause the processor to: determine a mode of operation of the mobile device, determine a thermal profile for the mode of operation of the mobile device, and implement a power profile to achieve the thermal profile.
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公开(公告)号：US10720783B2
公开(公告)日：2020-07-21
申请号：US15756053
申请日：2015-09-25
申请人： Intel Corporation , Stephen John Allen , Gregory A. Peek , Yoshifumi Nishi , Rolf Laido , Shaun Gerrit Immeker , Kerry A. Stevens , Andrew Larson , Ralph V. Miele , Kimi Jensen , Duck Young Kong , Dan H. Gerbus
发明人： Stephen John Allen , Gregory A. Peek , Yoshifumi Nishi , Rolf Laido , Shaun Gerrit Immeker , Kerry A. Stevens , Andrew Larson , Ralph V. Miele , Kimi Jensen , Duck Young Kong , Dan H. Gerbus
摘要： Particular embodiments described herein provide for an electronic device, that includes a first housing and a wireless charging stand. The first housing can include a display. The wireless charging stand can include a power receiving unit and is configured to wireless charge the electronic device and support the first housing at different viewing angles of the display.
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公开(公告)号：US20180358826A1
公开(公告)日：2018-12-13
申请号：US15756053
申请日：2015-09-25
申请人： Stephen John ALLEN , Gregory A. PEEK , Yoshifumi NISHI , Rolf LAIDO , Shaun Gerrit IMMEKER , Kerry A. STEVENS , Andrew LARSON , Ralph V. MIELE , Kimi JENSEN , Duck Young KONG , Dan H. GERBUS , Intel Corporation
发明人： Stephen John Allen , Gregory A. Peek , Yoshifumi Nishi , Rolf Laido , Shaun Gerrit Immeker , Kerry A. Stevens , Andrew Larson , Ralph V. Miele , Kimi Jensen , Duck Young Kong , Dan H. Gerbus
摘要： Particular embodiments described herein provide for an electronic device, that includes a first housing and a wireless charging stand. The first housing can include a display. The wireless charging stand can include a power receiving unit and is configured to wireless charge the electronic device and support the first housing at different viewing angles of the display.
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公开(公告)号：US20170285603A1
公开(公告)日：2017-10-05
申请号：US15088750
申请日：2016-04-01
申请人： Dan H. Gerbus , Ralph V. Miele
发明人： Dan H. Gerbus , Ralph V. Miele
IPC分类号： G05B19/042
CPC分类号： G05B19/0428 , G05B15/02 , G05B2219/25011
摘要： A sensor system including a remote sensor and an integrated system on a chip (“SOC”) or controller. The remote sensor can be integrated into the light switch to monitor the area adjacent the light switch, where the light switch can visually disguise the remote sensor to minimize any undesirable aesthetic appearances created by the remote sensor. As light switches are ordinarily positioned high on a wall to be easily accessible, the concealed remote sensor also positioned to make optimal measurements of the area adjacent the light switch. The SOC can process measurements for the remote sensor and provide a control signal for an HVAC controller or other building system. The SOC can permit the sensor system to operate as a localized controller that can operate building systems to control conditions adjacent the sensor system.
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公开(公告)号：US20240240688A1
公开(公告)日：2024-07-18
申请号：US18620216
申请日：2024-03-28
申请人： Phil Geng , Prabhakar Subrahmanyam , Vishnu Prasadh Sugumar , Jacob McMillian , Ralph V. Miele , Ying-Feng Pang , David Shia
发明人： Phil Geng , Prabhakar Subrahmanyam , Vishnu Prasadh Sugumar , Jacob McMillian , Ralph V. Miele , Ying-Feng Pang , David Shia
CPC分类号： F16F9/50 , G01V1/36 , H05K7/20236 , H05K7/20272 , H05K7/20281 , F16F2230/08 , F16F2230/18 , G01V2210/144 , G01V2210/6222
摘要： In some embodiments, an immersion cooling system comprises a spring damper, a crumple block, a frictional layer, and/or preloaded spring-based mounts to mitigate the effects of seismic events. In other embodiments, the combined mass of liquids in the immersion tank and a compensation tank is kept constant to maintain the system's response to seismic events. In still other embodiments, an immersion cooling system comprises a tunable mass to provide an active response to seismic events. In yet other embodiments, an immersion tank is located within a housing pallet and is moveable within the palette. Spring dampers dampen tank movement within the pallet and shutoff switches housed in the pallet cause power to components in the tank to be shut off in response to tank movement. Cooling liquid can be transferred from the tank to a secondary reservoir to avoid cooling liquid loss and protect the tank.
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公开(公告)号：US20170287309A1
公开(公告)日：2017-10-05
申请号：US15089272
申请日：2016-04-01
申请人： Dan H. Gerbus , Ralph V. Miele
发明人： Dan H. Gerbus , Ralph V. Miele
CPC分类号： G08B21/182 , G08B19/005 , G08B21/14 , G08B27/001
摘要： A detection system having a threshold sensor for detecting indices of an emergency event in a space and a persistent sensor for continually gathering information within a space. The detection system can monitor the space to determine if an emergency event is occurring and continue to collect information regarding the space. The collected information can be transmitted to rescue workers to provide real time or updated information on people present in the space and their condition or other information.
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公开(公告)号：US20240133945A1
公开(公告)日：2024-04-25
申请号：US18401133
申请日：2023-12-29
申请人： Mohanraj Prabhugoud , David Shia , Lejie Liu , Silver Alfonso Rodriguez Estrada , Min Pei , Ralph V. Miele , Caleb Million Tessema
发明人： Mohanraj Prabhugoud , David Shia , Lejie Liu , Silver Alfonso Rodriguez Estrada , Min Pei , Ralph V. Miele , Caleb Million Tessema
IPC分类号： G01R31/28
CPC分类号： G01R31/2863 , G01R31/2808 , G01R31/2886
摘要： A low level contact resistance (LLCR) testing apparatus comprises a test board, an interface board, and a patch board. The test board comprises a processor socket. The interface board connects to both the test board and the patch board. The patch board connects to a contact resistance tester. An LLCR system comprising the LLCR testing apparatus and a contact resistance tester can be portable. The test board can accommodate thermal management solutions of varying sizes and types. Different test board designs can accommodate different socket-processor configurations and the different test boards can be easily accommodated by an LLCR testing apparatus due to its modular design.
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公开(公告)号：US20240349457A1
公开(公告)日：2024-10-17
申请号：US18754759
申请日：2024-06-26
申请人： Phil Geng , David Shia , Donald Tiendung Tran , James Trevor Goulding , Jeffory L. Smalley , Ralph V. Miele , Sanjoy Kumar Saha , Jing-Hua He , Steven Adam Klein , Ethan Russell Long , Andres Ramirez Macias , Irving Joseph Castro Guzman
发明人： Phil Geng , David Shia , Donald Tiendung Tran , James Trevor Goulding , Jeffory L. Smalley , Ralph V. Miele , Sanjoy Kumar Saha , Jing-Hua He , Steven Adam Klein , Ethan Russell Long , Andres Ramirez Macias , Irving Joseph Castro Guzman
IPC分类号： H05K7/20
CPC分类号： H05K7/2039 , H05K7/20709
摘要： Damping assemblies for heat sinks and related methods are disclosed. An example apparatus includes a chassis; a first heat sink associated with an electronic component in the chassis; a second heat sink coupled to the first heat sink, the second heat sink spaced apart from the first heat sink in the chassis; and damping material proximate to the second heat sink.
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