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1.发明授权公开(公告)号：US07462926B2
公开(公告)日：2008-12-09
申请号：US11293711
申请日：2005-12-01
申请人： Ran Fu , Deming Liu , Yiu Fai Kwan
发明人： Ran Fu , Deming Liu , Yiu Fai Kwan
IPC分类号： H01L23/495 , H01L21/00 , B32B15/00
CPC分类号： H01L23/49582 , H01L2924/00014 , H01L2924/0002 , Y10T428/12694 , Y10T428/12708 , Y10T428/12771 , Y10T428/12882 , Y10T428/12903 , H01L2224/45099 , H01L2924/00
摘要： A method of producing a leadframe is provided, the method including the steps of providing a substrate, plating the substrate with a layer of tin, plating a layer of nickel over the layer of tin, and thereafter plating one or more protective layers over the layer of nickel. The leadframe may thereafter be heated to produce one or more intermetallic layers comprising tin, which impedes the out-diffusion of copper from a base material of the leadframe to the surface thereof.
摘要翻译： 提供一种制造引线框架的方法，该方法包括以下步骤：提供基板，用锡层镀基材，在锡层上镀镍层，然后在该层上镀覆一层或多层保护层 的镍。 引线框架之后可以被加热以产生包含锡的一个或多个金属间层，其阻止铜从引线框架的基底材料向其表面的向外扩散。
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公开(公告)号：US07246735B2
公开(公告)日：2007-07-24
申请号：US11031412
申请日：2005-01-07
申请人： Deming Liu , Ran Fu
发明人： Deming Liu , Ran Fu
IPC分类号： B23K37/00
CPC分类号： H01L24/78 , B23K20/004 , B23K2101/32 , H01L24/45 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/78 , H01L2224/85 , H01L2924/00014 , H01L2924/01005 , H01L2924/01007 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01041 , H01L2924/01047 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/00 , H01L2224/48
摘要： A wire clamping plate is provided for a wire clamp that is adapted to contact a length of metallic wire when the wire clamp is applying a clamping force on the wire. The wire clamping plate comprises doped silicon carbide, which makes it electrically conductive and exhibit a high level of wear resistance.
摘要翻译： 为线夹提供线夹板，当线夹在线上施加夹紧力时，线夹适于接触一段金属线。 线夹板包括掺杂的碳化硅，其使其导电并表现出高水平的耐磨性。
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公开(公告)号：US20050186019A1
公开(公告)日：2005-08-25
申请号：US10785293
申请日：2004-02-23
申请人： Deming Liu , Ran Fu , Kui Lam , Man Raymond Ng , Wai Cheung
发明人： Deming Liu , Ran Fu , Kui Lam , Man Raymond Ng , Wai Cheung
CPC分类号： H01L24/83 , H01L21/67132 , H01L23/49861 , H01L24/29 , H01L24/75 , H01L2224/291 , H01L2224/29111 , H01L2224/2919 , H01L2224/83191 , H01L2224/83801 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01065 , H01L2924/01073 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/0133 , H01L2924/014 , H01L2924/0665 , H01L2924/12041 , H01L2924/14 , H01L2924/157 , H01L2924/30107 , H01L2924/00 , H01L2924/00015
摘要： The invention provides an apparatus for die attachment onto a substrate including non-metallic material, and metallic material that is adapted to receive a die having a eutectic coating. A heating conduit is provided through which the substrate is movable for heating the metallic material to a eutectic bonding temperature to facilitate bonding between the die and the metallic material at a die-attach position. An induction heating device at the die-attach position heats the metallic material of the substrate to the eutectic bonding temperature prior to attaching a die onto the metallic material.
摘要翻译： 本发明提供一种用于芯片附着到包括非金属材料的基板上的设备，以及适于接收具有共晶涂层的模具的金属材料。 提供加热导管，通过该加热导管可移动基板，以将金属材料加热至共晶接合温度，以便于在模具附着位置处与模具和金属材料之间的结合。 在将模具附接到金属材料上之前，在芯片附着位置处的感应加热装置将基板的金属材料加热至共晶粘合温度。
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4.发明申请公开(公告)号：US20070126096A1
公开(公告)日：2007-06-07
申请号：US11293711
申请日：2005-12-01
申请人： Ran Fu , Deming Liu , Yiu Kwan
发明人： Ran Fu , Deming Liu , Yiu Kwan
IPC分类号： H01L23/495
CPC分类号： H01L23/49582 , H01L2924/00014 , H01L2924/0002 , Y10T428/12694 , Y10T428/12708 , Y10T428/12771 , Y10T428/12882 , Y10T428/12903 , H01L2224/45099 , H01L2924/00
摘要： A method of producing a leadframe is provided comprising the steps of providing a substrate, plating the substrate with a layer of tin, plating a layer of nickel over the layer of tin, and thereafter plating one or more protective layers over the layer of nickel. The leadframe may thereafter be heated to produce one or more intermetallic layers comprising tin, which impedes the out-diffusion of copper from a base material of the leadframe to the surface thereof.
摘要翻译： 提供一种制造引线框架的方法，包括以下步骤：提供基板，用锡层镀基板，在锡层上镀镍层，然后在镍层上镀覆一层或多层保护层。 引线框架之后可以被加热以产生包含锡的一个或多个金属间层，其阻止铜从引线框架的基底材料向其表面的向外扩散。
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公开(公告)号：US06991967B2
公开(公告)日：2006-01-31
申请号：US10785293
申请日：2004-02-23
申请人： Deming Liu , Ran Fu , Kui Kam Lam , Man Chung Raymond Ng , Wai Yuen Cheung
发明人： Deming Liu , Ran Fu , Kui Kam Lam , Man Chung Raymond Ng , Wai Yuen Cheung
IPC分类号： H01L21/44
CPC分类号： H01L24/83 , H01L21/67132 , H01L23/49861 , H01L24/29 , H01L24/75 , H01L2224/291 , H01L2224/29111 , H01L2224/2919 , H01L2224/83191 , H01L2224/83801 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01065 , H01L2924/01073 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/0133 , H01L2924/014 , H01L2924/0665 , H01L2924/12041 , H01L2924/14 , H01L2924/157 , H01L2924/30107 , H01L2924/00 , H01L2924/00015
摘要： The invention provides an apparatus for die attachment onto a substrate including non-metallic material, and metallic material that is adapted to receive a die having a eutectic coating. A heating conduit is provided through which the substrate is movable for heating the metallic material to a eutectic bonding temperature to facilitate bonding between the die and the metallic material at a die-attach position. An induction heating device at the die-attach position heats the metallic material of the substrate to the eutectic bonding temperature prior to attaching a die onto the metallic material.
摘要翻译： 本发明提供一种用于芯片附着到包括非金属材料的基板上的设备，以及适于接收具有共晶涂层的模具的金属材料。 提供加热导管，通过该加热导管可移动基板，以将金属材料加热至共晶接合温度，以便于在模具附着位置处与模具和金属材料之间的结合。 在将模具附接到金属材料上之前，在芯片附着位置处的感应加热装置将基板的金属材料加热至共晶粘合温度。
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公开(公告)号：US07458495B2
公开(公告)日：2008-12-02
申请号：US10964292
申请日：2004-10-13
申请人： Ran Fu , Deming Liu , Chi Chuen Chaw , Hing Leung Li , Chak Hau Pang , Hing Suen Siu
发明人： Ran Fu , Deming Liu , Chi Chuen Chaw , Hing Leung Li , Chak Hau Pang , Hing Suen Siu
CPC分类号： B23K20/106 , B23K2101/40 , H01L24/75 , H01L2224/16 , H01L2224/75 , H01L2224/75743 , H01L2224/81205 , H01L2224/81801 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01024 , H01L2924/01033 , H01L2924/01042 , H01L2924/01061 , H01L2924/01074 , H01L2924/01082 , H01L2924/14 , H01L2924/3011 , H01L2224/0401
摘要： A bonding tool and method for bonding a semiconductor chip to a surface is provided wherein the bonding tool includes a bonding tip comprising a ceramic material, preferably titanium carbide. The bonding tip is operative to hold the chip and a bonding energy generator such as an ultrasonic transducer is coupled to the bonding tip for applying bonding energy to the bonding tip and the chip to bond the chip to the surface. The bonding tip may further include martensite such that the titanium carbide is present in a hard phase and the martensite is present in a soft phase as a binder for the same.
摘要翻译： 提供了一种用于将半导体芯片接合到表面的接合工具和方法，其中所述接合工具包括具有陶瓷材料的接合末端，优选为碳化钛。 接合端可操作以保持芯片，并且诸如超声波换能器的键合能量发生器耦合到接合尖端，以将粘合能量施加到接合尖端和芯片以将芯片粘合到表面。 接合端可以进一步包括马氏体，使得碳化钛存在于硬质相中，并且马氏体作为粘合剂存在于软相中。
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公开(公告)号：US20060151571A1
公开(公告)日：2006-07-13
申请号：US11031412
申请日：2005-01-07
申请人： Deming Liu , Ran Fu
发明人： Deming Liu , Ran Fu
IPC分类号： B23K37/00
CPC分类号： H01L24/78 , B23K20/004 , B23K2101/32 , H01L24/45 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/78 , H01L2224/85 , H01L2924/00014 , H01L2924/01005 , H01L2924/01007 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01041 , H01L2924/01047 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/00 , H01L2224/48
摘要： A wire clamping plate is provided for a wire clamp that is adapted to contact a length of metallic wire when the wire clamp is applying a clamping force on the wire. The wire clamping plate comprises doped silicon carbide, which makes it electrically conductive and exhibit a high level of wear resistance.
摘要翻译： 为线夹提供线夹板，当线夹在线上施加夹紧力时，线夹适于接触一段金属线。 线夹板包括掺杂的碳化硅，其使其导电并表现出高水平的耐磨性。
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公开(公告)号：US20060076391A1
公开(公告)日：2006-04-13
申请号：US10964292
申请日：2004-10-13
IPC分类号： B23K1/00
CPC分类号： B23K20/106 , B23K2101/40 , H01L24/75 , H01L2224/16 , H01L2224/75 , H01L2224/75743 , H01L2224/81205 , H01L2224/81801 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01024 , H01L2924/01033 , H01L2924/01042 , H01L2924/01061 , H01L2924/01074 , H01L2924/01082 , H01L2924/14 , H01L2924/3011 , H01L2224/0401
摘要： A bonding tool and method for bonding a semiconductor chip to a surface is provided wherein the bonding tool includes a bonding tip comprising a ceramic material, preferably titanium carbide. The bonding tip is operative to hold the chip and a bonding energy generator such as an ultrasonic transducer is coupled to the bonding tip for applying bonding energy to the bonding tip and the chip to bond the chip to the surface. The bonding tip may further include martensite such that the titanium carbide is present in a hard phase and the martensite is present in a soft phase as a binder for the same.
摘要翻译： 提供了一种用于将半导体芯片接合到表面的接合工具和方法，其中所述接合工具包括具有陶瓷材料的接合末端，优选为碳化钛。 接合端可操作以保持芯片，并且诸如超声波换能器的键合能量发生器耦合到接合尖端，以将粘合能量施加到接合尖端和芯片以将芯片粘合到表面。 接合端可以进一步包括马氏体，使得碳化钛存在于硬质相中，并且马氏体作为粘合剂存在于软相中。
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