Edge seal technology for low dielectric/porous substrate processing
    2.
    发明授权
    Edge seal technology for low dielectric/porous substrate processing 失效
    用于低介电/多孔基材加工的边缘密封技术

    公开(公告)号:US5489465A

    公开(公告)日:1996-02-06

    申请号:US254327

    申请日:1994-06-03

    IPC分类号: B32B18/00 H01L23/12

    摘要: A sealed composite ceramic structure is formed by first forming a plurality of composite green sheets. Each of the green sheets is a composite structure comprising a central portion of partially densifiable material and an outer portion of fully densifiable material. Next, top and bottom green sheets of fully densifiable material are formed. The greensheets are then stacked to form a laminated structure in the following order: the bottom green sheet, the plurality of composite green sheets, and the top green sheet. The substrate laminate is sintered to form the sealed structure having a porous central portion. The composite structure has particular application to ceramic substrates for mounting semiconductor devices requiring low dielectric constant substrates, but the structure also has applications in fluid processing using porous laminated structures. In both applications, the creation of a porous ceramic body with solid, sealed edges and/or external surfaces hold significant advantages.

    摘要翻译: 通过首先形成多个复合生片形成密封复合陶瓷结构体。 每片生坯是由部分致密材料的中心部分和完全致密材料的外部组成的复合结构。 接下来,形成完全致密材料的顶部和底部生片。 然后按以下顺序堆放毛坯以形成层压结构:底部生片,多个复合生片和顶生片。 将基板层压体烧结以形成具有多孔中心部分的密封结构。 该复合结构特别适用于要求低介电常数衬底的半导体器件的陶瓷衬底,但该结构也可用于使用多孔层压结构的流体处理中。 在这两种应用中,创建具有固体,密封边缘和/或外部表面的多孔陶瓷体具有显着的优点。