公开(公告)号：US07462926B2

公开(公告)日：2008-12-09

申请号：US11293711

申请日：2005-12-01

申请人： Ran Fu ,  Deming Liu ,  Yiu Fai Kwan

发明人： Ran Fu ,  Deming Liu ,  Yiu Fai Kwan

IPC分类号： H01L23/495 ,  H01L21/00 ,  B32B15/00

CPC分类号： H01L23/49582 ,  H01L2924/00014 ,  H01L2924/0002 ,  Y10T428/12694 ,  Y10T428/12708 ,  Y10T428/12771 ,  Y10T428/12882 ,  Y10T428/12903 ,  H01L2224/45099 ,  H01L2924/00

摘要： A method of producing a leadframe is provided, the method including the steps of providing a substrate, plating the substrate with a layer of tin, plating a layer of nickel over the layer of tin, and thereafter plating one or more protective layers over the layer of nickel. The leadframe may thereafter be heated to produce one or more intermetallic layers comprising tin, which impedes the out-diffusion of copper from a base material of the leadframe to the surface thereof.

摘要翻译： 提供一种制造引线框架的方法，该方法包括以下步骤：提供基板，用锡层镀基材，在锡层上镀镍层，然后在该层上镀覆一层或多层保护层 的镍。 引线框架之后可以被加热以产生包含锡的一个或多个金属间层，其阻止铜从引线框架的基底材料向其表面的向外扩散。

公开(公告)号：US07329617B2

公开(公告)日：2008-02-12

申请号：US11019421

申请日：2004-12-22

申请人： Jianxiong Li ,  Chi Chuen Chaw ,  Ngai Kin Tsui ,  Deming Liu ,  Yiu Fai Kwan ,  Wai Chan

发明人： Jianxiong Li ,  Chi Chuen Chaw ,  Ngai Kin Tsui ,  Deming Liu ,  Yiu Fai Kwan ,  Wai Chan

IPC分类号： H01L21/31

CPC分类号： H01L23/3142 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2924/12044 ,  H01L2924/00014 ,  H01L2924/00

摘要： A method is provided for enhancing adhesion between a molding compound and a semiconductor device comprising a semiconductor chip attached on a carrier, such as a lead frame, by coating the semiconductor device with a polymer primer prior to molding the semiconductor device. Such coating may be performed by dipping, dripping or spraying the semiconductor device in or with a polymer solution.

摘要翻译： 提供了一种通过在模制半导体器件之前通过用聚合物底漆涂覆半导体器件来提高模制化合物和半导体器件之间的粘合性的方法，该半导体器件包括安装在诸如引线框架的载体上的半导体芯片。 可以通过在聚合物溶液中或与聚合物溶液中浸渍，滴加或喷涂半导体器件来进行这种涂覆。

公开(公告)号：US07125750B2

公开(公告)日：2006-10-24

申请号：US10994790

申请日：2004-11-22

申请人： Yiu Fai Kwan ,  Wai Chan

发明人： Yiu Fai Kwan ,  Wai Chan

IPC分类号： H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC分类号： H01L23/49582 ,  H01L24/45 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01047 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/00 ,  H01L2224/48

摘要： A leadframe having a metallic substrate and comprising layers of plated material, and a method of manufacturing said leadframe are provided. The substrate is plated with a layer of oxidizable material comprising nickel and a noble metal is selectively plated on the layer of oxidizable material. Thereafter, an exposed portion of the oxidizable material that is not plated with the noble metal is passivated to enhance adhesion of an encapsulation compound molded to the leadframe.

摘要翻译： 提供了具有金属基底并包括镀层材料层的引线框，以及制造所述引线框架的方法。 该衬底镀有包含镍的可氧化材料层，并且贵金属被选择性地镀在可氧化材料层上。 此后，将未镀有贵金属的可氧化材料的暴露部分钝化，以增强模塑到引线框架的封装化合物的粘合性。

公开(公告)号：US08012886B2

公开(公告)日：2011-09-06

申请号：US11683234

申请日：2007-03-07

申请人： Yiu Fai Kwan ,  Tat Chi Chan ,  Wai Chan ,  Chi Chung Lee

发明人： Yiu Fai Kwan ,  Tat Chi Chan ,  Wai Chan ,  Chi Chung Lee

IPC分类号： H01L21/31

CPC分类号： C22C1/00 ,  H01L21/4821 ,  H01L23/49582 ,  H01L23/49586 ,  H01L24/45 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48247 ,  H01L2224/48639 ,  H01L2224/48655 ,  H01L2224/48664 ,  H01L2224/48839 ,  H01L2224/48855 ,  H01L2224/48864 ,  H01L2224/85011 ,  H01L2224/85439 ,  H01L2224/85455 ,  H01L2224/85464 ,  H01L2924/00014 ,  H01L2924/01028 ,  H01L2924/01047 ,  H01L2924/14 ,  H01L2924/15747 ,  Y10S438/909 ,  Y10S438/974 ,  H01L2924/00 ,  H01L2224/48

摘要： A method is provided for treating a leadframe comprising copper or copper alloy to enhance adhesion of molding compound to it. The leadframe is oxidized in an oxidation treatment bath to form copper oxide on the surface of the leadframe. It is then dipped in a complexing or chelating agent to enhance the purity of the copper oxide formed. Thereafter, the leadframe is cleaned with an acid to remove any contaminants remaining on the leadframe.

摘要翻译： 提供了一种处理包含铜或铜合金的引线框以增强模塑料对其的粘附性的方法。 引线框在氧化处理槽中氧化，在引线框的表面形成氧化铜。 然后将其浸入络合剂或螯合剂中以提高形成的氧化铜的纯度。 此后，用酸清洁引线框架以除去留在引线框架上的任何污染物。

公开(公告)号：US20100155260A1

公开(公告)日：2010-06-24

申请号：US12341240

申请日：2008-12-22

申请人： Yiu Fai Kwan ,  Tat Chi Chan ,  Chun Ho Yau

发明人： Yiu Fai Kwan ,  Tat Chi Chan ,  Chun Ho Yau

IPC分类号： B23H9/16

CPC分类号： H01L23/49548 ,  H01L21/4835 ,  H01L23/3142 ,  H01L23/49582 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01019 ,  H01L2224/45099 ,  H01L2924/00

摘要： Method of manufacturing a lead frame wherein a bare lead frame material is immersed in a salt solution. Gas bubbles are provided in the salt solution next to the bare lead frame material such that the bubbles contact a surface of the lead frame material and pop in proximity to the bare lead frame material causing chemical reactions on the surface of the lead frame, thereby forming a plurality of dimples of irregular sizes on the surface of the lead frame.

摘要翻译： 制造引线框架的方法，其中将裸引线框架材料浸入盐溶液中。 在裸露的引线框架材料旁边的盐溶液中提供气泡，使得气泡接触引线框架材料的表面并且在裸引线框架材料附近弹出，引起引线框架表面上的化学反应，从而形成 在引线框架的表面上具有不规则尺寸的多个凹坑。

公开(公告)号：US07691679B2

公开(公告)日：2010-04-06

申请号：US11690383

申请日：2007-03-23

申请人： Yiu Fai Kwan ,  Tat Chi Chan ,  Chun Ho Yau ,  Chi Chung Lee

发明人： Yiu Fai Kwan ,  Tat Chi Chan ,  Chun Ho Yau ,  Chi Chung Lee

IPC分类号： H01L21/16

CPC分类号： H01L23/49582 ,  H01L24/45 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/00

摘要： A process for producing a pre-plated leadframe that has enhanced adhesion by molding compound is provided, wherein a base leadframe material is first plated with multiple layers of metallic material. Thereafter, the plated base leadframe material is covered with a mask, so as to expose selected surfaces thereof at unmasked areas where enhanced adhesion of molding compound is desired. The said unmasked areas are plated with a layer of copper before removing the mask. Optionally, the layer of copper may further be oxidized to form a layer of specially controlled copper oxide.

摘要翻译： 提供了一种通过模塑料生产具有增强的粘附性的预镀引线框的方法，其中首先用多层金属材料镀覆基底引线框架材料。 此后，用掩模覆盖电镀基底引线框架材料，以便在需要增强模塑料附着力的未掩蔽区域中露出其选择的表面。 所述未掩蔽区域在去除掩模之前镀有一层铜。 任选地，铜层可进一步被氧化以形成特殊控制的氧化铜层。

公开(公告)号：US20080233683A1

公开(公告)日：2008-09-25

申请号：US11690383

申请日：2007-03-23

申请人： Yiu Fai Kwan ,  Tat Chi Chan ,  Chun Ho Yau ,  Chi Chung Lee

发明人： Yiu Fai Kwan ,  Tat Chi Chan ,  Chun Ho Yau ,  Chi Chung Lee

IPC分类号： H01L21/00 ,  H01L21/44

CPC分类号： H01L23/49582 ,  H01L24/45 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/00

摘要： A process for producing a pre-plated leadframe that has enhanced adhesion by molding compound is provided, wherein a base leadframe material is first plated with multiple layers of metallic material. Thereafter, the plated base leadframe material is covered with a mask, so as to expose selected surfaces thereof at unmasked areas where enhanced adhesion of molding compound is desired. The said unmasked areas are plated with a layer of copper before removing the mask. Optionally, the layer of copper may further be oxidized to form a layer of specially controlled copper oxide.

摘要翻译： 提供了一种通过模塑料生产具有增强的粘附性的预镀引线框的方法，其中首先用多层金属材料镀覆基底引线框架材料。 此后，用掩模覆盖电镀基底引线框架材料，以便在需要增强模塑料附着力的未掩蔽区域中露出其选择的表面。 所述未掩蔽区域在去除掩模之前镀有一层铜。 任选地，铜层可进一步被氧化以形成特殊控制的氧化铜层。