公开(公告)号：US07787270B2

公开(公告)日：2010-08-31

申请号：US11810825

申请日：2007-06-06

申请人： Ravisekhar NadimpalliRaju ,  Richard S. Zhang ,  Rajib Datta ,  Allen Michael Ritter ,  Ljubisa Dragoljub Stevanovic

发明人： Ravisekhar NadimpalliRaju ,  Richard S. Zhang ,  Rajib Datta ,  Allen Michael Ritter ,  Ljubisa Dragoljub Stevanovic

IPC分类号： H02M7/10

CPC分类号： H02J4/00 ,  H02M1/14 ,  H02M7/217 ,  H02M2001/007

摘要： A galvanic isolated DC-DC and DC-AC power conversion system is coupled to a plurality of DC sources which are derived from a combination of a plurality of single-phase and three-phase AC-DC converters. The DC-DC and DC-AC power conversion system in one embodiment is configured to provide mixed type outputs (mixed frequency, e.g. DC with 50 or 60 Hz, with 400 Hz; mixed voltage levels).

摘要翻译： 电流隔离DC-DC和DC-AC电力转换系统耦合到从多个单相和三相AC-DC转换器的组合导出的多个DC源。 一个实施例中的DC-DC和DC-AC电力转换系统被配置为提供混合型输出（混合频率，例如具有50Hz或60Hz的DC，具有400Hz;混合电压电平）。

公开(公告)号：US20080304296A1

公开(公告)日：2008-12-11

申请号：US11810825

申请日：2007-06-06

申请人： Ravisekhar NadimpalliRaju ,  Richard S. Zhang ,  Rajib Datta ,  Allen Michael Ritter ,  Ljubisa Dragoljub Stevanovic

发明人： Ravisekhar NadimpalliRaju ,  Richard S. Zhang ,  Rajib Datta ,  Allen Michael Ritter ,  Ljubisa Dragoljub Stevanovic

IPC分类号： H02M1/14 ,  H02M7/00

CPC分类号： H02J4/00 ,  H02M1/14 ,  H02M7/217 ,  H02M2001/007

摘要： A galvanic isolated DC-DC and DC-AC power conversion system is coupled to a plurality of DC sources which are derived from a combination of a plurality of single-phase and three-phase AC-DC converters. The DC-DC and DC-AC power conversion system in one embodiment is configured to provide mixed type outputs (mixed frequency, e.g. DC with 50 or 60 Hz, with 400 Hz; mixed voltage levels).

摘要翻译： 电流隔离DC-DC和DC-AC电力转换系统耦合到从多个单相和三相AC-DC转换器的组合导出的多个DC源。 一个实施例中的DC-DC和DC-AC电力转换系统被配置为提供混合型输出（混合频率，例如具有50Hz或60Hz的DC，具有400Hz;混合电压电平）。

公开(公告)号：US20080304300A1

公开(公告)日：2008-12-11

申请号：US11810837

申请日：2007-06-06

申请人： Ravisekhar Nadimpalli Raju ,  Richard S. Zhang ,  Rajib Datta ,  Allen Michael Ritter ,  Ljubisa Dragoljub Stevanovic

发明人： Ravisekhar Nadimpalli Raju ,  Richard S. Zhang ,  Rajib Datta ,  Allen Michael Ritter ,  Ljubisa Dragoljub Stevanovic

IPC分类号： H02M7/06 ,  H02M7/00 ,  H02M7/155 ,  H02M7/217

CPC分类号： H02M7/217 ,  H02M2001/0074 ,  H02M2001/009 ,  Y02B70/1483

摘要： A power conversion system has a three-phase AC input, where each AC input phase is linked to a string of cascaded single-phase AC-DC converters placed in series with a three-phase AC-DC converter. Each single-phase AC-DC converter in one embodiment includes a silicon carbide (SiC) pulse width modulated MOSFET H-bridge that placed in series with the three-phase AC-DC converter that includes a silicon (Si) SCR bridge. The single-phase AC-DC converters and the three-phase AC-DC converter together in one embodiment include a mixed silicon-carbide (SiC) and silicon (Si) device topology.

摘要翻译： 电力转换系统具有三相AC输入，其中每个AC输入相位与串联的三相AC-DC转换器串联的级联单相AC-DC转换器串联。 在一个实施例中，每个单相AC-DC转换器包括与包括硅（Si）SCR桥的三相AC-DC转换器串联放置的碳化硅（SiC）脉宽调制MOSFET H桥。 在一个实施例中，单相AC-DC转换器和三相AC-DC转换器一起包括混合碳化硅（SiC）和硅（Si）器件拓扑。

公开(公告)号：US07679941B2

公开(公告)日：2010-03-16

申请号：US11810837

申请日：2007-06-06

申请人： Ravisekhar Nadimpal Raju ,  Richard S. Zhang ,  Rajib Datta ,  Allen Michael Ritter ,  Ljubisa Dragoljub Stevanovic

发明人： Ravisekhar Nadimpal Raju ,  Richard S. Zhang ,  Rajib Datta ,  Allen Michael Ritter ,  Ljubisa Dragoljub Stevanovic

IPC分类号： H02M5/45

CPC分类号： H02M7/217 ,  H02M2001/0074 ,  H02M2001/009 ,  Y02B70/1483

摘要： A power conversion system has a three-phase AC input, where each AC input phase is linked to a string of cascaded single-phase AC-DC converters placed in series with a three-phase AC-DC converter. Each single-phase AC-DC converter in one embodiment includes a silicon carbide (SiC) pulse width modulated MOSFET H-bridge that placed in series with the three-phase AC-DC converter that includes a silicon (Si) SCR bridge. The single-phase AC-DC converters and the three-phase AC-DC converter together in one embodiment include a mixed silicon-carbide (SiC) and silicon (Si) device topology.

摘要翻译： 电力转换系统具有三相AC输入，其中每个AC输入相位与串联的三相AC-DC转换器串联的级联单相AC-DC转换器串联。 在一个实施例中，每个单相AC-DC转换器包括与包括硅（Si）SCR桥的三相AC-DC转换器串联放置的碳化硅（SiC）脉宽调制MOSFET H桥。 在一个实施例中，单相AC-DC转换器和三相AC-DC转换器一起包括混合碳化硅（SiC）和硅（Si）器件拓扑。

公开(公告)号：US07817422B2

公开(公告)日：2010-10-19

申请号：US12193441

申请日：2008-08-18

申请人： Satish Sivarama Gunturi ,  Mahadevan Balasubramaniam ,  Ramakrishna Venkata Mallina ,  Richard Alfred Beaupre ,  Le Yan ,  Richard S. Zhang ,  Ljubisa Dragoljub Stevanovic ,  Adam Gregory Pautsch ,  Stephen Adam Solovitz

发明人： Satish Sivarama Gunturi ,  Mahadevan Balasubramaniam ,  Ramakrishna Venkata Mallina ,  Richard Alfred Beaupre ,  Le Yan ,  Richard S. Zhang ,  Ljubisa Dragoljub Stevanovic ,  Adam Gregory Pautsch ,  Stephen Adam Solovitz

IPC分类号： H05K7/20

CPC分类号： F28F3/12 ,  H01L23/473 ,  H01L25/117 ,  H01L2924/0002 ,  H01L2924/13055 ,  H01L2924/3011 ,  H01L2924/00

摘要： A heat sink for directly cooling at least one electronic device package is provided. The electronic device package has an upper contact surface and a lower contact surface. The heat sink comprises a cooling piece formed of at least one thermally conductive material. The cooling piece defines multiple inlet manifolds configured to receive a coolant and multiple outlet manifolds configured to exhaust the coolant. The inlet and outlet manifolds are interleaved. The cooling piece further defines multiple millichannels configured to receive the coolant from the inlet manifolds and to deliver the coolant to the outlet manifolds. The millichannels and inlet and outlet manifolds are further configured to directly cool one of the upper and lower contact surface of the electronic device package by direct contact with the coolant, such that the heat sink comprises an integral heat sink.

摘要翻译： 提供了用于直接冷却至少一个电子设备封装的散热器。 电子器件封装具有上接触表面和下接触表面。 散热器包括由至少一种导热材料形成的冷却片。 冷却片限定了多个入口歧管，其构造成接收冷却剂和多个出口歧管，其被配置为排出冷却剂。 入口和出口歧管交错。 冷却片进一步限定多个毫通道，其构造成从入口歧管接收冷却剂并且将冷却剂输送到出口歧管。 毫通道和入口和出口歧管还被构造成通过与冷却剂直接接触直接冷却电子器件封装的上接触表面和下接触表面之一，使得散热器包括整体式散热器。

公开(公告)号：US20100038058A1

公开(公告)日：2010-02-18

申请号：US12193441

申请日：2008-08-18

申请人： Satish Sivarama Gunturi ,  Mahadevan Balasubramaniam ,  Ramakrishna Venkata Mallina ,  Richard Alfred Beaupre ,  Le Yan ,  Richard S. Zhang ,  Ljubisa Dragoljub Stevanovic ,  Adam Gregory Pautsch ,  Stephen Adam Solovitz

发明人： Satish Sivarama Gunturi ,  Mahadevan Balasubramaniam ,  Ramakrishna Venkata Mallina ,  Richard Alfred Beaupre ,  Le Yan ,  Richard S. Zhang ,  Ljubisa Dragoljub Stevanovic ,  Adam Gregory Pautsch ,  Stephen Adam Solovitz

IPC分类号： F28F7/00

CPC分类号： F28F3/12 ,  H01L23/473 ,  H01L25/117 ,  H01L2924/0002 ,  H01L2924/13055 ,  H01L2924/3011 ,  H01L2924/00

摘要： A heat sink for directly cooling at least one electronic device package is provided. The electronic device package has an upper contact surface and a lower contact surface. The heat sink comprises a cooling piece formed of at least one thermally conductive material. The cooling piece defines multiple inlet manifolds configured to receive a coolant and multiple outlet manifolds configured to exhaust the coolant. The inlet and outlet manifolds are interleaved. The cooling piece further defines multiple millichannels configured to receive the coolant from the inlet manifolds and to deliver the coolant to the outlet manifolds. The millichannels and inlet and outlet manifolds are further configured to directly cool one of the upper and lower contact surface of the electronic device package by direct contact with the coolant, such that the heat sink comprises an integral heat sink.

摘要翻译： 提供了用于直接冷却至少一个电子设备封装的散热器。 电子器件封装具有上接触表面和下接触表面。 散热器包括由至少一种导热材料形成的冷却片。 冷却片限定了多个入口歧管，其构造成接收冷却剂和多个出口歧管，其被配置为排出冷却剂。 入口和出口歧管交错。 冷却片进一步限定多个毫通道，其构造成从入口歧管接收冷却剂并且将冷却剂输送到出口歧管。 毫通道和入口和出口歧管还被构造成通过与冷却剂直接接触直接冷却电子器件封装的上接触表面和下接触表面之一，使得散热器包括整体式散热器。

公开(公告)号：US20100038774A1

公开(公告)日：2010-02-18

申请号：US12193429

申请日：2008-08-18

申请人： Richard S. Zhang ,  Richard Alfred Beaupre ,  Ramakrishna Venkata Mallina ,  Arun Virupaksha Gowda ,  Le Yan ,  Ljubisa Dragoljub Stevanovic ,  Peter Morley ,  Stephen Adam Solovitz

发明人： Richard S. Zhang ,  Richard Alfred Beaupre ,  Ramakrishna Venkata Mallina ,  Arun Virupaksha Gowda ,  Le Yan ,  Ljubisa Dragoljub Stevanovic ,  Peter Morley ,  Stephen Adam Solovitz

IPC分类号： H01L23/34

CPC分类号： H01L23/473 ,  H01L24/72 ,  H01L2924/01079 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/3011 ,  H01L2924/00

摘要： A heat sink for cooling at least one electronic device package is provided. The electronic device package has an upper contact surface and a lower contact surface. The heat sink comprises at least one thermally conductive material and defines multiple inlet manifolds configured to receive a coolant, multiple outlet manifolds configured to exhaust the coolant, and multiple millichannels configured to receive the coolant from the inlet manifolds and to deliver the coolant to the outlet manifolds. The manifolds and millichannels are disposed proximate to the respective one of the upper and lower contact surface of the electronic device package for cooling the respective surface with the coolant.

摘要翻译： 提供了用于冷却至少一个电子设备封装的散热器。 电子器件封装具有上接触表面和下接触表面。 散热器包括至少一个导热材料并且限定被配置为接收冷却剂的多个入口歧管，被配置为排出冷却剂的多个出口歧管以及被配置成从进气歧管接收冷却剂并将冷却剂输送到出口的多个通路 歧管。 歧管和毫通道靠近电子装置包装的上接触表面和下接触表面中的相应一个设置，用于用冷却剂冷却相应的表面。

公开(公告)号：US08567046B2

公开(公告)日：2013-10-29

申请号：US12632084

申请日：2009-12-07

申请人： Satish Prabhakaran ,  John Stanley Glaser ,  Ljubisa Dragoljub Stevanovic ,  Juan Manuel Rivas Davila

发明人： Satish Prabhakaran ,  John Stanley Glaser ,  Ljubisa Dragoljub Stevanovic ,  Juan Manuel Rivas Davila

IPC分类号： H01F7/06

CPC分类号： H01F17/02 ,  H01F17/06 ,  H01F27/10 ,  H01F27/2804 ,  H01F27/2895 ,  H01F41/041 ,  Y10T29/49002 ,  Y10T29/49071 ,  Y10T29/49073 ,  Y10T29/49075 ,  Y10T156/10

摘要： A method for making a magnetic component is provided. The method comprises providing a core with one or more ridges protruding from one or more surfaces of the core, depositing one or more electrically conductive materials on the core, and removing at least a portion of the one or more ridges to form one or more continuous conductors wound around the core. Each of the one or more continuous conductors defines at least one insulating gap. Further, a magnetic component and methods for making the magnetic component are also presented.

摘要翻译： 提供了一种制造磁性部件的方法。 该方法包括提供具有从芯的一个或多个表面突出的一个或多个脊的芯，在芯上沉积一个或多个导电材料，以及去除所述一个或多个脊的至少一部分以形成一个或多个连续 导体缠绕在芯上。 一个或多个连续导体中的每一个限定至少一个绝缘间隙。 此外，还提出了磁性部件和用于制造磁性部件的方法。

公开(公告)号：US20130075878A1

公开(公告)日：2013-03-28

申请号：US13247216

申请日：2011-09-28

申请人： Eladio Clemente Delgado ,  Arun Virupaksha Gowda ,  Antonio Caiafa ,  Brian Lynn Rowden ,  Ljubisa Dragoljub Stevanovic ,  Richard Alfred Beaupre

发明人： Eladio Clemente Delgado ,  Arun Virupaksha Gowda ,  Antonio Caiafa ,  Brian Lynn Rowden ,  Ljubisa Dragoljub Stevanovic ,  Richard Alfred Beaupre

IPC分类号： H01L23/552

CPC分类号： H01L23/552 ,  H01L25/117 ,  H01L2924/0002 ,  H01L2924/00

摘要： A power module includes at least one semiconductor die holding structure. Each die holding structure has a substantially cylindrical outer profile and a central axis. Each die holding structure is disposed within a common cylindrical EMI shield. A plurality of semiconductor devices are mounted to each die holding structure to form a substantially symmetric die mounting pattern respect to the central axis of the die holding structure.

摘要翻译： 电源模块包括至少一个半导体管芯保持结构。 每个模具保持结构具有基本上圆柱形的外部轮廓和中心轴线。 每个管芯保持结构设置在共同的圆柱形EMI屏蔽内。 多个半导体器件被安装到每个管芯保持结构，以相对于管芯保持结构的中心轴线形成大致对称的管芯安装图案。

公开(公告)号：US07258464B2

公开(公告)日：2007-08-21

申请号：US10323251

申请日：2002-12-18

申请人： Garron K. Morris ,  Kamlesh Mundra ,  Ljubisa Dragoljub Stevanovic ,  Ashutosh Joshi ,  Didier G. Rouaud ,  Janos G. Sarkozi

发明人： Garron K. Morris ,  Kamlesh Mundra ,  Ljubisa Dragoljub Stevanovic ,  Ashutosh Joshi ,  Didier G. Rouaud ,  Janos G. Sarkozi

IPC分类号： F21V29/00

CPC分类号： F21V29/67 ,  F21V29/004 ,  F21V29/15 ,  F21V29/51 ,  F21V29/70

摘要： A lamp having a lighting source, integral electronics, and a thermal distribution mechanism disposed in a housing. The thermal distribution mechanism may include a For example, the lamp may include a thermal shield between the lighting source and the integral electronics. The lamp also may have a forced convection mechanism, such as an air-moving device, disposed adjacent the integral electronics. A heat pipe, a heat sink, or another conductive heat transfer member also may be disposed in thermal communication with one or more of the integral electronics. For example, the integral electronics may be mounted to a thermally conductive board. The housing itself also may be thermally conductive to conductively spread the heat and convect/radiate the heat away from the lamp.

摘要翻译： 一种具有照明源，集成电子部件和布置在壳体中的热分配机构的灯。 热分配机构可以包括例如，灯可以包括在照明源和集成电子器件之间的热屏蔽。 该灯还可以具有邻近整体电子设备设置的强制对流机构，例如空气移动装置。 还可以将热管，散热器或另一导电传热构件设置成与一个或多个整体电子器件热连通。 例如，整体电子器件可以安装到导热板上。 壳体本身也可以是导热的，以导电地传播热量并使热量远离灯的对流/辐射。