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公开(公告)号：US07679941B2
公开(公告)日：2010-03-16
申请号：US11810837
申请日：2007-06-06
申请人： Ravisekhar Nadimpal Raju , Richard S. Zhang , Rajib Datta , Allen Michael Ritter , Ljubisa Dragoljub Stevanovic
发明人： Ravisekhar Nadimpal Raju , Richard S. Zhang , Rajib Datta , Allen Michael Ritter , Ljubisa Dragoljub Stevanovic
IPC分类号： H02M5/45
CPC分类号： H02M7/217 , H02M2001/0074 , H02M2001/009 , Y02B70/1483
摘要： A power conversion system has a three-phase AC input, where each AC input phase is linked to a string of cascaded single-phase AC-DC converters placed in series with a three-phase AC-DC converter. Each single-phase AC-DC converter in one embodiment includes a silicon carbide (SiC) pulse width modulated MOSFET H-bridge that placed in series with the three-phase AC-DC converter that includes a silicon (Si) SCR bridge. The single-phase AC-DC converters and the three-phase AC-DC converter together in one embodiment include a mixed silicon-carbide (SiC) and silicon (Si) device topology.
摘要翻译： 电力转换系统具有三相AC输入，其中每个AC输入相位与串联的三相AC-DC转换器串联的级联单相AC-DC转换器串联。 在一个实施例中，每个单相AC-DC转换器包括与包括硅（Si）SCR桥的三相AC-DC转换器串联放置的碳化硅（SiC）脉宽调制MOSFET H桥。 在一个实施例中，单相AC-DC转换器和三相AC-DC转换器一起包括混合碳化硅（SiC）和硅（Si）器件拓扑。
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公开(公告)号：US20080304300A1
公开(公告)日：2008-12-11
申请号：US11810837
申请日：2007-06-06
申请人： Ravisekhar Nadimpalli Raju , Richard S. Zhang , Rajib Datta , Allen Michael Ritter , Ljubisa Dragoljub Stevanovic
发明人： Ravisekhar Nadimpalli Raju , Richard S. Zhang , Rajib Datta , Allen Michael Ritter , Ljubisa Dragoljub Stevanovic
CPC分类号： H02M7/217 , H02M2001/0074 , H02M2001/009 , Y02B70/1483
摘要： A power conversion system has a three-phase AC input, where each AC input phase is linked to a string of cascaded single-phase AC-DC converters placed in series with a three-phase AC-DC converter. Each single-phase AC-DC converter in one embodiment includes a silicon carbide (SiC) pulse width modulated MOSFET H-bridge that placed in series with the three-phase AC-DC converter that includes a silicon (Si) SCR bridge. The single-phase AC-DC converters and the three-phase AC-DC converter together in one embodiment include a mixed silicon-carbide (SiC) and silicon (Si) device topology.
摘要翻译： 电力转换系统具有三相AC输入，其中每个AC输入相位与串联的三相AC-DC转换器串联的级联单相AC-DC转换器串联。 在一个实施例中，每个单相AC-DC转换器包括与包括硅（Si）SCR桥的三相AC-DC转换器串联放置的碳化硅（SiC）脉宽调制MOSFET H桥。 在一个实施例中，单相AC-DC转换器和三相AC-DC转换器一起包括混合碳化硅（SiC）和硅（Si）器件拓扑。
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公开(公告)号：US07787270B2
公开(公告)日：2010-08-31
申请号：US11810825
申请日：2007-06-06
申请人： Ravisekhar NadimpalliRaju , Richard S. Zhang , Rajib Datta , Allen Michael Ritter , Ljubisa Dragoljub Stevanovic
发明人： Ravisekhar NadimpalliRaju , Richard S. Zhang , Rajib Datta , Allen Michael Ritter , Ljubisa Dragoljub Stevanovic
IPC分类号： H02M7/10
CPC分类号： H02J4/00 , H02M1/14 , H02M7/217 , H02M2001/007
摘要： A galvanic isolated DC-DC and DC-AC power conversion system is coupled to a plurality of DC sources which are derived from a combination of a plurality of single-phase and three-phase AC-DC converters. The DC-DC and DC-AC power conversion system in one embodiment is configured to provide mixed type outputs (mixed frequency, e.g. DC with 50 or 60 Hz, with 400 Hz; mixed voltage levels).
摘要翻译： 电流隔离DC-DC和DC-AC电力转换系统耦合到从多个单相和三相AC-DC转换器的组合导出的多个DC源。 一个实施例中的DC-DC和DC-AC电力转换系统被配置为提供混合型输出（混合频率，例如具有50Hz或60Hz的DC，具有400Hz;混合电压电平）。
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公开(公告)号：US20080304296A1
公开(公告)日：2008-12-11
申请号：US11810825
申请日：2007-06-06
申请人： Ravisekhar NadimpalliRaju , Richard S. Zhang , Rajib Datta , Allen Michael Ritter , Ljubisa Dragoljub Stevanovic
发明人： Ravisekhar NadimpalliRaju , Richard S. Zhang , Rajib Datta , Allen Michael Ritter , Ljubisa Dragoljub Stevanovic
CPC分类号： H02J4/00 , H02M1/14 , H02M7/217 , H02M2001/007
摘要： A galvanic isolated DC-DC and DC-AC power conversion system is coupled to a plurality of DC sources which are derived from a combination of a plurality of single-phase and three-phase AC-DC converters. The DC-DC and DC-AC power conversion system in one embodiment is configured to provide mixed type outputs (mixed frequency, e.g. DC with 50 or 60 Hz, with 400 Hz; mixed voltage levels).
摘要翻译： 电流隔离DC-DC和DC-AC电力转换系统耦合到从多个单相和三相AC-DC转换器的组合导出的多个DC源。 一个实施例中的DC-DC和DC-AC电力转换系统被配置为提供混合型输出（混合频率，例如具有50Hz或60Hz的DC，具有400Hz;混合电压电平）。
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公开(公告)号：US07817422B2
公开(公告)日：2010-10-19
申请号：US12193441
申请日：2008-08-18
申请人： Satish Sivarama Gunturi , Mahadevan Balasubramaniam , Ramakrishna Venkata Mallina , Richard Alfred Beaupre , Le Yan , Richard S. Zhang , Ljubisa Dragoljub Stevanovic , Adam Gregory Pautsch , Stephen Adam Solovitz
发明人： Satish Sivarama Gunturi , Mahadevan Balasubramaniam , Ramakrishna Venkata Mallina , Richard Alfred Beaupre , Le Yan , Richard S. Zhang , Ljubisa Dragoljub Stevanovic , Adam Gregory Pautsch , Stephen Adam Solovitz
IPC分类号： H05K7/20
CPC分类号： F28F3/12 , H01L23/473 , H01L25/117 , H01L2924/0002 , H01L2924/13055 , H01L2924/3011 , H01L2924/00
摘要： A heat sink for directly cooling at least one electronic device package is provided. The electronic device package has an upper contact surface and a lower contact surface. The heat sink comprises a cooling piece formed of at least one thermally conductive material. The cooling piece defines multiple inlet manifolds configured to receive a coolant and multiple outlet manifolds configured to exhaust the coolant. The inlet and outlet manifolds are interleaved. The cooling piece further defines multiple millichannels configured to receive the coolant from the inlet manifolds and to deliver the coolant to the outlet manifolds. The millichannels and inlet and outlet manifolds are further configured to directly cool one of the upper and lower contact surface of the electronic device package by direct contact with the coolant, such that the heat sink comprises an integral heat sink.
摘要翻译： 提供了用于直接冷却至少一个电子设备封装的散热器。 电子器件封装具有上接触表面和下接触表面。 散热器包括由至少一种导热材料形成的冷却片。 冷却片限定了多个入口歧管，其构造成接收冷却剂和多个出口歧管，其被配置为排出冷却剂。 入口和出口歧管交错。 冷却片进一步限定多个毫通道，其构造成从入口歧管接收冷却剂并且将冷却剂输送到出口歧管。 毫通道和入口和出口歧管还被构造成通过与冷却剂直接接触直接冷却电子器件封装的上接触表面和下接触表面之一，使得散热器包括整体式散热器。
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公开(公告)号：US20100038058A1
公开(公告)日：2010-02-18
申请号：US12193441
申请日：2008-08-18
申请人： Satish Sivarama Gunturi , Mahadevan Balasubramaniam , Ramakrishna Venkata Mallina , Richard Alfred Beaupre , Le Yan , Richard S. Zhang , Ljubisa Dragoljub Stevanovic , Adam Gregory Pautsch , Stephen Adam Solovitz
发明人： Satish Sivarama Gunturi , Mahadevan Balasubramaniam , Ramakrishna Venkata Mallina , Richard Alfred Beaupre , Le Yan , Richard S. Zhang , Ljubisa Dragoljub Stevanovic , Adam Gregory Pautsch , Stephen Adam Solovitz
IPC分类号： F28F7/00
CPC分类号： F28F3/12 , H01L23/473 , H01L25/117 , H01L2924/0002 , H01L2924/13055 , H01L2924/3011 , H01L2924/00
摘要： A heat sink for directly cooling at least one electronic device package is provided. The electronic device package has an upper contact surface and a lower contact surface. The heat sink comprises a cooling piece formed of at least one thermally conductive material. The cooling piece defines multiple inlet manifolds configured to receive a coolant and multiple outlet manifolds configured to exhaust the coolant. The inlet and outlet manifolds are interleaved. The cooling piece further defines multiple millichannels configured to receive the coolant from the inlet manifolds and to deliver the coolant to the outlet manifolds. The millichannels and inlet and outlet manifolds are further configured to directly cool one of the upper and lower contact surface of the electronic device package by direct contact with the coolant, such that the heat sink comprises an integral heat sink.
摘要翻译： 提供了用于直接冷却至少一个电子设备封装的散热器。 电子器件封装具有上接触表面和下接触表面。 散热器包括由至少一种导热材料形成的冷却片。 冷却片限定了多个入口歧管，其构造成接收冷却剂和多个出口歧管，其被配置为排出冷却剂。 入口和出口歧管交错。 冷却片进一步限定多个毫通道，其构造成从入口歧管接收冷却剂并且将冷却剂输送到出口歧管。 毫通道和入口和出口歧管还被构造成通过与冷却剂直接接触直接冷却电子器件封装的上接触表面和下接触表面之一，使得散热器包括整体式散热器。
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公开(公告)号：US20100038774A1
公开(公告)日：2010-02-18
申请号：US12193429
申请日：2008-08-18
申请人： Richard S. Zhang , Richard Alfred Beaupre , Ramakrishna Venkata Mallina , Arun Virupaksha Gowda , Le Yan , Ljubisa Dragoljub Stevanovic , Peter Morley , Stephen Adam Solovitz
发明人： Richard S. Zhang , Richard Alfred Beaupre , Ramakrishna Venkata Mallina , Arun Virupaksha Gowda , Le Yan , Ljubisa Dragoljub Stevanovic , Peter Morley , Stephen Adam Solovitz
IPC分类号： H01L23/34
CPC分类号： H01L23/473 , H01L24/72 , H01L2924/01079 , H01L2924/1301 , H01L2924/1305 , H01L2924/13055 , H01L2924/3011 , H01L2924/00
摘要： A heat sink for cooling at least one electronic device package is provided. The electronic device package has an upper contact surface and a lower contact surface. The heat sink comprises at least one thermally conductive material and defines multiple inlet manifolds configured to receive a coolant, multiple outlet manifolds configured to exhaust the coolant, and multiple millichannels configured to receive the coolant from the inlet manifolds and to deliver the coolant to the outlet manifolds. The manifolds and millichannels are disposed proximate to the respective one of the upper and lower contact surface of the electronic device package for cooling the respective surface with the coolant.
摘要翻译： 提供了用于冷却至少一个电子设备封装的散热器。 电子器件封装具有上接触表面和下接触表面。 散热器包括至少一个导热材料并且限定被配置为接收冷却剂的多个入口歧管，被配置为排出冷却剂的多个出口歧管以及被配置成从进气歧管接收冷却剂并将冷却剂输送到出口的多个通路 歧管。 歧管和毫通道靠近电子装置包装的上接触表面和下接触表面中的相应一个设置，用于用冷却剂冷却相应的表面。
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公开(公告)号：US20100133901A1
公开(公告)日：2010-06-03
申请号：US12317306
申请日：2008-12-22
IPC分类号： H02J3/36
CPC分类号： H02M5/458 , H02M7/003 , H02M7/483 , Y10T307/25 , Y10T307/258 , Y10T307/707
摘要： A sub-sea power delivery system includes a plurality of modular power converter building blocks on each of the power source side and the sub-sea load side that are stacked and interconnected to meet site expansion requirements and electrical load topologies. The power delivery system comprises a system DC transmission link/bus, wherein the system DC link is configured to carry HVDC or MVDC power from an onshore utility or topside power source to multiple sub-sea load modules. The stacked modular power converter topology on the sub-sea side of the sub-sea power delivery system is symmetrical with the stacked modular power converter topology on the on-shore/top-side of the sub-sea power delivery system.
摘要翻译： 海底电力输送系统包括在电源侧和海底负载侧的多个模块化功率转换器构建块，其被堆叠和互连以满足现场扩展要求和电负载拓扑。 电力输送系统包括系统DC传输链路/总线，其中系统DC链路被配置为将HVDC或MVDC电力从陆上公用事业或顶层电源运送到多个海底负载模块。 海底电力输送系统的海底侧堆叠的模块化电力转换器拓扑结构与海底电力输送系统的岸上/顶部的堆叠模块化电力转换器拓扑结构是对称的。
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9.发明授权Converter topology and methods for interfacing an electrical machine to electrical power grid 失效用于将电机与电力电网连接的转换器拓扑和方法公开(公告)号：US07532490B2
公开(公告)日：2009-05-12
申请号：US11464241
申请日：2006-08-14
摘要： A power converter for coupling an electrical machine to an electrical grid includes a machine side converter and a grid side converter, each, side having a plurality of corresponding stages for converting a three-phase electrical signal of the electrical machine to a three-phase electrical signal of the electrical grid. The machine side converter includes a plurality of single-phase bridges coupled in series. The grid side converter includes a plurality of three-phase bridges. Each three-phase bridge corresponds to one of the single-phase bridges of the machine side converter. Each three-phase bridge is coupled to the primary windings of a corresponding transformer. The secondary windings of each corresponding transformer is phase-shifted from its primary windings and is coupled to secondary windings of another respective transformer, thus providing for coupling of the three-phase bridges in a series.
摘要翻译： 用于将电机耦合到电网的功率转换器包括机器侧转换器和电网侧转换器，每个侧面具有多个对应级，用于将电机的三相电信号转换成三相电 电网信号。 机器侧转换器包括串联耦合的多个单相桥。 电网侧转换器包括多个三相桥。 每个三相桥对应于机器侧转换器的单相桥之一。 每个三相桥耦合到相应变压器的初级绕组。 每个相应变压器的次级绕组从其初级绕组相移并耦合到另一个相应变压器的次级绕组，从而提供串联的三相桥的耦合。
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公开(公告)号：US20080284249A1
公开(公告)日：2008-11-20
申请号：US11608582
申请日：2006-12-08
IPC分类号： H02J1/06
CPC分类号： H02J3/36 , H02J1/06 , H02M2001/0074 , H02M2001/008 , Y02E60/60 , Y10T307/445 , Y10T307/461
摘要： A direct current (DC) transmission and distribution system (10) includes a system DC link (12) configured for carrying power from a source (14) to a plurality of loads (16) and DC to alternating current (AC) power converter modules (18, 118, 218, 318, 418) coupled in series to the system DC link on a load side of the system DC link.
摘要翻译： 直流（DC）传输和分配系统（10）包括系统DC链路（12），其被配置用于承载从源（14）到多个负载（16）和DC到交流（AC）功率转换器模块 （18,118,218,318,418），其串联耦合到系统DC链路的负载侧的系统DC链路。
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