公开(公告)号：US20230139276A1

公开(公告)日：2023-05-04

申请号：US17515870

申请日：2021-11-01

Applicant: Raytheon Company ,  The University of Massachusetts

Inventor： Craig A. Armiento ,  Yuri Piro ,  Andrew M. Luce ,  Emily Lamport ,  Oshadha Ranasingha ,  Christopher R. Areias ,  Christopher N. Kuncho ,  Alkim Akyurtlu ,  Edward D. Kingsley

IPC: H05K1/18 ,  H05K3/30 ,  C09D11/102 ,  C09D11/101 ,  C09D11/037

Abstract: A chip-embedded printed circuit board includes a cavity in a printed circuit board, a chip in the cavity of the printed circuit board, and a thixotropic dielectric filler in a gap in the cavity to seal the chip in the printed circuit board.

公开(公告)号：US20250145845A1

公开(公告)日：2025-05-08

申请号：US18504518

申请日：2023-11-08

Applicant: Raytheon Company ,  The University of Massachusetts

Inventor： Gavin Alexander ,  Andrew M. Luce ,  Christopher Areias ,  Craig Alfred Armiento ,  Susan C. Trulli ,  Alkim Akyurtlu ,  Oshada K. Ranasingha

IPC: C09D11/38 ,  C09D11/52

Abstract: A method of forming a convertible ink. The method includes: performing a polyol process with a metal salt, a capping agent and a solvent to produce encapsulated nanospheres in a first aqueous solution; reducing the amount of capping agent in the solution. The capping agent can be reduced by: adding solvent soluble with the capping agent and agitating the mixture via centrifugation to form a supernatant and a precipitate that includes the encapsulated nanospheres; removing the supernatant; adding a second solvent to the precipitate to form a second solution; agitating the second solution to form a second supernatant and a precipitate that includes the encapsulated nanospheres; and removing the second supernatant.

公开(公告)号：US12096561B2

公开(公告)日：2024-09-17

申请号：US17515870

申请日：2021-11-01

Applicant: Raytheon Company ,  The University of Massachusetts

Inventor： Craig A. Armiento ,  Yuri Piro ,  Andrew M. Luce ,  Emily Lamport ,  Oshadha Ranasingha ,  Christopher R. Areias ,  Christopher N. Kuncho ,  Alkim Akyurtlu ,  Edward D. Kingsley

IPC: H05K1/18 ,  C09D11/037 ,  C09D11/101 ,  C09D11/102 ,  H05K3/30

CPC classification number: H05K1/183 ,  C09D11/037 ,  C09D11/101 ,  C09D11/102 ,  H05K3/30 ,  H05K2201/0112 ,  H05K2201/0137 ,  H05K2201/0209

Abstract: A chip-embedded printed circuit board includes a cavity in a printed circuit board, a chip in the cavity of the printed circuit board, and a thixotropic dielectric filler in a gap in the cavity to seal the chip in the printed circuit board.

公开(公告)号：US20230113929A1

公开(公告)日：2023-04-13

申请号：US17938688

申请日：2022-10-07

Applicant: Raytheon Company ,  The University of Massachusetts

Inventor： Craig A. Armiento ,  Yuri Piro ,  Oshadha Ranasingha ,  Andrew M. Luce ,  Edward D. Kingsley ,  Alkim Akyurtlu

IPC: C09D11/54 ,  C09D11/52 ,  C09D11/107

Abstract: An ink stabilizing composition includes a polymeric network including an acrylate polymer and a plurality of high aspect ratio particles each having an aspect ratio of about 2:1 to about 30:1 and an average particle diameter of about 0.5 to about 1.2 micrometers.

公开(公告)号：US20220220331A1

公开(公告)日：2022-07-14

申请号：US17629798

申请日：2020-07-30

Applicant: University of Massachusetts ,  Raytheon Company

Inventor： Oshadha K. Ranasingha ,  Andrew M. Luce ,  Guinevere M. Strack ,  Mahdi Haghzadeh ,  Cameron Hardie ,  Edward Kingsley ,  Craig A. Armiento ,  Alkim Akyurtlu

IPC: C09D11/52 ,  C09D11/037 ,  C09D11/033 ,  B41J11/00

Abstract: This disclosure describes manufacture of a mixture and use of same to fabricate different types of electronic components. In one configuration, the mixture includes: first particles, the first particles being an insulator material; second particles, the second particles being electrically conductive metal material; and a combination of the first particles and the second particles suspended in a printable liquid medium, the printable liquid/solid medium (slurry) being curable into a dielectric layer of material. According to one configuration, the printable material is disposed and cured on a substrate. The first particles and second particles are randomly distributed in the cured printed material (dielectric material). The second particles in the cured dielectric material are transformable into one or more electrically conductive paths, electronic components, etc., via application of heat above a threshold value. Thus, a dielectric (insulator) material can be transformed into an electrically conductive path via application of heat.

公开(公告)号：US20250063672A1

公开(公告)日：2025-02-20

申请号：US18233596

申请日：2023-08-14

Applicant: Raytheon Company

Inventor： Christopher Areias ,  Andrew M. Luce ,  Gavin Alexander ,  Oshada K. Ranasingha ,  Alkim Akyurtlu ,  Susan C. Trulli

IPC: H05K3/12 ,  H05K1/09

Abstract: A method of tuning a circuit includes measuring an electrical characteristic of the circuit and forming, by an automated process, a conductive trace connected to the circuit to adjust the electrical characteristic of the circuit. The steps of measuring the electrical characteristic and forming the conductive trace are conducted simultaneously. The automated process involves adjusting a physical characteristic of the conductive trace in real-time in response to results of measuring the electrical characteristic of the circuit until the electrical characteristic of the circuit complies with a selected criterion.

公开(公告)号：US20230017655A1

公开(公告)日：2023-01-19

申请号：US17372907

申请日：2021-07-12

Applicant: Raytheon Company ,  The University of Massachusetts

Inventor： Yuri Piro ,  Christopher R. Areias ,  Andrew M. Luce ,  Oshadha Ranasingha ,  Emily Lamport ,  Alkim Akyurtlu ,  Edward D. Kingsley ,  Craig A. Armiento

IPC: C09D11/38 ,  C09D11/328 ,  C09D11/101 ,  C09D11/102 ,  C09D11/037 ,  B41M5/00 ,  B41J11/00

Abstract: A dielectric ink composition includes an epoxy precursor and a photoacid generator. The dielectric ink composition is aerosolable and ultraviolet (UV) curable.

公开(公告)号：US20230014456A1

公开(公告)日：2023-01-19

申请号：US17373083

申请日：2021-07-12

Applicant: Raytheon Company ,  The University of Massachusetts

Inventor： Christopher R. Areias ,  Yuri Piro ,  Andrew M. Luce ,  Guinevere M. Strack ,  Oshadha Ranasingha ,  Alkim Akyurtlu ,  Edward D. Kingsley ,  Craig A. Armiento

IPC: B29C64/112 ,  B29C64/129 ,  C09D11/52 ,  C09D11/101 ,  B33Y10/00 ,  B33Y40/10 ,  B29C64/205 ,  C09D11/102 ,  C09D11/03 ,  B33Y70/00 ,  C09D11/50

Abstract: A method of fabricating a three-dimensional (3D) object includes atomizing a pre-polymer composition into an aerosol jet stream. The pre-polymer composition includes an epoxy precursor and a photoacid generator. The method further includes depositing the aerosol jet stream onto a substrate to form a first layer of dielectric ink and curing the first layer of dielectric ink using ultraviolet (UV) light. The method further includes depositing the aerosol jet stream onto the first layer of dielectric ink to form a second layer of dielectric ink. The first layer of dielectric ink and the second layer of dielectric ink overlap by at least 50%.